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On the available benchmark evidence, the Dimensity 8400 leads the Snapdragon 7s Gen 4, most clearly in aggregate AnTuTu results. But the figures compare Snapdragon 7s Gen 4 with the base Dimensity 8400—not a confirmed Dimensity 8400 Max—and come from tests submitted on different phones. Treat them as indicative, not a controlled head-to-head verdict.
First, what does “Dimensity 8400 Max” mean here?
The naming needs care. MediaTek’s official specification and launch pages call the processor Dimensity 8400, while a third-party listing from 91mobiles uses the name “Dimensity 8400 Max” and gives its clock configuration. MediaTek’s device directory separately identifies the POCO X7 Pro’s chip as Dimensity 8400-Ultra. The cited sources do not establish that the Max, base 8400, and 8400-Ultra are equivalent.
That matters for the comparison: NanoReview’s direct benchmark page tests the base Dimensity 8400, not a chip explicitly identified as 8400 Max. Its results are useful context for the 8400 family, but cannot establish a precise benchmark result for a Max-branded chip.
Benchmark results: Dimensity 8400 leads in the available comparison
NanoReview’s comparison reports these results for Snapdragon 7s Gen 4 and base Dimensity 8400. It aggregates submissions from different phone models, rather than reporting a controlled test of two equivalent retail phones.
#1 Best Overall
- COMPATIBILITY: Suitable for Mediatek Dimensity 8400 (MT6899) processor chip IC and MT6899Z CPU applications
- PACKAGE CONTENTS: Includes 1 piece of MT6899 IC chip tin mesh
- INSTALLATION KIT: Complete BGA IC chip installation kit featuring positioning tin plant net for precise placement
- APPLICATION: Ideal for motherboard BGA IC chip replacement and CPU chip maintenance operations
- COMPONENT TYPE: Professional-grade electronic component designed for precise motherboard integration and repair
| Benchmark | Snapdragon 7s Gen 4 | Dimensity 8400 | What the comparison shows |
|---|---|---|---|
| AnTuTu 11 total | 1,041,898 (35 tests listed) | 1,948,428 (313 tests listed) | The Dimensity 8400 has the higher reported aggregate score; sample counts differ substantially. |
| Geekbench 6 single-core | 1,223 (13 tests listed) | 1,576 (31 tests listed) | The Dimensity 8400 has the higher reported score. |
| Geekbench 6 multi-core | 3,168 | Not stated in the cited comparison extract | The available extract does not provide a Dimensity result to compare. |
| PCMark 3.0 | 13,701 (fewer than 3 tested phones listed) | 14,015 (5 models listed) | The Dimensity result is higher, but the Snapdragon sample is especially limited. |
These are NanoReview’s reported values, accessed in 2026. They are not scores measured under matched conditions on the same phone design. Phone cooling, power settings, software, and other implementation differences can affect benchmark outcomes, so avoid treating the figures as a guaranteed result for every handset or as direct confirmation of 8400 Max performance.
Specifications: CPU, graphics, memory, and connectivity
The table separates official platform specifications from the third-party clock listing. A chip’s supported maximums are capabilities, not a guarantee that a phone maker will use them.
| Area | Snapdragon 7s Gen 4 | Dimensity 8400 / 8400 Max evidence |
|---|---|---|
| CPU | Qualcomm identifies a Kryo CPU; the cited official page does not provide a core-by-core configuration. | MediaTek’s official Dimensity 8400 specification lists eight Arm Cortex-A725 cores: one with 1 MB L2 cache, three with 512 KB L2 each, and four with 256 KB L2 each; it also lists 6 MB L3 and 5 MB system-level cache. 91mobiles lists the Max configuration as 1 × 3.25 GHz, 3 × 3.0 GHz, and 4 × 2.1 GHz. |
| GPU and gaming features | Adreno graphics and selected Snapdragon Elite Gaming features. | Mali-G720 MC7 graphics, Frame Rate Converter, and HyperEngine Adaptive Gaming Technology 3.0. |
| Memory and storage | The cited official page does not state comparable memory and storage limits. | LPDDR5X up to 8533 Mbps and UFS 4 with MCQ, according to MediaTek. |
| Wireless connectivity | Qualcomm lists Wi-Fi 6/6E capability and Bluetooth 6.0. Actual phone support can depend on design and region. | MediaTek lists Wi-Fi 6E and Bluetooth 5.4. |
| Display, camera, and video | Qualcomm describes platform imaging and display features; the cited material does not provide directly comparable limits here. | MediaTek lists WQHD+ displays up to 144 Hz, camera sensors up to 320 MP, and 4K60 video capture and playback. These are platform capabilities, not promises about every phone. |
What the chip specifications mean for gaming and everyday use
CPU performance
MediaTek’s all-Cortex-A725 design specifies eight performance-oriented cores, while Qualcomm describes the Snapdragon 7s Gen 4 as using a Kryo CPU. The benchmark comparison gives the Dimensity 8400 the higher reported Geekbench 6 single-core score; a complete multi-core comparison is not available in the cited extract. Neither a core description nor one score alone predicts how a phone will behave during long workloads.
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Gaming and graphics
The platform feature lists identify different GPU families and gaming technologies, but do not establish which chip will deliver higher frame rates in a particular game. Sustained gaming depends on the handset’s cooling and power limits as well as the game, settings, and software. Compare tests of the exact phone models when gaming performance is the deciding factor.
Rank #2
- COMPATIBILITY: Suitable for Mediatek Dimensity 8400 (MT6899) processor chip IC and MT6899Z CPU applications
- PACKAGE CONTENTS: Includes 1 piece of MT6899 IC chip with positioning board, magnet base, and tin mesh components
- INSTALLATION KIT: Complete BGA IC chip installation kit featuring positioning tin plant net for precise placement
- COMPLETE KIT: Includes tin mesh, positioning board, magnetic base, and tin scraper blade for comprehensive chip maintenance
- PRECISION DESIGN: Positioning board ensures accurate alignment during tin mesh application for optimal chip coverage
Memory, storage, and connectivity
The Dimensity 8400’s listed LPDDR5X and UFS 4 support can enable fast memory and storage, but phone makers may choose different configurations. Qualcomm’s listed wireless capabilities also do not guarantee that every Snapdragon 7s Gen 4 phone will expose all supported features. Check the individual handset’s specification sheet, including regional variants.
Independent reader supportYour contribution helps us test, update, and keep practical guides available for everyone.Do MediaTek’s launch figures compare it with Snapdragon?
No. MediaTek’s December 23, 2024 announcement said the Dimensity 8400 offered “up to 41% higher multi-core performance” and a “44% reduction in peak power use” compared with the previous Dimensity 8300. Those are vendor claims about a predecessor comparison, not measurements against Snapdragon 7s Gen 4.
Which phone should you choose?
These processors are not usually bought separately; they come inside phones with different designs and configurations. Use the chip comparison as one input, then compare the exact handsets you can buy in your region.
Quick Recap
- For benchmark-oriented performance: the available aggregate results favor the base Dimensity 8400, especially in AnTuTu 11. The evidence does not verify the same scores for 8400 Max.
- For sustained gaming or heavy workloads: look for testing of the specific phone under extended load. A chipset feature list does not show how effectively a handset cools itself.
- For daily use: weigh battery life, display, camera, storage configuration, software support, price, and regional network bands. A benchmark comparison does not measure those differences.
- When checking a listing: confirm the exact chip name. Do not assume a phone advertised with Dimensity 8400-Ultra uses the same processor as a Dimensity 8400 Max model.
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