Lam Research’s 2300 Etch Series was a configurable plasma-etch platform announced on November 16, 2000, for both 200 mm (8-inch) and 300 mm (12-inch) wafers. Its four-module architecture brought dielectric, silicon and metal etch applications onto a shared platform, with products aimed at processes for technology nodes below 130 nm. It was an etch equipment family—not a tool for every step in semiconductor manufacturing.
What the 2300 platform was designed to do
Plasma etching selectively removes material from a wafer to form device and interconnect features. The 2300 family used specialized process modules for different kinds of etch rather than relying on one chamber chemistry to do every job. A fab could configure a common platform with as many as four process modules, alongside shared wafer handling and factory-automation infrastructure.
Lam described the 2300 as an open architecture intended to support process and factory automation. The product line targeted advanced etch applications for sub-130 nm technology nodes. That describes the intended application range at launch; it does not establish a particular customer’s production results or a platform-wide throughput figure.
Which 2300 systems handled which etch applications?
| System | Etch focus | Application described at launch |
|---|---|---|
| 2300 Exelan | Dielectric etch | Insulating films, including structures associated with dual-damascene processing |
| 2300 Versys Silicon | Silicon etch | Silicon etch for advanced device structures |
| 2300 Versys Metal | Metal etch | Metal and metal-hard-mask etch applications |
The names represent distinct process offerings within the 2300 family. The platform’s breadth came from configuring specialized modules around a shared architecture, not from a single chamber being equally suited to dielectric, silicon and metal etch.
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- This wafer container is designed for 8 inch diameter wafer.It can prevent precision wafer or substrate from damage and contamination during shipping and storing.Max stored 25 pcs silicon wafers .
- Each complete set includes four parts: container, cover , 5 pcs ESD PU sponge and 25 pcs separator paper.
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Why support for both wafer sizes mattered
In 2000, leading-edge manufacturing was shifting from 200 mm wafers to 300 mm wafers. Lam’s bridge-tool strategy was to let fabs develop and refine processes on 200 mm substrates, then carry that process learning toward 300 mm production. Smaller wafers and existing pilot capacity could remain useful during development while manufacturers prepared for larger-wafer manufacturing.
Lam later said 2300 chambers could be converted at customer facilities from 200 mm to 300 mm operation. That conversion path was part of the platform’s flexibility; it should not be read as evidence that every system configuration changed wafer size without modification, or that transferring a process required no additional qualification.
Rank #2
- Wafer Pattern May Vary from the Product Images. Great to be used as gift, display object, exhibition, educating demonstration, testing, decoration or your collection
- Beautiful microchip pattern structure made by the advanced copper technology
- 90~130nm minimum microchip feature Copper Characterization with TEOS or Black Diamond Low-k ILD on the single crystal silicon wafer
- The original value of un-polished wafer is above $500
- No guarantee for research and other applications
What “all process steps” means in the headline
The phrase refers to coverage across major etch categories—dielectric, silicon and metal—not to all steps in making a semiconductor. A chip fab also needs equipment for operations such as deposition, lithography, cleaning, implantation and inspection. The 2300’s modular approach addressed etch needs within a broader manufacturing flow.
Etch processes differ because the materials and feature shapes being removed differ. Separating the 2300 offerings by application let manufacturers choose process-specific systems while retaining a common platform framework. Lam’s process categories also distinguish conductor and dielectric etch from deep-silicon/through-silicon-via (TSV) and bevel applications.
Rank #3
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How Syndion relates to the 2300
Lam later extended the 2300 architectural lineage into Syndion deep-silicon etch systems for applications including TSV formation. Lam reported that Syndion systems supported both 200 mm and 300 mm wafers, including configurations with modules handling different wafer sizes. Syndion is a later development in the platform’s lineage, not one of the three 2300 products listed above as the original dielectric, silicon and metal offerings.
Independent reader supportYour contribution helps us test, update, and keep practical guides available for everyone.What the historical record does—and does not—establish
The documented launch facts establish the platform’s two wafer sizes, four-module architecture, broad etch scope and sub-130 nm target. They do not establish a platform-specific wafer-per-hour rate, cost-of-ownership figure, market share or customer count. Nor does the existence of Lam’s current, broader etch portfolio show that the original 2300 systems remain available to order. The 2300 is best understood as a historical, flexible etch platform designed to help fabs manage process integration and the transition to 300 mm manufacturing.
Quick Recap
Best Value
- 🚚 Lot of 2PCS 8" or 200mm single wafer carrier for display purpose
- 👍 Single wafer carrier for 8" or 200mm circular substrate
- 🥼 Good for Universities 8" fab R&D sample display or presentation
Rank #4
- Wafer Pattern May Vary from the Product Images. Great to be used as gift, display object, exhibition, educating demonstration, testing, decoration or your collection
- Beautiful microchip pattern structure made by the advanced copper technology
- 90~130nm minimum microchip feature Copper Characterization with TEOS or Black Diamond Low-k ILD on the single crystal silicon wafer
- The original value of un-polished wafer is above $500
- No guarantee for research and other applications
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