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Peregrine Semiconductor completed its acquisition of IDT’s wafer-fabrication facility in Sydney, Australia, on July 10, 2000. The transaction transferred Quality Semiconductor Australia (QSA), previously a wholly owned subsidiary of Integrated Device Technology (IDT), to Peregrine as a wholly owned subsidiary. The purchase price was not disclosed.
What Peregrine acquired from IDT
The acquired operation was IDT’s Sydney wafer fab, held through Quality Semiconductor Australia. After the transaction, QSA became a wholly owned Peregrine subsidiary. By September 26, 2000, the site was operating under the name Peregrine Semiconductor Australia and qualifying Peregrine’s Ultra-Thin Silicon (UTSi) CMOS process.
The ownership change gave Peregrine control of a manufacturing site, rather than merely access to an outside foundry. It could use the facility for its own chip production while continuing to provide manufacturing services to other customers.
Why the Sydney fab mattered to Peregrine
Peregrine planned to begin producing its patented UTSi CMOS technology at the Sydney site. The company said the added capacity would support highly integrated RF synthesizer and transceiver chips for wireless products. In the acquisition announcement, CEO Stav Prodromou called the deal a “very significant milestone” and pointed to strong demand for high-performance communications ICs.
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- Wafer Pattern May Vary from the Product Images. Great to be used as gift, display object, exhibition, educating demonstration, testing, decoration or your collection
- Beautiful microchip pattern structure made by the advanced copper technology
- 90~130nm minimum microchip feature Copper Characterization with TEOS or Black Diamond Low-k ILD on the single crystal silicon wafer
- The original value of un-polished wafer is above $500
- No guarantee for research and other applications
The fab also continued to offer 0.50-micron CMOS foundry services. That combination—Peregrine’s own UTSi production alongside established foundry work—meant the facility had both a strategic role in Peregrine’s product manufacturing and a continuing service business.
How the fab’s technology plans developed
The acquisition announcement described 0.50-micron CMOS foundry capability. In September 2001, equipment supplier ASML said its lithography, track and thermal systems would help upgrade the Sydney fab from 0.5-micron Class 10 to 0.25-micron Class 1 capability. Volume production was scheduled for the third quarter of 2001; that was a stated schedule, not confirmation in the announcement that production began on time.
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- Wafer Pattern May Vary from the Product Images. Great to be used as gift, display object, exhibition, educating demonstration, testing, decoration or your collection
- Beautiful microchip pattern structure made by the advanced copper technology
- 90~130nm minimum microchip feature Copper Characterization with TEOS or Black Diamond Low-k ILD on the single crystal silicon wafer
- The original value of un-polished wafer is above $500
- No guarantee for research and other applications
The change in node and class reflects a planned capability upgrade after the acquisition, not the condition of the fab when Peregrine bought it. The company’s manufacturing footprint also later served markets beyond wireless: Peregrine’s 2005 certification release described the Sydney fab as part of its ISO-9001:2000- and AS-9100-certified RF-IC design and manufacturing system, supporting applications including satellite and fiber communications.
What is known about the purchase price
Peregrine and IDT did not disclose the financial terms. No reliable purchase-price figure is established in the announcements, so the acquisition cannot be assigned a specific dollar value from the available reporting.
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- 5 x 5 inches, 0.67 ounces, 0.03 inches thick. Some wafers are marked with alignment marks.
- The pattern is produced by light diffraction, and its reflective appearance changes with the viewing angle.
- Silicon wafers are fragile—please handle with care.
- Circuit details can be examined under a microscope.
Later manufacturing scale
A 2007 Peregrine and OKI announcement reported that the two companies together were manufacturing 2.5 million UltraCMOS devices per week. That figure is a combined output milestone reported seven years after the Sydney acquisition; it is not a Sydney-fab-only production number and should not be read as one.
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- Genuine Silicon Wafer: crafted from high-purity silicon, this 12 inch silicon wafer features a precision double-side polished surface, delivering exceptional smoothness and mirror-like reflectivity on both sides, fitting well with tech decor needs; Please note: wafer pattern may vary from the product images
- Genuine Uncut Ic Silicon Wafer: this is a genuine uncut IC silicon wafer, not a replica or model; It preserves the original circular wafer form applied in semiconductor manufacturing, allowing you to experience real chip substrate material up close
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- Method: CZ ; Size: 4inch ;
- Type: P-Type ; Dopant: B ; Orientation: 100 ;
- Resistivity:1-10Ω ; Thickness: 525um±25 ;
- Front Side: Polished ; Back Side: Etched ; TTV＜10um；
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