TSMC held an expansion ceremony at its Fab 22 site in Kaohsiung as the company prepared for its N2, or 2nm-class, process, according to an April 1, 2025 report by ExtremeTech. The event marks a construction and expansion milestone—not proof that the fab has reached high-volume production. TSMC’s public roadmap set an N2 production target, but the available sources do not verify Fab 22’s current output, yields, or customer allocations.
What happened at TSMC’s Fab 22?
ExtremeTech reported on April 1, 2025, that TSMC welcomed Fab 22 in Kaohsiung with an expansion ceremony. The report described the site as under construction and linked it to Taiwan investment and preparation for N2 manufacturing. TSMC’s official process announcements explain the N2 technology and schedule, but do not independently confirm the ceremony or its event details.
The report also discussed possible wafer capacity, investment, employment, and potential early customers. Those details should be treated as reporting and estimates, not confirmed Fab 22 capacity, budget, headcount, customer orders, or allocations. ExtremeTech cited conflicting outside capacity figures, so no single estimate is established as fact.
What is TSMC’s N2, or 2nm-class, process?
N2 is TSMC’s name for its 2nm-class process generation; “2nm” is a process-generation label, not a claim that every transistor feature measures exactly two nanometers. In a 2022 announcement, TSMC said N2 would use nanosheet transistor architecture, a gate-all-around-style structure intended to improve performance and power efficiency. TSMC’s N2 announcement described the architecture as delivering a “full-node improvement in performance and power efficiency.”
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TSMC’s stated comparison with N3
In 2022, TSMC said N2 would offer 10–15% greater speed at the same power, or 25–30% lower power at the same speed, compared with N3. These are TSMC’s process-level comparisons, not independent measurements or guaranteed gains for every finished chip. A product’s results can depend on its design and implementation.
When was N2 expected to enter production?
TSMC’s 2022 announcement scheduled N2 production for 2025. In a 2025 customer newsletter, the company said N2 remained on track for volume production in the second half of that year. That was a roadmap statement made at the time, not independent confirmation of when production actually began or how much any particular fab produced.
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The sources available here do not establish Fab 22’s operating status, production volume, yields, or customer allocation as of October 3, 2026. A ceremony and a company schedule are evidence of an expansion milestone and a target, respectively; neither alone verifies high-volume output at the Kaohsiung site.
How does Fab 22 fit into TSMC’s wider expansion?
Fab 22 is part of the Kaohsiung expansion described in the ceremony report. Separately, in an August 2025 newsletter, TSMC described U.S. plans totaling US$165 billion: an Arizona cluster comprising six advanced wafer fabs, two advanced packaging fabs, and a major R&D center. These were company-stated plans. The announcement does not establish that the Kaohsiung ceremony signaled a shift away from Taiwan or quantify any tradeoff between Taiwan and U.S. manufacturing. TSMC’s August 2025 newsletter
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TSMC introduced A14 in April 2025 as a subsequent process generation, with production planned for 2028. The company compared A14 with N2 at up to 15% more speed at the same power, up to 30% lower power at the same speed, and more than 20% greater logic density. These are TSMC’s projections for a planned process, not verified product results. TSMC’s A14 announcement
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