Do these 3 things before closing this tab:
1Fix the driver behind crashes, sound loss and screen glitches2Clear out junk files and repair common Windows errors3Scan for outdated or missing drivers - takes under a minuteWire bonding makes an electrical connection by joining a fine metal wire between two locations: a first bond on a die pad and a second bond on a carrier or package pad. The wire bridge completes an interconnection after device fabrication. Which process, wire, and test are appropriate depends on the pad metallurgy, package design, wire size, bonding equipment, and reliability requirements.
What wire bonding connects
A wire bonder presses and joins a fine metal wire at both ends to create an electrical path. The first bond is made at a die pad; the second is made at a carrier or package pad. The arrangement can connect a chip to a substrate, two chips, or two substrates. Fraunhofer ENAS also describes wire bonding for interconnection of micromechanical and electronic components and substrates including electronics and ceramics.
It is a packaging operation, not a way to fabricate the device itself. Fraunhofer ENAS notes that wire bonding can be used to manufacture prototypes and small series.
How the bonding processes differ
Process names describe how energy is applied to form a bond. They are distinct from geometry terms such as ball/stitch and wedge/wedge, which describe the tool workflow and shape of the connections.
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Thermocompression
Thermocompression forms the connection with heat and pressure. In SK hynix’s description, the chip pad and capillary are heated while pressure is applied.
Ultrasonic wedge bonding
In the described ultrasonic method, a wedge presses the wire against the pad while ultrasonic energy is applied; a ball is not formed first. This is a different process from ball bonding.
Thermosonic bonding
Thermosonic bonding combines heat, pressure, and ultrasonic vibration. SK hynix describes it as combining advantages of thermocompression and ultrasonic methods, but that does not make it universally preferable: the package, pads, wire, bonder, and reliability target govern the choice.
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Ball/stitch and wedge/wedge geometries
Ball/stitch
For ball bonding, the wire end is formed into a ball to make the first bond. The wire is then looped to the second location, where it is attached with a stitch bond. A capillary guides the wire, forms the ball, and applies the process inputs at the pad during thermosonic ball bonding.
Wedge/wedge
Wedge bonding uses a wedge tool and can create wedge bonds at both ends. Fraunhofer ENAS lists ball/stitch, ultrasonic wedge, and wedge/wedge capabilities. The geometry and process need to suit the component and package; these are not interchangeable workflows.
Choosing bond-wire material and size
Gold, aluminum, and copper are common bond-wire materials, but none is a universal best choice. SK hynix identifies tradeoffs: gold is chemically stable and suited to ball formation and looping; aluminum alloys are useful in some high-temperature or ultrasonic applications; copper costs less but is harder, creating process challenges that can include ball formation, looping, and pad damage. The actual decision also depends on product, package type, pad size, wire diameter, bonding process, and reliability needs.
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Fraunhofer ENAS lists the following wire sizes for its own services; these are examples of facility capability, not universal recommendations or proof of general market availability.
| Material | Fraunhofer ENAS listed wire diameters |
|---|---|
| Aluminum | 18, 25, 33, and 50 μm |
| Gold | 20, 25, 33, and 50 μm |
| Copper | 25 and 50 μm |
Wire diameter and alloy must match the package, pads, and process. A bond-wire purchase is a specialist consumable decision, not a standalone specification.
How bond strength is assessed
Pull and shear testing break or damage the tested bond, so they are destructive methods used for process development, qualification, process control, or quality assurance—not nondestructive inspection. They measure different aspects of bonding, and the applicable standard and customer requirements determine the procedure and acceptance limits.
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Shear testing
IEC 60749-22-2:2025 describes shear testing for thermosonic ball bonds made with wire 15–76 μm in diameter. The sample must allow sufficient tool access; IEC specifies a ball height of at least 4.0 μm for consistent shear results. The standard says the method can support process development, process control, or quality assurance. It cautions that wedge-bond shear has not been shown to be a consistent indicator of bond integrity. IEC 60749-22-2:2025.
Pull testing
BSI’s 2026 listing for BS EN IEC 60749-22-1:2026, adopting IEC 60749-22-1:2025, describes destructive pull testing to assess strength and failure mode. Its listed scope covers thermosonic gold-, copper-, and silver-alloy ball/stitch bonds with wire 15–76 μm in diameter, and ultrasonic gold-, copper-, and aluminum-alloy wedge bonds with wire 18–600 μm in diameter. These ranges describe the standard listing, not a general specification for every assembly. BSI’s standard listing.
Why shear and pull are complementary
ASTM F1269-13 covers destructive shear testing of gold or copper ball bonds. ASTM says ball shear examines the first bond, so it should complement wire pull testing rather than replace it. Check the current applicable edition and customer requirements before specifying a test. ASTM F1269-13 catalog listing.
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Tooling, compatibility, and handling
A capillary is a credible search term for thermosonic ball-bond tooling, but it must match the bonder, wire diameter, and process. The same compatibility caution applies to bond wire: a tool or consumable that fits one setup may not suit another. Confirm specifications against the equipment and package requirements before selection.
Handling precautions can also be device-specific. For GaAs MMIC assembly, Keysight’s application note calls for ESD prevention during storage, handling, and assembly, including antistatic storage, grounded mats, operator ground straps, and common grounding of equipment. Follow the relevant device and assembly requirements rather than assuming every detail applies to every wire-bonding operation. Keysight’s GaAs MMIC assembly application note.
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