Telink Semiconductor unveiled its TL322X wireless SoC family alongside the ML3228A module at Embedded World in Nuremberg on March 10, 2026. The launch pairs configurable chips for product designers with a more integrated module, targeting both multi-protocol IoT devices and wireless gaming peripherals.
What are the TL322X and ML3228A?
The TL322X is a dual-core, 32-bit RISC-V system-on-chip (SoC) for wireless products. Telink describes support for Bluetooth Low Energy (BLE), Zigbee, Matter, Thread, and a proprietary 2.4 GHz protocol; its launch material also describes concurrent Bluetooth, Zigbee, and Thread operation. These are protocol capabilities, not a guarantee that every configuration or product will use every protocol simultaneously.
The ML3228A is Telink’s module offering based on TL322X-class capability. A module packages the core wireless hardware into a more ready-to-use component than a bare SoC, which can simplify integration for a product team. Telink positions it for esports keyboards, mice, game controllers, smart-home devices, and wearables. Its official selection table lists the ML3228A-GAIA-M3-PE11 with Bluetooth 6.1.
Which published TL322X parts have different memory and package options?
Telink’s official selection table lists the following configurations. Memory, GPIO count, and package dimensions differ by part, so the TL322X family should not be treated as one fixed hardware specification.
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- High-performance foundation line, ARM Cortex-M4 core with DSP and FPU, 512 Kbytes Flash, 180 MHz CPU, ART Accelerator, Dual QSPI
- On-board ST-LINK/V2-1 debugger/programmer with SWD connector
- Can be powered from USB
- Three LEDs, Two Push-buttons
- Support of wide choice of Integrated Development Environments (IDEs) including IAR, ARM Keil, GCC-based IDEs
| Part | SRAM | NVM | GPIO | Package |
|---|---|---|---|---|
| TL3228AE11T80R | 384 KB | 2,560 KB | 64 | QFN80, 9 × 9 mm |
| TL3228AE10T80R | 256 KB | 1,536 KB | not stated (Telink official selection table) | not stated (Telink official selection table) |
| TL3225CG10T40R | 256 KB | 1,024 KB | 27 | QFN40, 5 × 5 mm |
The same Telink table specifies the ML3228A-GAIA-M3-PE11 at 18 × 35.3 × 2.6 mm, with 384 KB SRAM, 2,560 KB NVM, 64 GPIO, and Bluetooth 6.1. The listed TL322X products are identified as Bluetooth 6.1 in Telink’s catalog; confirm the exact part and documentation for the intended design.
What does Telink claim about 8K wireless gaming?
Telink is targeting gaming peripherals with what it calls true 8K polling, ultra-low latency, and a high-speed wireless link. In its 2026 event recap, Telink reports a maximum 6 Mbps Telink HDT wireless transfer rate, a maximum TL322X processor frequency of 192 MHz, and a 480 Mbps high-speed USB interface. These are vendor-published figures, not independently validated test results in the available launch material.
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- Featuring a 1GHz processor and SGX530 Graphics Engine.
- IntegratedNEON SIMD coprocessor；
- On board eMMC memory
- This development board offer high-speed USBconnectivity, an HDMIcompatible interface, and expandable memory option.
- Advanced for BeagleBone Black AM335x CortexA8 Development Board
The 480 Mbps figure refers to the USB path, while 6 Mbps is the reported maximum wireless transfer rate; they describe different links and should not be compared as though both measure the same connection. Telink’s social post associates the 8K polling claim and these gaming-oriented capabilities with mice, keyboards, and gamepads. The launch sources do not provide independent latency measurements or benchmark conditions, so treat the performance language as product positioning rather than a measured guarantee for a finished peripheral.
What other applications does Telink target?
Beyond gaming, Telink connects the family to smart homes, wearables, asset tracking, and automotive digital keys. Its official product information describes the automotive-grade TL3225 as integrating CAN-FD and LIN, channel-sounding anti-relay positioning, low-power operation, and AEC-Q100 certification for digital-key development. These automotive features are specific to the TL3225 positioning and should not be assumed for every TL322X part or the ML3228A module.
Rank #3
- 8/16-bit 65816 based Microcomputer (3.6864 MHz) on board with Twin Tone Generators, Timers, 4x UART, IO, Parallel Interface Bus
- 50 pin XBUS Expansion Connector with Address, Data, and Microprocessor control signals
- 3x8 IO Expansion Port Connectors
- 32KB External SRAM and 128KBytes External Socketed FLASH ROM
- Powered by USB (5V) for ease of connection to PC, MAC, Android Smartphone
What development tools and evaluation hardware are listed?
Telink lists SDKs for Bluetooth LE multi-connection, Bluetooth Audio, and the platform, and says its SDK and IoT Studio support development through OTA maintenance. The available launch information does not provide the SDK version numbers, so developers should check Telink’s current product materials for the releases applicable to their selected part.
- TL322X EV-board: Telink describes it as a board for verifying TL3228X/3828X-series chips and running functional tests.
- AIOT-DK1: Telink lists this development platform for ML721X, ML321X, and ML322X modules.
The EV-board is the most direct listed evaluation route for chip-level testing; AIOT-DK1 is the named platform for module development. The launch information establishes that these tools are documented, but does not establish current stock, pricing, regional availability, or a direct purchase channel. Ask Telink or an authorized distributor about availability and whether a specific board supports the exact part under consideration.
Quick Recap
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- 【ARM Cortex‑M3 32‑Bit MCU Core】 APM32F103C8T6 development board; ARM Cortex‑M3 32‑bit core running up to 72 MHz; 64 KB Flash and 20 KB SRAM; supports complex control logic and real‑time processing; suitable for MCU learning and embedded firmware development
- 【Minimum System Board Architecture】 Minimal system design with essential power, clock, and reset circuits; exposes core GPIO and control pins directly; reduces board complexity while keeping full MCU functionality; ideal for users who want clear hardware structure and custom peripheral expansion
- 【USB Type‑C Power And Data Interface】 USB Type‑C connector supports stable power input and data connection; modern reversible interface simplifies daily use; provides reliable 5 V input for onboard regulation; convenient for development setups without additional power adapters
- 【Flexible Unsoldered Pin Design】 Pin headers are not pre‑soldered; allows direct soldering to custom PCBs or selective header installation; improves mechanical flexibility and space utilization; suitable for embedded integration where fixed connectors are not desired
- 【SWD Debug And Code Compatibility】 Supports SWD programming and debugging via SWDIO and SWCLK pins; compatible with common ARM toolchains; largely code‑compatible with for STM32F103C8T6 projects; enables easy migration of examples and learning resources for practice and testing
Rank #4
- Capacitive Touch Display: Onboard 1.28inch capacitive touch display with 240×240 resolution and 65K color, featuring QMI8658 6-axis IMU with 3-axis accelerometer and 3-axis gyroscope for detecting motion gestures
- Memory and Storage: Built in 512KB of SRAM and 384KB ROM, with onboard 2MB PSRAM and an external 16MB Flash memory, featuring Type-C connector for easy connectivity and updates
- Dual-Core Processor: Equipped with 32-bit LX7 dual-core processor operating up to 240MHz main frequency, supports 2.4GHz Wi-Fi (802.11 b/g/n) and Bluetooth 5 (LE) with onboard antenna
- Battery and Connectivity: Onboard 3.7V lithium battery recharge and discharge header with 6 GPIO pins via SH1.0 connector for flexible project integration
- Low Power Consumption: Supports flexible clock and module power supply independent setting with various controls to realize low power consumption in different scenarios, integrated with USB serial port full-speed controller and GPIO pins for flexible pin function configuration
What should a design team verify before choosing one?
- Protocol needs: Confirm whether the product requires BLE, Zigbee, Matter, Thread, proprietary 2.4 GHz, or a particular combination, and verify the supported configuration for the selected part.
- Integration level: Decide whether a bare SoC or module better suits the design, then check board space, antenna and RF requirements, and the module documentation.
- Memory and I/O: Match the exact part’s SRAM, NVM, GPIO count, and package to the product’s firmware and hardware requirements.
- Performance evidence: For a gaming peripheral, request test conditions and implementation details behind polling, throughput, and latency claims rather than assuming the event figures predict end-product behavior.
- Automotive requirements: If designing a digital key, verify TL3225-specific interfaces and certification documentation for the intended application.
- Evaluation path: Confirm board compatibility, SDK release, and distributor availability before planning a prototype schedule.
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