Microchip Technology and Delta Electronics announced an engineering partnership on July 17, 2025, to validate Microchip’s mSiC™ products in Delta power designs. The companies say the work is intended to speed adoption of silicon-carbide solutions for AI, mobility, automation, and infrastructure; they have not announced a named Delta product or a launch schedule.
What did Microchip and Delta agree to?
Under the agreement, the companies will collaborate on using Microchip silicon-carbide (SiC) products and technology in Delta designs. Microchip said it would prioritize resources to validate its mSiC solutions in those designs. The support described includes technical training, insight into Microchip’s R&D activities, early access to product samples, and design-validation help.
This is an engineering-adoption partnership, not a publicly announced merger, investment, or purchase commitment. The announcement describes the intended collaboration and target markets, but does not identify a Delta end product or confirm that a design has entered production.
Why use silicon carbide in power electronics?
SiC is a wide-bandgap semiconductor used in power switches and diodes. Its properties make it relevant to high-voltage, high-power conversion, where switching losses, heat, equipment size, and reliability can affect a system’s design and operating costs. Microchip vice president Clayton Pillion described SiC as enabling smaller, more efficient designs for high-voltage, high-power applications, with the potential for lower system cost.
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- CAS120M12BM2 CAS300M12BM2 Silicon Carbide Power Module
Those are technology benefits, not a published guarantee of savings for a particular Delta system. The companies have not released comparative efficiency, thermal, cost, or reliability results from a Delta design. The outcome depends on the device, circuit, operating conditions, cooling, and the wider system architecture.
Which Microchip SiC devices and modules are in scope?
The partnership announcement refers broadly to Microchip’s mSiC products; it does not specify which part numbers Delta will evaluate. Microchip’s public product announcements show the range of SiC components and modules it has described:
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- CAS120M12BM2 CAS300M12BM2 Silicon Carbide Power Module
| Microchip announcement | Products or ratings stated | What the release says |
|---|---|---|
| 2019 | 700 V SiC MOSFETs; 700 V and 1200 V Schottky barrier diodes | Intended for automotive, industrial, aerospace and defense, and other high-power applications. |
| 2020 | Schottky-diode-based power modules in 700 V, 1200 V, and 1700 V classes | Topologies included dual diode, full bridge, phase leg, dual common cathode, and three-phase bridge. Microchip said the modules were intended to improve switching efficiency, reduce thermal rise, and support smaller system footprints. |
| May 26, 2026 | HV-D3 mSiC power modules rated at 3.3 kV, integrating SiC MOSFETs and Schottky diodes in an industry-standard 62 mm package | Positioned for solid-state transformers in AI hyperscale data centers and other high-voltage applications. |
The 2026 HV-D3 announcement came after the partnership announcement, but it does not establish that Delta selected or adopted those modules. The public partnership materials do not name a specific device, package, current rating, or topology for Delta’s designs.
Where could the partnership apply?
Microchip named AI, mobility, automation, and infrastructure as target markets. Its product announcements also discuss applications including EVs, charging stations, smart grids, industrial motor drives, aerospace, and solid-state transformers. These are relevant application areas for SiC devices, not confirmed Delta projects under this agreement.
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- This CM400DX1-24A power semiconductor module features a rated current of 400A and a voltage rating of 1200V, designed for reliable switching and power conversion in industrial electronic setups.
- It is constructed with high-grade sintered copper and silicon carbide substrates to deliver consistent thermal performance and resist long-term thermal cycling under heavy operational loads.
- This module is compatible with standard industrial power drive racks and inverter systems, fitting seamlessly into preconfigured industrial automation and motor control assemblies.
- It supports three-phase power configuration, making it suitable for use in variable frequency drives, uninterruptible power supplies, and grid-tied renewable energy conversion systems.
- The module includes integrated gate drive terminals and a standardized pinout to simplify installation and reduce wiring errors during industrial electronics assembly.
In AI infrastructure, high-voltage power conversion is one potential use case; Microchip’s later 3.3 kV module release specifically positions that product for solid-state transformers in hyperscale data centers. That product positioning should not be read as evidence of a Delta data-center deployment.
What the announcement does not establish
Microchip and Delta have not publicly disclosed the agreement’s financial terms, exclusivity, purchase commitments, production volumes, binding design-win milestones, or guaranteed launch dates. Nor have they announced a named Delta product resulting from the work. Until the companies disclose a design or product, the partnership is best understood as an effort to evaluate and validate Microchip SiC technology for possible use in Delta systems, rather than proof of a commercial deployment.
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- 1 Pcs Silicon Carbide Field Effect Transistor (MOSFET) GC3M0120090D SUPSiC MOSFET Silicon Carbide Field Effect Transistor TO-247-3
What to compare when evaluating a SiC solution
A device rating alone does not show whether a SiC component fits a power system. For a product or design decision, compare:
Quick Recap
Best Value
- 1 Pcs Silicon Carbide Field Effect Transistor (MOSFET) IMW65R048M1H IMW65R048M1H TO-247-3
- Voltage class and current rating: Confirm both against the system’s electrical requirements; the partnership announcement does not state Delta’s target ratings.
- Switching and thermal performance: Check data under relevant operating conditions rather than assuming a general efficiency or temperature benefit.
- Package and topology: Module layout and circuit configuration affect integration and system design.
- Application fit: A device intended for one high-power use case is not automatically suitable for another.
- Design support and samples: Microchip’s announcement specifically describes training, R&D insight, early samples, and validation support as part of the collaboration.
- Supply continuity and total system cost: Assess these for the specific design; the partnership announcement publishes no volume, pricing, or supply commitment.
Product prices and availability are accurate as of the date/time indicated and are subject to change. Any price and availability information displayed on Amazon at the time of purchase will apply.
