Kioxia began sampling 512 GB and 1 TB QLC UFS 4.1 embedded flash devices on January 27, 2026. They are components for device makers—not consumer storage cards or drives—and are aimed at products that need high-capacity, read-intensive storage. Kioxia reports substantial speed improvements over its previous QLC UFS generation, but those figures are vendor comparisons, not independent test results.
What Kioxia announced
Kioxia America said it had started sampling Universal Flash Storage (UFS) Ver. 4.1 devices built with 4-bit-per-cell quadruple-level cell (QLC) memory and 8th-generation BiCS FLASH 3D memory. The announced mobile-oriented capacities are 512 GB and 1 TB. Each device combines the flash memory with an integrated controller in a JEDEC-standard package. Kioxia’s January 27, 2026 announcement describes the parts as designed for high-capacity, read-intensive applications.
These are embedded components intended for OEM and system-design teams to integrate into products. They are not removable UFS cards, USB drives, or a phone-upgrade part that a consumer can install. The announcement concerns sampling for design evaluation; it does not provide a consumer retail listing or a general availability date.
How fast is it, according to Kioxia?
Kioxia compares the new devices with its earlier UFS 4.0/BiCS6 QLC UFS generation. It claims improvements in three performance measures and a reduction in write amplification:
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| Measure | Kioxia’s reported change | Comparison and qualification |
|---|---|---|
| Sequential write speed | 25% higher | Compared with Kioxia’s prior UFS 4.0/BiCS6 QLC UFS generation; vendor-reported, not independently tested. Kioxia, January 2026. |
| Random read speed | 90% higher | Compared with Kioxia’s prior UFS 4.0/BiCS6 QLC UFS generation; vendor-reported, not independently tested. Kioxia, January 2026. |
| Random write speed | 95% higher | Compared with Kioxia’s prior UFS 4.0/BiCS6 QLC UFS generation; vendor-reported, not independently tested. Kioxia, January 2026. |
| Write-amplification factor | Improves by up to 3.5× | Kioxia’s maximum claimed improvement versus that prior generation, with WriteBooster disabled; vendor-reported. Kioxia, January 2026. |
The percentages describe generation-over-generation claims from Kioxia, not a guarantee that every phone or workload will see the same increase. The announcement does not provide independent benchmark results or enough test details to translate the figures into a specific device’s everyday performance.
What QLC and 8th-generation BiCS FLASH contribute
QLC raises storage density
QLC stores four bits in each memory cell, increasing bit density compared with TLC, which stores three. That makes QLC useful where designers want more capacity in a compact embedded-storage package. Kioxia says controller and error-correction advances support competitive performance; that is the company’s characterization, not a separately established test conclusion.
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CBA bonds circuitry directly to the memory array
Kioxia’s 8th-generation BiCS FLASH introduces CMOS directly Bonded to Array (CBA), a design in which CMOS circuitry is directly bonded to the memory array. The device architecture combines a host processor and UFS interface with the embedded flash controller and high-density BiCS FLASH memory. Kioxia’s release presents this combination as part of the platform behind the new samples.
Capacity, package and compatibility
- Capacities: 512 GB and 1 TB for the announced QLC mobile samples.
- Package: JEDEC-standard package measuring 9 × 13 mm, reduced from the previous 11 × 13 mm package cited by Kioxia.
- UFS compatibility: UFS 4.1, with backward compatibility for UFS 4.0 and UFS 3.1.
- Controller: Integrated in the package alongside the BiCS FLASH memory.
Compatibility with earlier UFS versions describes the storage interface; it does not mean the component is a drop-in replacement for an existing phone chip. OEMs still need to design, qualify, and integrate the device into a host product.
Rank #3
- model; THGJFMT1E45BATV Chip volume：9x 13 x 0.8mm Chip capacity ：UFS 4.0. 256Gb.Memory chip Package : 153 FBGA
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- Suitable for use on mobile phones Smart products such as tablets and cars Repair usage Or upgrade the motherboard capacity Mainboard memory chip IC.
- Support bulk procurement Various integrated circuits Component chip IC.Mainboard memory chip IC Integrated circuit chips Component chip IC。various. Motherboard repair tool Mobile motherboard repair tool
- Various electronic chip models are available in stock from companies. not sure about the chip version Or it can be purchased in bulk You can contact customer service Consultation and confirmation,
Where the QLC samples may fit
Kioxia identifies smartphones and tablets as target applications, with potential use in PCs, networking equipment, AR/VR, IoT, and AI-enabled devices. The combination is most relevant to product designs seeking high embedded capacity and read-intensive use. Whether a given product adopts it depends on its host design, performance needs, power and thermal constraints, and qualification process.
How the automotive UFS 4.1 parts differ
Kioxia has also announced automotive UFS 4.1 products, but those are a distinct product line from the 512 GB and 1 TB mobile QLC samples. Its automotive release lists 128 GB, 256 GB, 512 GB, and 1 TB capacities for applications including infotainment, advanced driver-assistance systems (ADAS), telematics, domain controllers, and vehicle computers. It specifies AEC-Q100/104 Grade 2 support to a case temperature of 115°C. These automotive capacities and qualifications should not be attributed to the mobile QLC samples. Kioxia’s automotive UFS 4.1 announcement describes that separate offering.
Independent reader supportYour contribution helps us test, update, and keep practical guides available for everyone.Can consumers buy or upgrade to it?
There is no consumer product to buy based on the announced sampling release. Kioxia’s material describes OEM sampling and product design-in, not an Amazon listing, retail SKU, or consumer installation path. A microSD card or generic flash drive is not an equivalent substitute: the announced device is embedded UFS memory designed to be integrated into a host system.
Quick Recap
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Product prices and availability are accurate as of the date/time indicated and are subject to change. Any price and availability information displayed on Amazon at the time of purchase will apply.
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