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Silego’s configurable mixed-signal ICs (CMICs) were designed to combine analog, digital and memory functions in a configurable chip, so product designers could replace groups of separate components without committing to a fully custom ASIC. In an October 4, 2017, EE Times interview, Silego CEO John Teegen described the strategy behind that approach: make flexible integration practical for high-volume products, including notebooks, tablets and wearables.

What is a configurable mixed-signal IC?

A CMIC combines circuit functions that might otherwise be built from separate analog, digital and passive components. Silego paired its silicon with software-based design tools, letting engineers configure the functions needed for a product rather than designing a new chip from the ground up.

The term “mixed-signal” refers to the combination of analog and digital circuitry. Depending on the device and design, a CMIC can handle functions such as voltage monitoring, power sequencing, reset control, logic and timing. Silego’s approach also included nonvolatile memory to hold the configuration. The interview described CMICs as one-time-programmable or metal-mask-configurable parts; later GreenPAK generations added devices that can be programmed in-system.

Teegen acknowledged that the category was not easy to summarize: “It’s a little confusing because we do a number of things. We tried to figure out, how do we categorize it in a way that makes sense?” His answer was a software-configurable mixed-signal integration platform—not simply a clock chip, nor a general-purpose processor.

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Why Silego pursued the CMIC model

Silego had a history in PC clock chips, but Teegen described a broader opportunity: integrate functions that would otherwise require linear ICs, passive parts and discrete components. The aim was to preserve enough configurability for customers while producing a small, economical part suited to consumer volumes.

In the 2017 interview, Teegen said Silego had built an in-house, software-programmable silicon architecture with a target average selling price in the low teens. That is the company’s stated target, not an independently audited price measure or a current GreenPAK price. He said the strategy was intended to make the technology viable in high-volume consumer products.

That market focus was reflected in the business mix he described: “close to 75 percent of our business is still in the notebook and tablet space.” Teegen characterized that segment as a market of more than 400 million units. Both figures are statements from the 2017 interview, not current market estimates.

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How a CMIC compares with other design choices

A CMIC sits between a collection of separate components and a fully custom chip. The right choice depends on how much integration and configurability a design needs, as well as production volume and whether the design must change after manufacture.

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Approach Integration and board area Configurability Development and cost considerations Configuration updates
Discrete components Functions remain separate; may require more board space and connections. Choose or change individual parts, within their fixed functions. Can suit simple designs, but each additional part adds placement and integration work. Usually requires changing hardware or component values.
Fixed-function IC Combines a defined set of functions in one package. Limited to the features and settings the manufacturer provides. Can reduce part count when its feature set fits; a mismatch may require extra components. Only configurable within the IC’s supported options.
CMIC Can consolidate selected analog and digital functions; exact savings depend on the design. Configure functions using the device’s supported blocks and design tools. Offers a middle ground between separate parts and a custom chip. Renesas says GreenPAK can avoid custom-ASIC nonrecurring engineering charges; that is a manufacturer claim. Depends on the part: traditional one-time-programmable devices differ from in-system-programmable models.
FPGA or MCU with peripherals Combines programmable processing or logic with supporting components; integration varies by design. Typically offers broad software or logic flexibility, depending on the device. May suit designs needing extensive programmability, but requires selecting and integrating the processor or programmable logic and its supporting circuits. Often supports updates, subject to the device and product architecture.
Custom ASIC Can integrate a design-specific set of functions on one chip. Designed for the intended application rather than general field reconfiguration. Requires custom design and associated nonrecurring engineering; economics depend on volume and development needs. Changes generally require a revised chip design and manufacturing run.

These are broad architectural distinctions, not a benchmark of any particular product. A CMIC does not automatically beat a fixed-function IC, MCU or ASIC on cost, power or area: the result depends on the required functions, implementation and production conditions.

GreenPAK examples: wearable power and in-system programming

SLG46580 for wearable and handheld power systems

The 2017 interview highlighted the SLG46580 GreenPAK CMIC for wearable and handheld power designs. Its cited functions included voltage monitoring, power sequencing, reset functionality and configurable low-dropout regulators. Those functions illustrate the product’s intended role: place several supporting control and power-management tasks in one configurable device.

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SLG46824 and SLG46826 for in-system programming

In 2018, Dialog Semiconductor announced the SLG46824 and SLG46826 as GreenPAK devices that could be programmed in-system through an I2C interface. The release also described multi-time programming and a 2.0 × 3.0 mm, 20-pin STQFN package. Teegen, then Dialog’s vice president and general manager of the Configurable Mixed-signal Business Unit, said: “These are our first GreenPAK devices that can be programmed in-system.”

The release listed analog comparators, a voltage reference, power-on reset and macrocells among their features, with dual-supply operation. It identified consumer, commercial and industrial uses including wearables, notebooks, servers, embedded computing and medical devices. In-system programming is a meaningful distinction from the one-time-programmable parts described in the original interview: it provides a way to program these named devices after they are installed in a system, but it does not mean every GreenPAK part can be reconfigured in the field.

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What changed after the 2017 interview?

The shipment figures show the company’s reported cumulative volume increasing across successive announcements, but they are company-reported claims rather than independently audited market data.

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Milestone What was reported Attribution
2017 More than 3 billion CMICs shipped; five generations of CMIC silicon and design tools. Silego CEO John Teegen in the EE Times interview.
2018 More than 3.5 billion CMICs shipped. Dialog Semiconductor announcement.
2024 More than 5 billion GreenPAK devices shipped. Renesas overview.

Renesas describes GreenPAK as technology originating at Silego and outlines a portfolio of analog and digital blocks configured through its Go Configure graphical software. Its listed functions include macrocells, lookup tables, counters, delays, flip-flops, latches, op amps, ADC/DAC functions and an asynchronous state machine. The exact blocks available depend on the selected device.

Renesas also says GreenPAK can integrate 10 to 30 components and reduce bill-of-material costs by up to three times. These are manufacturer claims; they should not be read as a guaranteed saving for every circuit or as a neutral comparison with discrete designs.

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Automotive and other application areas

The configurable-control role extends beyond consumer wearables and computing. An official announcement for the automotive-grade SLG46620-A listed power sequencing, voltage monitoring, system reset, LED control, frequency detection and sensor interfacing. It also described factory programming and testing to automotive reliability requirements.

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Renesas identifies consumer, industrial, communications and AEC-Q100 automotive applications for the GreenPAK portfolio. These application statements describe intended markets; they do not establish that every GreenPAK device is automotive-qualified. For an automotive design, the qualification and operating requirements of the specific part matter.

Choosing a GreenPAK development platform

GreenPAK development platforms and an in-system-programming board are documented in official product materials, but the specific kit models, current availability and pricing are not established here. Choose a platform only after confirming that it supports the target device and its programming method. In particular, verify whether the part is one-time programmable or supports in-system or multi-time programming before planning a workflow around later configuration changes.

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