TDK’s ModCap UHP (B25648A) DC-link capacitors are specified for a lifetime of 200,000 hours at a continuous hotspot temperature of +105 °C, without power derating. That is a rating under specified electrical and thermal conditions—not a guarantee that every capacitor will last that long in every installation.
What does TDK’s 200,000-hour rating mean?
The rating applies to the capacitor’s hotspot—the hottest point inside the component—and depends on the operating voltage, current and thermal conditions. It does not mean that an inverter can run at any current or cooling level and still achieve the stated lifetime. TDK’s 2026 announcement says the ModCap UHP series supports continuous hotspot operation up to +105 °C without power derating and is designed for 200,000 hours at that temperature.
TDK also says the series supports 20% higher current density than its comparison baseline. That claim describes the design’s current density, not a 20% increase in the rated current of every variant or an across-the-board reduction in system size.
Which ModCap UHP ratings are available?
TDK announced three variants. Their rated-current figures below are specified at a capacitor temperature of +75 °C; they are not interchangeable with the +105 °C hotspot lifetime condition.
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| Rated DC voltage | Rated capacitance | Rated current at +75 °C |
|---|---|---|
| 1350 V | 880 µF | 205 A |
| 1600 V | 640 µF | 190 A |
| 1800 V | 470 µF | 180 A |
The family has a stated equivalent series inductance (ESL) of 8 nH. TDK describes a modular cubic form factor intended to support busbar integration, along with self-healing construction and overvoltage capability. These features may help with compact DC-link layouts and high-frequency switching, but the appropriate part still depends on the full electrical and mechanical design.
How was the high-temperature performance demonstrated?
In a design example analyzed by Electronic Design in 2026, the DC link needed 1,600 V, at least 1,850 µF and 570 A. Three B25648A1647K003 UHP capacitors met those stated requirements. Finite-element thermal modeling predicted a maximum internal capacitor temperature of +104.8 °C—0.2 °C below the +105 °C limit—and the design was assessed at 200,000 hours without derating.
This example helps explain what the lifetime claim can look like in a system calculation: the predicted internal hotspot must stay within the rating while the electrical requirements are met. It is a modeled design case, not evidence of a 200,000-hour field trial or a universal field-life result.
How does ModCap UHP differ from ModCap HF?
Electronic Design identifies the UHP film in its comparison as BOEPN and contrasts it with BOPP film in ModCap HF. The useful comparison is not just the material name: it is how each candidate performs in the intended DC link at its actual hotspot, current, voltage and switching conditions.
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- Thermal and lifetime margin: Compare predicted hotspot temperature and lifetime at the system’s real voltage and ripple-current load, rather than treating a family-level lifetime figure as an unconditional guarantee.
- Current and switching behavior: Check rated current and current density alongside ESL and the switching-frequency behavior of the assembled busbar and capacitor loop.
- Electrical fit: Confirm voltage, capacitance and surge-current headroom, then determine how many capacitors must be connected in parallel.
- System trade-offs: Compare the resulting bank’s total volume and cost, rather than assuming the capacitor with the higher current density will always produce a smaller or cheaper system.
In Electronic Design’s specific case study, the UHP solution used three capacitors, compared with five for the HF design to preserve thermal and lifetime margin. The analysis reported 40% lower DC-link volume and 25% lower capacitor cost for UHP in that design. Those figures are case-study results; they are not guaranteed savings for other systems.
Where is ModCap UHP intended to be used?
TDK positions the series for DC links built around silicon-carbide (SiC) power switches. Named applications include renewable-energy converters, energy-storage systems, electrolyzers, auxiliary traction drives and industrial motor drives. Its high-temperature rating and modular construction are relevant to designs where thermal limits, current density and layout constraints matter, but the part must still be selected against the system’s actual operating envelope.
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What should engineers verify before design-in?
TDK offers its CLARA and CAP Thermal tools for application-specific lifetime and thermal evaluation. Before selecting a part, check the conditions that govern both predicted temperature and electrical stress:
- Cooling and the resulting internal capacitor hotspot, not just ambient or enclosure temperature.
- The ripple-current spectrum and its frequency-dependent heating effects.
- Busbar coupling and the inductance of the assembled DC-link loop.
- Operating voltage and any required voltage derating.
- Insulation, mechanical clearances and the exact ordering code.
Use the applicable datasheet and design tools to validate the selected part in the intended circuit. A family-level lifetime figure alone cannot establish the lifetime of a particular installation.
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