For NVIDIA’s HGX SXM configurations, H200 offers more memory and memory bandwidth than H100, while B200 raises both further and doubles the listed GPU-to-GPU NVLink bandwidth compared with H100 and H200. Those are platform specifications, not guaranteed workload speedups. Availability depends on current OEM, channel, and cloud listings; exports to China depend on the product and the details of the transaction.
How H100, H200, and B200 compare
NVIDIA’s HGX reference configurations place H100 and H200 in the Hopper generation and B200 in Blackwell. The figures below describe those HGX SXM configurations; they should not be assumed to apply to every board, server, or product form factor.
| HGX SXM configuration | Architecture | Memory per GPU | GPU memory bandwidth | Memory across eight GPUs | NVLink GPU-to-GPU bandwidth | Aggregate NVLink bandwidth |
|---|---|---|---|---|---|---|
| H100 | Hopper | 80 GB HBM3 | 3.35 TB/s | 640 GB | 900 GB/s | 7.2 TB/s |
| H200 | Hopper | 141 GB HBM3e | 4.8 TB/s | 1.1 TB (1,128 GB in NVIDIA’s reference architecture) | 900 GB/s | 7.2 TB/s |
| B200 | Blackwell | 180 GB HBM3e | Up to 8 TB/s | 1.44 TB | 1,800 GB/s | 14.4 TB/s |
Source: NVIDIA’s HGX H100/H200/B200 components reference. Values are vendor specifications, not independent test results. Actual performance depends on the board and complete system, workload, precision, software, and power configuration.
Memory capacity: how much model state can fit
In this reference comparison, H200 has 61 GB more memory per GPU than H100, and B200 has 39 GB more than H200. Greater capacity can make it possible to keep more model weights, runtime state, or other data in GPU memory, but usable capacity depends on software overhead and how a workload is divided across GPUs. Eight-GPU totals describe the system’s combined memory; they do not mean that a single GPU can use the entire total as its own memory.
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Memory bandwidth: moving data to and from GPU memory
NVIDIA lists H200 at 4.8 TB/s versus H100 at 3.35 TB/s, and B200 at up to 8 TB/s. Bandwidth is one factor in workload performance, not a direct prediction of training time or inference throughput. To compare speed for a particular use, look for benchmarks that match the model, precision, software stack, batch or sequence settings, and full system configuration.
Interconnect: scaling work across GPUs
HGX H100 and H200 use fourth-generation NVLink and third-generation NVSwitch, with 900 GB/s GPU-to-GPU bandwidth and 7.2 TB/s aggregate NVLink bandwidth in NVIDIA’s reference. HGX B200 uses fifth-generation NVLink and fourth-generation NVSwitch, with 1,800 GB/s GPU-to-GPU and 14.4 TB/s aggregate bandwidth. This distinction is relevant to multi-GPU workloads that exchange data between GPUs; it does not by itself establish a workload speedup.
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Which one should you choose?
- Consider H100 when its 80 GB per GPU and the performance of a specific available system meet the workload’s needs. Compare full-system benchmarks and acquisition terms rather than assuming a newer model is automatically the better value.
- Consider H200 when the additional memory capacity or bandwidth over H100 matters to the model or workload, and a supplier can offer the required system or cloud capacity.
- Consider B200 when the workload can benefit from its larger listed memory capacity, higher memory bandwidth, or newer interconnect, and the complete platform is available and suitable for the deployment.
Before deciding, compare the exact system’s workload results at matching precision and software versions, total system cost, power and cooling requirements, network design, delivery or cloud capacity, and any licensing restrictions for the destination. NVIDIA’s architecture overview says hardware support is provided through the fulfillment OEM and channel partners; it describes NVIDIA AI Enterprise software support for that architecture as a paid, per-GPU subscription. Confirm support scope and terms with the relevant supplier.
Availability: historical announcements are not live stock
| Product or milestone | What NVIDIA reported | What that establishes today |
|---|---|---|
| H200 system availability announcement | In November 2023, NVIDIA said systems would be available from global system manufacturers and cloud providers starting in Q2 2024. | A forward-looking announcement made in 2023; it does not establish present inventory, pricing, or delivery timing. |
| H200 on CoreWeave | NVIDIA later reported H200-powered systems available on CoreWeave and described it as the first cloud provider to announce general availability. | A dated company-reported deployment milestone, not confirmation of current capacity, price, or availability elsewhere. |
| H100 and B200 | The cited material does not establish current stock or delivery dates for either product. | Check a current OEM, channel partner, or cloud-provider listing for the exact system or instance. |
Availability can vary by system configuration, region, provider, and time. Request a current quote or capacity listing rather than relying on an old launch announcement. NVIDIA’s August 2026 filing also illustrates why export permission and commercial availability are separate: the company reported that it received licenses beginning in February 2026 for small amounts of H200 products for specific China-based customers, while PRC government restrictions prevented sales of all products for which licenses had been granted.
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Can H100, H200, or B200 be exported to China?
There is no safe blanket answer such as “allowed” or “banned” for every product and transaction. U.S. rules and licensing can depend on the exact product and configuration, destination, consignee and ownership, end use, and shipping or reexport route. A general policy announcement is not authorization for a specific shipment.
H200: case-by-case review under the January 2026 policy
On January 13, 2026, the U.S. Bureau of Industry and Security (BIS) announced that it would review license applications for H200, AMD MI325X, and similar chips for export to China case by case, provided security requirements are met. BIS specified that applicants must show the exports would not reduce global semiconductor production capacity available to U.S. customers; the Chinese purchaser must have export-compliance procedures, including customer screening; and the chip must pass independent third-party performance and security testing in the United States. This is a licensing review policy with conditions, not blanket permission to ship H200 to any China-based buyer.
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H100 and B200: check the product and transaction
NVIDIA’s August 2026 Form 10-Q describes U.S. licensing controls for products above specified performance thresholds and lists H100 and B200 among examples of products affected by controls for China and certain other destinations. The filing is NVIDIA’s account of commercial impacts and licensing controls; it is not a transaction-specific classification or license determination.
What a buyer or seller should verify
- Confirm the exact accelerator, system configuration, classification, and applicable current Export Administration Regulations.
- Review the destination, end user, ownership, intended end use, and all transit or reexport locations.
- Determine whether a license is required and whether any available license exception applies to the actual parties and transaction.
- Consult current BIS rules and qualified export counsel before committing to an international sale or shipment.
What the specifications do—and do not—tell you
The HGX figures are useful for comparing memory capacity, memory bandwidth, and interconnect specifications across NVIDIA’s stated configurations. They do not establish independent comparative benchmarks, current prices, or live inventory. Nor do they predict how a particular model will perform: software, precision, workload shape, system power and cooling, and network design can all affect the result. Ask suppliers for results and configuration details that match your own workload.
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For technical specifications, consult NVIDIA’s HGX H100/H200/B200 components reference and architecture overview. For dated availability statements, use NVIDIA’s H200 announcement and subsequent CoreWeave announcement. For export decisions, consult the current BIS rules and the relevant company filing; historical policy announcements and filings can be superseded or overtaken by later licensing decisions.
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