ASML and Nikon both offer deep-ultraviolet (DUV) lithography, including argon-fluoride (ArF) immersion scanners. The defining difference in their publicly listed portfolios is that ASML also sells extreme-ultraviolet (EUV) systems, while Nikon’s cited semiconductor lineup lists DUV, i-line and advanced-packaging equipment—not an EUV scanner.
How the lithography technologies differ
Lithography transfers a pattern onto a light-sensitive coating on a silicon wafer. A tool’s imaging capability depends on more than its manufacturer or one advertised resolution figure: wavelength, numerical aperture (NA), illumination and process conditions all matter.
DUV uses lenses; immersion boosts imaging capability
DUV scanners use lenses to direct exposure light. In ArF immersion lithography, the light remains at 193 nm; a thin layer of water between the final lens and wafer increases the optical system’s NA without changing that wavelength. ASML says its immersion systems reach NA 1.35. ASML’s explanation of lenses, mirrors and immersion describes the distinction.
EUV requires a different optical path
ASML’s EUV systems use 13.5 nm light. Because EUV is absorbed by air and ordinary optical materials, the light travels through a vacuum and is directed by multilayer mirrors rather than conventional refractive lenses. ASML describes its source as a CO₂ laser striking moving tin droplets to generate EUV light. This is a high-level description of the source and optical path, not a complete account of EUV manufacturing. ASML’s EUV systems page and lenses and mirrors page explain these principles.
The Tool Desk
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What each company lists
The comparison below reflects the public semiconductor product lineups cited here. It does not establish what either company may be researching privately.
| Technology or product scope | ASML public lineup | Nikon public lineup |
|---|---|---|
| EUV | NXE systems and EXE High-NA systems, both using 13.5 nm light. ASML EUV systems | No EUV scanner appears on the cited semiconductor lineup page. Nikon semiconductor lineup |
| ArF immersion | NXT family, including the NXT:2000i. ASML NXT:2000i | NSR-S636E and other listed ArF immersion scanners. Nikon semiconductor lineup |
| Other DUV and UV lithography | ArF, KrF and i-line dry product lines. ASML DUV systems | Dry ArF, KrF and i-line systems. Nikon semiconductor lineup |
| Related equipment | The cited product pages cover DUV and EUV lithography systems. | The cited lineup also includes advanced-packaging lithography and related alignment, metrology and inspection systems. These are adjacent product categories, not direct equivalents to an exposure scanner. Nikon semiconductor lineup |
Model specifications: useful examples, not a head-to-head test
These vendor-published figures illustrate the kinds of tools the companies offer. They are not a normalized ranking: resolution definitions, overlay measurement, wafer handling and throughput conditions differ.
Rank #2
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| System | Vendor-stated specifications | How to read the figures |
|---|---|---|
| Nikon NSR-S636E | 193 nm ArF exposure; NA 1.35; resolution ≤38 nm; mix-and-match overlay ≤2.1 nm; throughput ≥280 wafers/hour at 96 shots. Nikon semiconductor lineup | Nikon defines the overlay value as mix-and-match overlay between two NSR-S636E tools. Throughput is stated at the specified 96-shot condition; it should not be compared with a figure using a different shot count or test setup. |
| ASML NXT:2000i | 193 nm ArF immersion; NA 1.35; dual-stage system for 300 mm wafers. ASML NXT:2000i product page | ASML positions it for advanced-node volume production and mix-and-match use with EUV. A directly comparable resolution, overlay and throughput set is not stated on the cited page. |
| ASML NXE and EXE EUV platforms | NXE: NA 0.33 and stated resolution 13 nm; EXE High-NA: NA 0.55 and stated resolution 8 nm. Both use 13.5 nm light. ASML EUV systems | These are ASML’s specifications and positioning for the named platforms, not directly comparable Nikon specifications. |
| ASML NXE:3800E | 220 wafers per hour at its full productivity specification, reached in 2025, according to ASML’s 2025 annual report. ASML 2025 annual report | This is a reported productivity figure for a different ASML system and context than Nikon’s 96-shot NSR-S636E figure; it is not a direct throughput comparison. |
ASML’s 2025 annual report also identifies ArF, KrF and i-line wavelengths as 193 nm, 248 nm and 365 nm, respectively. ASML 2025 annual report
Why EUV does not replace DUV across a chip
EUV is used for the most intricate layers, while DUV systems print other layers. ASML says it expects EUV and DUV to be used in parallel for many years. That means the practical comparison is not simply “EUV versus DUV”: a fab may need several lithography technologies for different layers, and an ArF immersion scanner can remain useful alongside EUV. ASML EUV systems
Rank #3
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How to compare tools for a real fab decision
A single headline resolution or throughput number cannot establish which tool is better for a particular production line. A useful comparison should match the same application and measurement conditions across vendors.
- Imaging approach: compare wavelength, source, NA and whether exposure is dry or immersion.
- Resolution conditions: check how resolution is defined and the illumination and process assumptions behind it.
- Overlay: distinguish single-machine overlay from mix-and-match overlay, and confirm which tools and measurement method the figure covers.
- Productivity: compare wafer diameter and throughput at equivalent shot counts and operating conditions.
- Fab fit: consider the target layers, compatibility with other tools in the line, and the system’s integration with existing process control.
- Economics: evaluate total cost of ownership for the intended production use rather than inferring it from resolution or throughput alone.
The cited vendor pages do not provide a common independent benchmark covering all these factors for ASML and Nikon systems. Any ranking that skips the conditions behind the specifications risks comparing unlike measurements.
Quick Recap
Best Value
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Rank #4
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