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NIKO-SEM’s January 2024 outlook identified two potential growth paths for its power-semiconductor business: rising power-management requirements in AI-capable PCs and expansion into electric vehicles, energy storage, efficiency and renewable-energy systems. The company presented these as opportunities and conditional forecasts—not measured market results—and the available material does not establish whether they were realized by 2026.

What NIKO-SEM said about AI PC power demand

In an EE Times Taiwan feature dated January 31, 2024, Alex Leng, associate manager of NIKO-SEM’s Power Module Business Division, linked interest in AI PCs to artificial intelligence and generative AI moving from cloud services toward personal devices. The article cited AI-oriented chipsets from Intel and Qualcomm and suggested that AI could change how people interact with PCs.

Leng’s central point was conditional: more demanding computing could increase the need for power components because those components help deliver and manage the energy required by higher-performance processors and accelerators. However, the same article recognized two countervailing forces. Better power efficiency could reduce the amount of hardware needed in later generations, while cost pressure could limit how much additional power circuitry manufacturers are willing to add.

Consequently, “AI PCs will need more power components” is not an established industry measurement in this source. It is NIKO-SEM’s 2024 outlook, balanced by the possibility that efficiency improvements and pricing requirements could moderate demand.

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The possible 48V opportunity

Leng also described a future transition to 48V DC architecture in servers or PCs as a potential opportunity. His wording was prospective: “if AI servers or PCs transition to a 48V DC architecture in the future, it could become a significant opportunity for NIKO-SEM.” The feature does not report that this transition had occurred, identify a timetable, or quantify the resulting market.

Why NIKO-SEM was targeting NEVs and energy systems

NIKO-SEM said it was moving beyond PC-related components into automotive, new-energy vehicle (NEV), energy-conservation and storage, and renewable-energy applications. The article describes several relevant component roles:

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  • Motor-drive modules: power components used in systems that control electric motors.
  • In-vehicle systems: traditional automotive power components for functions such as A/V entertainment and touch panels.
  • Energy and renewable applications: power conversion and control needs associated with storage and renewable-energy equipment.

The company was described as conducting research and development in automotive power markets and obtaining automotive certifications. No certification name, jurisdiction or completion date is provided, so the material should not be read as proof that automotive qualification was complete.

How the opportunities compare

Opportunity Primary application Demand mechanism described in 2024 Evidence status
AI-capable PCs Computing power management Higher computational requirements could raise component demand; efficiency and cost reductions could lower it Company forecast, not a measured market result
48V server or PC architecture Higher-voltage system power distribution A possible future architecture change could create new module opportunities Prospective scenario; adoption not reported
NEVs and automotive systems Motor drives and in-vehicle electronics Electrification and broader vehicle electronics expand potential application areas Company expansion and R&D direction; certification completion not stated
Storage and renewables Energy conversion, conservation and storage New-energy equipment requires power switching and conversion Market focus identified; no market-size figures supplied

These are application-level distinctions from the feature, not rankings of market size or proof that one segment would outperform another.

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Power Semiconductor Module CM400DX1-24A
  • This CM400DX1-24A power semiconductor module features a rated current of 400A and a voltage rating of 1200V, designed for reliable switching and power conversion in industrial electronic setups.
  • It is constructed with high-grade sintered copper and silicon carbide substrates to deliver consistent thermal performance and resist long-term thermal cycling under heavy operational loads.
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  • The module includes integrated gate drive terminals and a standardized pinout to simplify installation and reduce wiring errors during industrial electronics assembly.

NIKO-SEM’s SFT PACK SiC module example

The named product example is NIKO-SEM’s SFT PACK series of silicon-carbide (SiC) power modules. The EE Times Taiwan feature reports that the series received an EE Awards Asia power-semiconductor award in 2023 and that its package isolation voltage is above 2 kV. The article does not provide a test method or independent verification for that specification.

NIKO-SEM describes an insulated package design that permits thermal paste to be applied directly to the heat sink during assembly. The claimed purpose is to control additional thermal-resistance differences introduced during assembly. This is a company-described packaging benefit, not an independently measured thermal-performance result in the available coverage.

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NIKO-SEM also presented itself as having more than 25 years of power-market experience. That figure is company context reported by the 2024 article rather than an independently audited corporate-history measure.

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What the 2024 outlook does—and does not—prove

  • It shows where NIKO-SEM said it was directing business development: AI-related PC power, automotive and NEV systems, storage and renewable energy.
  • It provides a conditional explanation of why AI PCs might increase power-component demand, alongside efficiency and cost pressures that could reduce that need.
  • It identifies 48V architecture as a possible future opportunity, not an announced industry transition.
  • It reports automotive R&D and certification activity without naming completed certifications.
  • It gives a product example and company-reported specifications, but not independent laboratory validation.
  • It contains no AI-PC or NEV market-size, shipment or adoption statistics.

The February 1, 2024 PR Newswire page carries an EE Times Taiwan-provided version of the material. It corroborates the publication and wording but is syndication, not an independent market study. The available sources also do not establish whether NIKO-SEM’s forecasts, certifications or product claims were realized or unchanged by 2026.

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Practical takeaway for engineers and buyers

For an engineer evaluating a SiC module, the reported “over 2 kV” isolation figure and package concept are starting points for due diligence, not substitutes for a datasheet, qualification report, switching-loss data, thermal-resistance values, creepage and clearance specifications, or application testing. For a market analyst, NIKO-SEM’s statements are useful as a snapshot of one supplier’s strategy in early 2024, but they cannot establish AI-PC or NEV adoption rates.

Anyone seeking an SFT PACK module should verify the exact part number, electrical ratings, certification documents, availability and authorized sales channel directly with NIKO-SEM or a qualified component distributor. A generic SiC power-module listing should not be assumed to be an SFT PACK product.

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