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What process node does Blackwell use?
NVIDIA identifies Blackwell’s manufacturing process as TSMC 4NP, not 3nm. The company used that designation in its March 18, 2024 Blackwell announcement, and its GB200 NVL technical guide and MLPerf report also describe the GPUs as 4NP.
“4NP” is NVIDIA’s published designation for a customized TSMC process. The cited NVIDIA materials do not establish that it is equivalent to a particular commercial node label, so it is not sound to translate 4NP into “3nm” or another name without additional evidence.
How is Blackwell built?
NVIDIA says each Blackwell GPU has 208 billion transistors across two reticle-limited dies. A 10 TB/s chip-to-chip connection joins the dies. That multi-die design is part of the architecture’s description; it does not change the process designation NVIDIA gives for manufacturing it.
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- AI Performance: 767 AI TOPS
- OC mode: 2632 MHz (OC mode)/ 2602 MHz (Default mode)
- Powered by the NVIDIA Blackwell architecture and DLSS 4
- Axial-tech fan design features a smaller fan hub that facilitates longer blades and a barrier ring that increases downward air pressure
- A 2.5-slot design maximizes compatibility and cooling efficiency for superior performance in small chassis
Which Blackwell products were announced?
NVIDIA introduced the Blackwell family at GTC on March 18, 2024. The announcement included B200 GPUs, the GB200 Grace Blackwell Superchip, and DGX B200 and DGX SuperPOD systems. These names refer to different levels of the product lineup, from GPU to integrated compute and larger systems.
| Product | What it combines or describes | Configuration stated by NVIDIA |
|---|---|---|
| B200 | Blackwell Tensor Core GPU | Blackwell GPU architecture; two reticle-limited dies and 208 billion transistors per GPU |
| GB200 Grace Blackwell Superchip | Grace CPU and Blackwell GPUs | One Grace CPU paired with two Blackwell GPUs |
| GB200 NVL72 | Rack-scale NVLink system | 36 Grace CPUs and 72 Blackwell GPUs connected in one NVLink domain |
NVIDIA said at launch that DGX GB200 and DGX B200 systems were expected from global partners later in 2024. That was the company’s announcement-time expectation, not a statement of current availability.
Rank #2
- Powered by the NVIDIA Blackwell architecture and DLSS 4
- Powered by GeForce RTX 5070 Ti
- Integrated with 16GB GDDR7 256bit memory interface
- PCIe 5.0
- WINDFORCE cooling system
What is TSMC 4NP, and what can the label tell you?
For this architecture, 4NP is the process name NVIDIA publishes for Blackwell manufacturing at TSMC. NVIDIA also identifies TSMC as a foundry partner in its June 2024 announcement. The available product descriptions do not supply a conversion from 4NP to a commercial “3nm” category or a node-to-node comparison. Treating those labels as interchangeable would go beyond what NVIDIA states.
What performance claims has NVIDIA made?
NVIDIA’s MLPerf Inference v4.1 report said Blackwell delivered up to 4× higher per-GPU throughput than H100 on the Llama 2 70B benchmark. The report’s results were retrieved on August 28, 2024. This is a vendor-reported result for a named workload and benchmark, not a guarantee of a 4× gain across other models, software stacks, precision settings or full systems.
Rank #3
- Powered by the NVIDIA Blackwell architecture and DLSS 4. System Requirements: Minimum 850W PSU with 16-pin 12V-2x6 (12VHPWR) connector required. Verify before purchasing.
- Military-grade components deliver rock-solid power and longer lifespan for ultimate durability. Compatibility: 348mm (13.7") length, 3.6 slots, 4.3 lbs. Confirm case clearance and slot spacing. GPU bracket included.
- Protective PCB coating helps protect against short circuits caused by moisture, dust, or debris
- 3.6-slot design with massive fin array optimized for airflow from three Axial-tech fans
- Phase-change GPU thermal pad helps ensure optimal thermal performance and longevity, outlasting traditional thermal paste for graphics cards under heavy loads
NVIDIA’s March 2024 DGX SuperPOD release also claimed up to 30× H100 inference performance for GB200 workloads. That is a separate vendor claim about GB200 workloads, not the same measurement as the per-GPU MLPerf result. Neither figure, by itself, establishes an independent comparison under every deployment’s power, cooling or operating conditions.
Independent reader supportYour contribution helps us test, update, and keep practical guides available for everyone.What Blackwell features matter beyond the process label?
NVIDIA positions Blackwell around its second-generation Transformer Engine and support for FP4 inference. These features are central to the company’s AI-performance claims; process branding alone does not describe how the architecture is intended to handle AI workloads.
Quick Recap
Best Value
- Powered by the NVIDIA Blackwell architecture and DLSS 4 OC mode: 2640MHz/Default mode: 2610MHz (Boost Clock)
- Military-grade components deliver rock-solid power and longer lifespan for ultimate durability
- Protective PCB coating helps protect against short circuits caused by moisture, dust, or debris
- 3.125-slot design with massive fin array optimized for airflow from three Axial-tech fans
- Phase-change GPU thermal pad helps ensure optimal thermal performance and longevity, outlasting traditional thermal paste for graphics cards under heavy loads
Rank #4
- Powered by the NVIDIA Blackwell architecture and DLSS 4
- Powered by GeForce RTX 5060
- Integrated with 8GB GDDR7 128bit memory interface
- PCIe 5.0
- WINDFORCE cooling system
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