TAIYO YUDEN’s EYSHSNZWZ was a Bluetooth 5.0 low-energy module measuring 3.25 × 8.55 mm, with a published height of either 0.85 or 0.90 mm depending on the document. The company called it the world’s smallest Bluetooth module with an integrated antenna based on its own research as of August 2017—not the smallest Bluetooth chip or a current, independently verified record. Today, KAGA FEI lists it as end of life and out of stock, and names the same-form-factor ES2832AA2 as its replacement candidate.
What the EYSHSNZWZ was
Announced on August 21, 2017, the EYSHSNZWZ was one of three Bluetooth 5 wireless communication modules introduced by TAIYO YUDEN. It was a complete, miniature radio module—not just a Bluetooth chip. The module combined a Nordic Semiconductor nRF52832 system-on-chip (SoC), RF circuitry, supporting components, and a pattern antenna in a shield-mold package. That integration reduced the number of radio-design tasks a product team would otherwise handle around a bare SoC.
The distinction matters when interpreting its size. A bare Bluetooth chip can be smaller than a packaged module, but it does not include the module’s antenna and supporting circuitry. A chip-based design typically requires its own RF layout, antenna, clock and power components, firmware integration, and regulatory work.
TAIYO YUDEN announced mass production for August 2017. The other modules in the announced family were EYSHCNZWZ and EYSHJNZWZ. The company identified wearables, healthcare equipment, smartphone peripherals, and IoT devices as intended application areas. Its launch announcement listed a historical direct-sales sample price of ¥3,000 per model; that 2017 sample figure is not a current price or production quote. TAIYO YUDEN’s 2017 launch announcement
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TAIYO YUDEN’s claim was specifically that the EYSHSNZWZ was the world’s smallest Bluetooth module with an integrated antenna, according to the company’s own research as of August 2017. It was a dated, company-attributed comparison of modules, not an assertion about every Bluetooth semiconductor, wireless device, or product available today. The available material does not establish it as a current global record. TAIYO YUDEN’s August 2017 announcement
How small it was—and why the height figures differ
The module’s footprint was 3.25 × 8.55 mm. The launch announcement gives its height as 0.90 mm; later KAGA FEI product information gives 0.85 mm. The published sources establish the difference but do not explain whether it reflects a revision, a different measurement convention, or rounding, so both figures are worth retaining rather than treating one as definitively correct. KAGA FEI’s EYSHSNZWZ product information
| Document | Published dimensions |
|---|---|
| TAIYO YUDEN launch announcement, 2017 | 3.25 × 8.55 × 0.90 mm |
| Later KAGA FEI product information | 3.25 × 8.55 × 0.85 mm |
Using the later 0.85 mm height, the package’s simple rectangular bounding-box volume is about 23.6 mm³. TAIYO YUDEN compared the module with the preceding EYSHJN-series module, listed at 5.1 × 11.3 × 1.3 mm. Those dimensions imply that the EYSHSNZWZ’s bounding-box volume was about 31.5% of the older module’s. This is a geometric envelope calculation, not a measurement of internal volume, and it excludes the host PCB, solder joints, antenna clearance, and surrounding parts.
Rank #2
- Power supply: You can directly use the MICRO USB Android cable 5V for direct power supply, or you can also connect 5V power supply or 3.7V lithium battery (as shown below). Note that the 5V and 3.7V power supply interfaces are different. The 5V voltage is connected to 5V and GND, and the 3.7V lithium battery is connected to VBAT and GND. The maximum operating current is 5V2A. It is recommended to use a regulated 5V2A power supply for better sound quality.
- Support USB sound card, free drive (plug and play). Connect the module to the computer with a USB cable, and the computer can play music through the module amplifier output. Audio output: output left and right stereo audio signals, which can be connected to two 2-8 ohm, 3-5W speakers, and 4 Euro 5W speakers.
- This product has its own dual 5W power amplifier circuit, and must not be connected to another amplifier! The outputs of the two amplifiers may not be connected in parallel or the negative poles may be connected together, otherwise the power amplifier chip may be damaged.
How the design reduced package size
TAIYO YUDEN attributed the miniaturization to its proprietary shield-mold technology. The company described shield molding as a resin-packaging approach that brings shielding properties into a compact package. Compared with adding a separate metal shield, combining encapsulation and shielding can help reduce package height and footprint. The integrated pattern antenna also avoids a separate antenna component.
Neither feature alone explains every dimension: the SoC, component integration, RF and antenna design, board layout, and manufacturing process all contribute. And a compact module does not eliminate the need to design around its antenna. Ground-plane dimensions, the battery, enclosure materials, displays, cables, nearby radios, and proximity to a person can all affect antenna behavior.
EYSHSNZWZ specifications
The detailed figures below come from later product information and distributor material, rather than all being specified in the original launch announcement. They describe the module; a product team still needs to verify the applicable revision and design documents before committing to a design.
Rank #3
- 【Ultra-long transmission distance module】The DX-BT27 module is developed and manufactured by PDDAXLQUE. It uses Renesas DA14531 chip + PA amplifier, ultra-long distance data transmission Bluetooth module.The transmission distance between the master module and slave module can reach 420m, and the transmission distance between the mobile phone and slave module can reach 240m.
- 【Serial communication】The DX-BT27 SET module Through UART serial port transmission, the device can communicate with the Bluetooth of a mobile phone or computer. You can control and monitor your device through a mobile phone or computer, making your device smarter and more convenient. The module supports multiple serial port baud rates: 2400, 9600, 19200, 38400, 57200, 115200. The module serial port transmission speed can reach up to 10kbs.
- 【AT Command】The DX-BT27 SET Bluetooth module has a variety of AT commands. You can use AT commands to query and set the parameters of the module, such as: set the device name, set the baud rate, set the UUID, set the transmission power, set the broadcast time, command disconnection, restart, etc. (You can check the information to get more AT commands). You don't need to develop the Bluetooth program again, it helps you quickly develop and verify your products.
- 【Complete Information】We provide comprehensive technical support, including technical documentation, AT command sets, module footprints, reference design schematics, and development/test tools. To help you quickly verify module functionality and accelerate product development, we strongly recommend purchasing a development kit with your initial order. Additionally, click the Product Guide and Documentation links below to access user guides, complete product information, and product tutorials.
- 【Multiple Certifications】DX-BT27 SET module has passed CE, FCC,SRRC certifications, making your product safer and more reliable. The module supports onboard antenna and external antenna, equipped with RF shielding cover, strong anti-interference, anti-static, EMC electromagnetic compatibility.
| Specification | Published detail |
|---|---|
| SoC | Nordic Semiconductor nRF52832 |
| Processor and memory | 32-bit ARM Cortex-M4F; 512 KB flash; 64 KB RAM |
| Bluetooth | Bluetooth 5.0 Low Energy; 2 Mbps mode |
| Frequency range | 2402–2480 MHz |
| Antenna | Integrated pattern antenna |
| Interfaces and functions | UART, SPI, I²C, I²S, PDM, NFC-A, and 12-bit ADC listed in later documentation |
| Supply voltage | 1.7–3.6 V |
| Typical output power | +4 dBm |
| Operating temperature | −40 to +85 °C |
| Certifications or qualifications listed | Japan, FCC, ISED/Canada, and Bluetooth; confirm exact revision and market documentation |
The SoC and memory details are also described in Mouser’s 2017 product announcement. Later product specifications and the current lifecycle notice are on KAGA FEI’s product page.
What Bluetooth 5 and the 2 Mbps mode did—and did not—promise
The 2 Mbps mode was a key part of the module’s Bluetooth 5 positioning in 2017. It describes a radio PHY option, not a guarantee of 2 Mbps of application data in real use. Actual throughput depends on connection settings, payload size, protocol overhead, interference, and host software.
Bluetooth 5.0 support also should not be read as support for every feature introduced in later Bluetooth 5.x versions. In particular, support for the 2 Mbps mode does not by itself establish long-range coded-PHY operation. The module was intended for low-power wireless links and relatively small data transfers, not high-volume media streaming.
Rank #4
- DA14531 chip, Bluetooth 5.1 low energy module, compatible with iOS and Android
- Coverage up to 65m(165ft),transmit Power: 2.5dBm, 10K Byte high transmit speed
- Its ultra-small size is only 10mm * 11.9mm * 2mm, which provides users with ultra-high flexibility and multiple possibilities.
- Support communicating with the FeasyBlue app and many other Bluetooth apps
- Please note: FSC-BT691 software version sold on Amazon is the master transmitter version (it cannot function as a receiver at the same time).
Design considerations beyond the module dimensions
Host board and antenna environment
The package can save board area and thickness, but the complete product needs room for its PCB, antenna environment, and mechanical tolerances. Follow the module’s current layout and keep-out guidance, then validate radio performance in the intended enclosure and use conditions. A nearby battery, metal housing, or the human body can change antenna performance; an integrated antenna does not make the radio independent of its surroundings.
Firmware and integration
The listed UART, SPI, I²C, I²S, PDM, and other functions give designers options for connecting peripherals and a host system. They do not make the module a ready-to-use development board. Confirm the required firmware and SoftDevice compatibility, programming and debug access, pin assignments, power behavior, and host-MCU interface against documentation for the exact module revision.
Assembly and regulatory work
A sub-millimeter package calls for appropriate PCB assembly and inspection capabilities. Module-level qualifications can reduce some radio approval work, but they are not a blanket authorization for every finished device. Check the approved antenna and layout conditions, regional documentation, labeling, enclosure changes, and any end-product requirements for the market in which the product will be sold.
Best Value
- 【Ultra-long transmission distance module】The DX-BT27 module is developed and manufactured by PDDAXLQUE. It uses Renesas DA14531 chip + PA amplifier, ultra-long distance data transmission Bluetooth module.The transmission distance between the master module and slave module can reach 580m, and the transmission distance between the mobile phone and slave module can reach 240m.
- 【UART Serial communication】The DX-BT27 module Through UART serial port transmission, the device can communicate with the Bluetooth of a mobile phone or computer. You can control and monitor your device through a mobile phone or computer, making your device smarter and more convenient. The module supports multiple serial port baud rates: 2400, 9600, 19200, 38400, 57200, 115200. The module serial port transmission speed can reach up to 10kbs.
- 【AT Command】The DX-BT27 Bluetooth module has a variety of AT commands. You can use AT commands to query and set the parameters of the module, such as: set the device name, set the baud rate, set the UUID, set the transmission power, set the broadcast time, command disconnection, restart, etc. (You can check the information to get more AT commands). You don't need to develop the Bluetooth program again, it helps you quickly develop and verify your products.
- 【Complete information】We provide complete information, including: technical document, AT instruction set, module package diagram, reference design diagram, development and testing tools, etc. We also provide module development kits, it can help you to quickly verify the module functions (it is recommended to buy a development kit for the first purchase) to help you use the module and develop products faster.
- 【Multiple Certifications】DX-BT27 module has passed CE, FCC,SRRC certifications, making your product safer and more reliable. The module supports onboard antenna and external antenna, equipped with RF shielding cover, strong anti-interference, anti-static, EMC electromagnetic compatibility.
Availability and replacement options
KAGA FEI’s product page lists the EYSHSNZWZ as “End of Life” and out of stock. It identifies the ES2832AA2 as a replacement with the same form factor and advises contacting the company because software changes may be needed. Same-form-factor positioning is not proof of pin, firmware, certification, or production compatibility; confirm those details with KAGA FEI and the relevant design documentation before planning a migration.
The EYSHSNZWZ information now appears in KAGA FEI’s product channel. Mouser’s listing also carries a notice that the Bluetooth-module business was transferred to KAGA FEI. For a legacy repair or redesign, check authorized distributors for genuine remaining inventory and verify date codes, storage condition, support, and regulatory documents. The 2017 sample price is not a basis for a current cost estimate. Mouser’s EYSHSNZWZ listing; TAIYO YUDEN’s business-transfer announcement
Choosing a path for a new design
- Need to preserve the form factor: Ask KAGA FEI about the ES2832AA2, migration changes, pin compatibility, approvals, and production status.
- Can accept a different package: Compare KAGA FEI’s newer module families, including offerings based on nRF52820, nRF52833, nRF52840, and nRF5340, against the required dimensions, Bluetooth capabilities, memory, interfaces, lifecycle, and certification needs. Do not assume they retain the EYSHSNZWZ footprint. KAGA FEI’s Bluetooth module portfolio
- Evaluating a bare SoC or another vendor: Compare complete design requirements—not just chip or module package size—including antenna, RF components, layout constraints, firmware effort, regulatory scope, availability, and development support.
For a fresh product, the central decision is no longer whether the EYSHSNZWZ was exceptionally compact; it was. It is whether the replacement path, package constraints, and lifecycle support suit the design now.
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Product prices and availability are accurate as of the date/time indicated and are subject to change. Any price and availability information displayed on Amazon at the time of purchase will apply.
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