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Clear out junk files and repair common Windows errorsFree Scan →Fix the driver behind crashes, sound loss and screen glitchesFind Drivers →The ST67W611M1 is the first named product from STMicroelectronics’ collaboration with Qualcomm Technologies. It is an embedded wireless coprocessor for designs that use an external STM32 microcontroller to run the application. ST currently lists Wi-Fi 6 and Bluetooth LE 5.4, with Matter over Wi-Fi supported; Matter over Thread remains a planned software update, currently scheduled by ST for Q1 2027.
What the ST67W611M1 does
The ST67W611M1 adds wireless connectivity to an embedded product; it is not a standalone smart-home device or a general-purpose application processor. The product’s application runs on an external STM32 host MCU, while the module handles connectivity. ST describes it as the first product of its collaboration with Qualcomm Technologies, using Qualcomm’s QCC743 connectivity SoC.
The module is a 32-pin LGA component with integrated RF-related parts, a 40 MHz crystal, power-management integration and 4 MB of NOR flash. Host communication is available over SPI or UART. Those interfaces do not make it a universal drop-in radio for any microcontroller: the intended host ecosystem is STM32, and the firmware and host integration need to fit the design.
Which wireless features are available now?
ST’s current product page specifies 2.4 GHz Wi-Fi 6 and Bluetooth LE 5.4, including concurrent Wi-Fi and Bluetooth LE operation. ST’s campaign says Matter over Wi-Fi is supported. By contrast, Matter over Thread is not described as available now: ST currently plans to deliver it through a software update in Q1 2027. That is a roadmap date, not a delivered feature.
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The dates matter because the description has evolved. ST’s December 11, 2024 launch announcement referred to Bluetooth 5.3-qualified operation and Thread support, with Matter over Wi-Fi planned. Its June 4, 2025 mass-production announcement described Wi-Fi 6 and Bluetooth LE 5.4 as preloaded, with Thread and Matter to follow in software. For the present feature status, the current product page and campaign are the more useful references.
ST67W611M1 specifications at a glance
| Item | ST-listed detail |
|---|---|
| Wireless | 2.4 GHz Wi-Fi 6 and Bluetooth LE 5.4 |
| Matter | Matter over Wi-Fi supported; Matter over Thread planned for Q1 2027 through a software update, according to ST’s current campaign |
| Host role | External STM32 MCU runs the application |
| Host interfaces | SPI and UART |
| Package | 32-pin LGA module |
| Memory and clock | 4 MB NOR flash; 40 MHz crystal |
| Input voltage | 3.3 V |
| Operating temperature | -40°C to +85°C |
| RF options | Embedded PCB antenna (-B), RF connector for an external antenna (-U), or RF-pin version (-P) |
Choose an RF configuration for the finished design
ST lists three module configurations, which accommodate different antenna and layout approaches:
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- -B: an embedded PCB antenna option.
- -U: an RF connector for an external antenna.
- -P: RF pins, intended for designs such as external antenna switching or multi-antenna implementations.
These options are not interchangeable in their antenna behavior. Select one according to enclosure materials and geometry, board layout, antenna placement, range needs and any switching requirements. The module’s integration can reduce the amount of discrete RF circuitry a design team must assemble, but it does not remove the need to engineer the antenna and validate radio performance in the end product.
What the ST–Qualcomm collaboration means for developers
The collaboration brings a Qualcomm connectivity SoC into an ST module and STM32-oriented development path. For a product team already building around STM32, the coprocessor arrangement can separate application processing from radio connectivity. The trade-off is that the design still depends on the host MCU, its interface, and compatible software integration; this is not a self-contained module that replaces the product’s main controller.
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ST lists software and reference-design material and offers the X-NUCLEO-67W61M1 expansion board for prototyping with an STM32 Nucleo development setup. That board is a development aid, distinct from the ST67W611M1 module intended for integration into a product. ST lists the module as active and in volume production.
Security features and certification: what they do—and do not—establish
ST lists PSA Certified Level 1, a hardware security engine, cryptographic acceleration, secure boot and firmware-over-the-air (FOTA) support. These are module-level capabilities. They can contribute to a product’s security architecture, but they do not by themselves establish that the complete device, its application firmware, cloud services or update process is secure or compliant with a particular law or security scheme.
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ST also lists regional regulatory certifications for the module. Approval requirements for a finished device depend on the exact module variant, integration and destination market; product teams should verify what applies to their final design rather than treating module-level status as blanket approval.
Independent reader supportYour contribution helps us test, update, and keep practical guides available for everyone.How to assess whether it fits your project
- Protocol timing: Confirm that Wi-Fi 6, Bluetooth LE 5.4 and Matter over Wi-Fi meet the product’s needs. If Matter over Thread is essential at launch, account for the fact that ST currently describes it as a future Q1 2027 software update.
- Host compatibility: Check that the STM32 host architecture, SPI or UART connection, and supporting software suit the design. The stated use case is an external STM32 host, not arbitrary-MCU compatibility.
- RF and enclosure: Select the antenna configuration with the board layout, enclosure, antenna placement and required radio behavior in mind.
- Security and approvals: Map the module’s stated security features and regional certifications to the requirements for the entire product and each market where it will be sold.
- Development path: Decide whether the module fits the production design and whether the X-NUCLEO-67W61M1 board and ST’s software or reference design can support evaluation and integration.
ST does not publish comparative throughput, range, power-consumption or reliability results in the cited product material. Those performance questions therefore require application-specific evaluation rather than an assumption that the module will outperform a discrete radio or a competing connectivity module.
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Quick Recap
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Product prices and availability are accurate as of the date/time indicated and are subject to change. Any price and availability information displayed on Amazon at the time of purchase will apply.
