A foundry qualifies a new manufacturing process by collecting evidence that the technology meets agreed reliability and application requirements, documenting that evidence against release criteria, and transferring the process into controlled manufacturing. Qualification is not one universal test or yield threshold: the tests and acceptance criteria depend on the process, its intended use, and the requirements agreed between foundry and customer.
What process qualification establishes
Process qualification evaluates whether a manufacturing technology behaves reliably enough for its intended use and can be transferred into controlled production. It builds evidence about the technology; it is not simply a declaration that a process node is ready.
JEDEC JEP001-3B describes methods and data for technology qualification vehicles (TQVs), but does not prescribe universal pass/fail values. Requirements beyond the guideline are set in light of expected technology performance and the needs agreed between the foundry and its customers. TSMC describes using release criteria and deliverables within its technology-development lifecycle to produce a process release specification.
How a foundry qualifies a process
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Define the scope and release criteria
The foundry identifies the technology characteristics and intended application demands to be evaluated, then specifies the evidence and criteria required for release. Customer-specific requirements can extend beyond guideline methods. TSMC describes applying Advanced Product Quality Planning (APQP), concurrent development disciplines, and coordination across functions in its technology-development lifecycle.
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Build qualification silicon and test structures
Qualification uses purpose-built structures and, where appropriate, functional TQVs. The JEDEC JEP001 series covers testing at the backend-of-line and transistor levels as well as technology qualification vehicle testing. A TQV can use a functional design relevant to the intended applications, connecting technology evaluation to the kinds of demands the process is expected to face.
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Evaluate reliability in stages
JEDEC JEP001-3B distinguishes two broad aims. Level 1 testing looks for process reliability weaknesses, particularly wear-out mechanisms. Level 2 evaluates reliability against projected or known application demands and can include life testing with a functional TQV. The particular methods, sample sizes, and acceptance criteria depend on the qualification plan rather than a single prescribed recipe.
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Check measurement and process control
Qualification evidence is only useful if measurements are understood and process variation can be monitored. Samsung Foundry describes statistical process control (SPC) for detecting abnormal variation, failure mode and effects analysis (FMEA) for identifying potential failures and preventive actions, and measurement-system analysis for understanding measurement uncertainty.
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Review the evidence and document release
The foundry reviews test results against the defined criteria and records the outcome in qualification reports and release documentation. TSMC describes release criteria and deliverables leading to a process release specification. This documentation gives the organization and customer a basis for assessing whether the evidence addresses their agreed requirements.
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Transfer the process and manage later changes
Qualification precedes transfer to manufacturing fabs in TSMC’s described process. After transfer, production controls monitor the baseline and flag abnormal signals for response. Samsung Foundry describes a Process Change Control Board that requires implementation and verification plans for process changes.
What a technology qualification vehicle does
A technology qualification vehicle is a test vehicle used to gather reliability evidence about a manufacturing technology. It may include a functional design relevant to the process’s intended applications, allowing evaluation to extend beyond isolated test structures. Under the JEDEC JEP001-3B framework, TQV testing is particularly associated with Level 2 evaluation against projected or known application demands, while Level 1 testing seeks weaknesses in the process itself.
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A TQV is not, by itself, proof that every customer design will meet its product requirements. Its value depends on the design and tests chosen, and on how well they represent the conditions the technology is expected to support.
Process qualification and customer-chip qualification are different
A qualified process provides evidence about the manufacturing technology. A customer chip has its own design, package, operating conditions, and product requirements, so its qualification may need to address factors that a process-level evaluation does not establish.
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| Aspect | Process qualification | Customer-product qualification |
|---|---|---|
| Primary subject | The manufacturing technology and its reliability evidence. | The specific product, which may include the chip, package, their interaction, design, operating environment, and related software or firmware. |
| Typical evidence described by the sources | Process test structures, transistor- and backend-of-line testing, and technology qualification vehicles under the JEDEC JEP001 series. | Product reliability testing or qualification by similarity justification, as described by Texas Instruments (TI). |
| Standards cited | JEDEC JEP001-3B describes TQV methods and data but does not set universal pass/fail values. | TI says non-automotive products use JEDEC JESD47 methodologies and automotive devices use AEC-Q100 methodology. |
IEC 63287-1:2021 is another, separate guideline, focused on integrated-circuit product reliability qualification plans. Its published description says sample sizes may be flexible and that Weibull analysis is one of several methods for determining sample size and test conditions. The guideline excludes military- and space-related applications. This does not make the standard interchangeable with process qualification guidance.
Independent reader supportYour contribution helps us test, update, and keep practical guides available for everyone.How to compare foundry qualification approaches
When assessing two foundries or process options, compare the scope and relevance of the evidence rather than relying on a generic claim that a process is qualified. Ask:
- Application fit: Which operating conditions and reliability demands does the qualification represent?
- Evidence scope: Which test structures, functional TQVs, wear-out evaluations, application-relevant tests, and product/package interactions are included?
- Acceptance basis: What agreed requirements and release criteria are used, and what reports document the results?
- Controls after release: How are SPC, measurement assurance, corrective action, and process changes handled?
What public information does not establish
The cited public sources do not establish one qualification duration, one yield-ramp target, or one release threshold that applies to every foundry and customer. Nor do they establish a universal sample size or test set for every application. The specific plan and acceptance basis depend on the process and intended use, with requirements potentially set through foundry-customer agreement.
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