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IIC Shenzhen 2025 took place in Shenzhen on 25–26 November 2025 and concluded on 26 November. The event brought together companies and professionals from across the global semiconductor value chain, with its central themes spanning component distribution, supply-chain collaboration, emerging data technologies and smart manufacturing.
What happened at IIC Shenzhen 2025?
The two-day International IC & Component Exhibition and Conference (IIC Shenzhen 2025) combined an exhibition with industry forums and a Global Distribution and Supply Chain Leaders Summit. According to EE Times Europe, the summit framed component supply chains through the paired ideas of “Breaking Chains” and “Forming Networks,” under the theme “The Diverse Ecosystem Pattern of Component Supply Chains.”
Jiguo Zhou, chairman of the Electronic Components Application and Supply Chain Branch of CIITA (ECAS), delivered the opening address. The listed speakers represented distributors, component and technology companies, consulting, media and logistics organizations.
Which supply-chain issues were discussed?
Building diverse distribution networks
The summit’s theme emphasized the changing shape of component supply chains and the importance of networks across the ecosystem. Its program included perspectives from Alan Yan of Quiksol, Bertier Luyt of Adesio, Priyasha Sharma of Seedst International, Ken Liu of Heilind Asia Pacific, Grayson Li of Richardson RFPD, Echo Zhao of AspenCore, Dr. Moon-Kuen Mak of Puli Consulting, Richard Lu of DWIN Technology, Jiang Lei of ICS Superman, and Vitalii Savryha of ARDl Logistics, Ardi Express and Stealtho.
#1 Best Overall
- COMPATIBILITY: Development board supporting multiple wireless protocols including Bluetooth
- Thread, Matter, Zigbee, ANT, and NFC at 2.4GHz frequency
- PROCESSOR: Features the advanced nRF54L15 transceiver chip from Nordic Semiconductor for reliable wireless communications
- WIRELESS STANDARDS: Implements IEEE 802.15.4 protocol support for Matter, Thread, and Zigbee networking applications
- DEVELOPMENT PLATFORM: Comprehensive evaluation board designed for testing and prototyping wireless connectivity solutions
Applying AI, IoT and big data
A roundtable asked how AI, IoT and big data could further empower distribution and supply-chain industries. Participants were Alan Yan, Kevin Wang of Amble Electronics, Arthur Fei of Sigma, Dr. Moon-Kuen Mak and Totti Jiang of Ruifan Micro. The discussion placed data and connected technologies in the context of improving supply-chain operations; the event report does not specify particular deployments or measured results.
Who exhibited, and what technologies were represented?
The curated exhibition brought together companies across semiconductor technology, component distribution, sensors, industrial systems and engineering technology. Named exhibitors included:
Rank #2
- DEVELOPMENT BOARD: Nordic Semiconductor NRF52-DK development and evaluation board designed for wireless applications and prototyping
- WIRELESS CAPABILITIES: Features Bluetooth
- (BLE) and ANT protocol support with 2.4GHz operation frequency for versatile connectivity options
- PROCESSOR OPTIONS: Compatible with both nRF52810 and nRF52832 transceivers, offering flexibility for different project requirements
- NFC SUPPORT: Includes Near Field Communication (NFC) capabilities, expanding potential use cases and application scenarios
- Sigma Technology Group, Quiksol Global, Shenzhen HJC Electronics and Shenzhen Kaixinda Technology
- Keysight Technologies (China), SmartSens Technology (Shanghai), Shenzhen Ruifan Microelectronics and Shanghai YueYue Electronics
- Vadas International, Biaoxin Technology Shenzhen, SHENZHEN GOCHEN TECHNOLOGY and Galaxy Semicon Group
- SEEDST International, ICkey (Shanghai), Jiangsu Runic Technology and Shenzhen Sinox Electronics
- Shenzhen HDY Technology, Hangzhou SDIC Microelectronics, OK Electronica and Shenzhen Iczoom
- MEET International, LINKCOST and Beijing Jingyuxing Technology
The exhibition report describes the companies’ displays collectively as showcasing products and technological achievements related to semiconductor trends and innovative solutions. It does not provide a company-by-company product inventory, so the list should not be read as a complete account of each exhibitor’s offerings.
How did the Industry 4.0 forum connect to semiconductors?
A parallel International Industry 4.0 Technology and Application Forum looked at robotics, industrial power supplies and sensors. MPS, ADI, Beijing Jingyuxing, Hangzhou SDIC Microelectronics and Dobot contributed perspectives. These topics connect component supply with the systems used in smart manufacturing, where semiconductors support sensing, control and automation.
Rank #3
- EVALUATION BOARD: NRF9151-DK development board from Nordic Semiconductor designed for cellular IoT and GNSS applications
- CONNECTIVITY: Features both cellular connectivity and GNSS (Global Navigation Satellite System) capabilities for location-based applications
- DEVELOPMENT PLATFORM: Ideal for prototyping and testing IoT devices, supporting cellular network communications
- COMPATIBILITY: Designed to work with Nordic Semiconductor's development tools and software development kit
- APPLICATIONS: Perfect for creating IoT solutions, asset tracking systems, and location-aware connected devices
What did the distributor awards recognize?
The 2025 Global Electronic Component Distributor Awards recognized companies and individuals for expanding markets, strengthening distribution and supply-chain collaboration, and building ecosystems that produce measurable industry value. The event also included a Special Industry Contribution Award marking ESMC’s 40th anniversary. The published event report does not include a full award-winner roster.
Yorbe Zhang, AspenCore’s Head of APAC and Head of Content, said: “Major global research firms project double-digit growth for the semiconductor industry in 2025. Meanwhile, the IC Design Branch of the China Semiconductor Industry Association expects China’s design sector to return to high growth this year and stand out globally. Yet growth is uneven across vertical tracks; opportunities and challenges coexist. Only firms that read multiple variables correctly can seize the lead. Today, the Distributor Leaders Summit has opened with momentum, and the speakers have jointly drawn a forward-looking industry blueprint. I extend my highest respect to all award-winning companies and individuals. Thank you for sharing this moment of honor.”
Rank #4
- Development Platform: nRF52833-DK evaluation board designed for prototyping and testing Bluetooth
- BLE, Thread, and Zigbee applications using the nRF52833 SoC
- Wireless Connectivity: Supports multiple protocols including Bluetooth
- (BLE), 802.15.4 (Thread, Zigbee) operating at 2.4GHz frequency for versatile wireless development
- Integrated Antenna: Features PCB trace antenna built directly on-board for immediate testing and development without requiring external antenna components
The growth outlook in Zhang’s remarks is attributed to unnamed research firms and is not accompanied by a specific forecast or underlying report in the event coverage. It is therefore best understood as his characterization of the outlook, not a separately verified numerical forecast.
Independent reader supportYour contribution helps us test, update, and keep practical guides available for everyone.What the event report does not establish
The published account does not state an attendance total, exhibitor count, award-winner roster or revenue figure. It also does not provide enough detail to compare the named exhibitors’ products or assess the business results of the event.
Quick Recap
Best Value
- DEVELOPMENT KIT: Nordic Semiconductor NRF5340-AUDIO-DK designed for audio application development with nRF5340 dual-core Bluetooth LE SOC
- VERSATILE CONNECTIVITY: Features multiple interface options including I2S, SPI, UART, and USB for comprehensive development capabilities
- POWER SPECIFICATIONS: Operates with flexible power supply range of 1.7V to 5V, suitable for various development scenarios
- TEMPERATURE RANGE: Capable of operating in environments up to +105°C, ensuring reliable performance across diverse conditions
- AI COMPATIBILITY: Supports Edge Impulse platform integration, enabling advanced machine learning and AI development capabilities
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