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Fix the driver behind crashes, sound loss and screen glitchesFind Drivers →Repair Windows errors before they cause bigger problemsFix Now →PCIM Europe 2024 opened in Nuremberg on Tuesday, June 11, with reported first-day coverage highlighting gallium nitride (GaN) and silicon carbide (SiC) power devices, industrial AI, and applications spanning HVAC, electric vehicles, and data-center power. The event ran June 11–13; the attendance and exhibition totals reported by the organizer cover all three days, not opening day alone.
What stood out on PCIM Europe’s opening day
A June 24 attendee recap described wide-bandgap semiconductors—especially GaN and SiC—as a central theme of June 11. Its examples ranged from power devices and integrated modules to EV charging and AI-server power supplies. These are observations from that attendee account, not a quantified survey of the entire exhibition or independent verification of every product claim.
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The broader emphasis fits the organizer’s description of the event program, which included e-mobility, energy storage, power-electronics applications, and live product demonstrations. PCIM Europe took place in Nuremberg, Germany, from June 11 through 13, 2024. The organizer later reported 637 exhibitors, more than 18,000 visitors, 38,000 m² of exhibition space, and 472 conference presentations with 952 conference participants from 38 countries; all those figures describe the complete event. PCIM/Mesago’s 2024 event summary.
Keynote: industrial AI in power electronics
The opening keynote was scheduled for Rolf Hellinger, Siemens AG’s Head of Company Core Technology and Center of Competence Power Electronics. Its title was “AI between Hype and Industrial-Grade,” as stated in the organizer’s preview. The attendee recap characterized Hellinger’s talk as addressing practical AI applications across the power-electronics lifecycle; that description comes from the attendee report rather than an official transcript.
#1 Best Overall
GaN and SiC product reports
The opening-day recap described several product and application examples. The event sources do not provide controlled, like-for-like tests or comparable specifications, so they do not support a conclusion that GaN or SiC was the better technology, or that one vendor’s product outperformed another.
- GaN devices and integration: The recap reported that Cambridge GaN Devices introduced its P2 line of 650-V ICeGaN devices for higher-power applications, and that onsemi showed an integrated GaN solution with a silicon gate driver. These were among the report’s examples, not necessarily the only notable demonstrations. WAWT Tech’s June 24 attendee recap.
- HVAC motor control: The same account reported Texas Instruments’ DRV7308 GaN intelligent power module for HVAC systems, claiming inverter efficiency above 99% and 50% lower power losses. Those are figures reported in the recap, not independently validated test results or verified specifications here.
- EV charging and transport: The recap said Microchip presented a SiC onboard-charger system solution and Wolfspeed discussed SiC applications in air taxis and mining trucks. The organizer’s program preview independently establishes e-mobility and energy storage as event themes, but does not verify those individual product or discussion details.
- Data-center power: The recap mentioned Navitas SiC and GaN/SiC hybrid products in connection with AI-server power supplies. It does not establish achievable system output or rack power, so those should not be inferred from the display description.
Officially scheduled onsemi sessions
Onsemi’s event page lists two June 11 appearances, connecting the exhibition’s device discussions with power conversion and EV protection topics:
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- Roman Radvan: “Revealing the NCP5892x Family – Integrated 650 V GaN Driver and Its Applications.”
- Tom Stoltz: “Solid-State EV Battery Disconnect and Over Current Protection.”
The listings confirm the scheduled talks, not their full content or any resulting product-performance claims. onsemi’s PCIM Europe 2024 event page.
How broad was the exhibition?
GaN and SiC were part of a much wider power-electronics supply chain. The organizer’s post-event product-group figures show the share of exhibitors associated with each listed category. Categories can overlap, so these percentages are not exclusive slices of the exhibition, market shares, or sales shares.
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| Exhibitor product group | Share reported by organizer |
|---|---|
| Power semiconductors, power components and modules | 48% |
| Passive components | 35% |
| Thermal management | 25% |
| Power converters | 23% |
| Assemblies and subsystems | 22% |
| Sensors | 20% |
| Test and measurement equipment | 16% |
| Magnetic and coil materials | 16% |
| Integrated circuits | 14% |
| Energy storage | 13% |
| Power quality | 11% |
| Information and services | 11% |
| Development and test tools | 10% |
These are event-wide organizer figures, not day-one counts. The organizer also described four stage programs, including the new Smart Power System Integration Stage in Hall 5, covering production technologies from smart power embedding to integrated smart power circuits. PCIM/Mesago’s event summary and event preview.
Independent reader supportYour contribution helps us test, update, and keep practical guides available for everyone.What the day-one coverage does—and does not—show
The reported highlights suggest how power-device discussions intersected with application needs: motor control in HVAC, onboard EV charging, transport electrification, and power delivery for AI servers. But the available event accounts do not provide matched product specifications, pricing, availability, or controlled efficiency tests. To compare devices for a real design, use manufacturer documentation with the same decision criteria for each candidate: voltage and current range, switching frequency, efficiency under stated test conditions, thermal design, integration and protection features, package, cost, and target application.
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There is also no named attendance statistic for June 11 alone in the event material cited here. The reported visitor and exhibitor totals should therefore be read as three-day figures, not as a measure of opening-day turnout.
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