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Bambu Lab’s parent company has filed a patent application for a heated print bed with a different heater arrangement. The filing says the design is intended to improve print-bed adhesion and print quality. It does not contain test results, and no published measurement or product launch shows that the design stops prints from peeling. The accurate answer to “will it stop peeling?” is that the application states an aim, and the aim has not been demonstrated.
What the patent application describes
The application was published internationally by WIPO as WO2025092408A1. It is filed by Shenzhen Tuozhu Technology Co Ltd, which current reporting identifies as the parent company of Bambu Lab. The filing describes three main parts: a heated bed body, a heating unit, and a bottom shell.
Where the heating unit sits
The heating unit is arranged between the heated bed body and the bottom shell. It is attached to the side of the bed body that is nearest the shell. The arrangement is the core of the proposal: the heat source is positioned under the bed surface rather than being the only design variable. A published application describes an intended design. It is not a parts list for a shipping product.
Key dates
| Milestone | Date | Where the date comes from |
|---|---|---|
| Priority date | November 1, 2023 | PCT publication WO2025092408A1 |
| Filing date | October 14, 2024 | PCT publication WO2025092408A1 |
| PCT publication date | May 8, 2025 | PCT publication WO2025092408A1 |
| US publication date (US20260264331A1) | September 10, 2026 | Reported by Tom’s Hardware; not checked against the USPTO record in this article |
The stated benefit, and what kind of claim it is
The abstract of the PCT publication contains the sentence: “Implementing the method of present application can improve the adhesion of a print bed and enhance printing quality.” That sentence is the applicant’s statement of the intended effect. It describes what the method is meant to do, not what a tested bed has achieved.
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Peeling is a failure of adhesion, so the stated goal is relevant to peeling. However, the abstract speaks about adhesion and print quality in general. It does not provide a peel rate, a success percentage, or a comparison with an existing bed.
What Tom’s Hardware reports about the drawings
Tom’s Hardware, which reported on the related US publication, describes the patent drawings as showing a recessed heating path that extends toward the corners of the bed. The same report says the design does not describe independently heated zones. These are the outlet’s readings of the drawings, not measurements or statements from Bambu Lab.
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The outlet also notes that the publication includes no performance data and no replacement-bed price. It speculates that machining the design could add cost, and that replacement-bed prices could rise if the design reaches production. Those are possibilities raised by the reporter. No cost, price change or production plan has been announced by the company.
What is not established
The published material does not establish any of the following:
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- A measured improvement in adhesion compared with an existing bed or plate.
- Bed-temperature uniformity across the surface.
- A reduction in warping.
- Time to reach a target temperature.
- That a bed built to this design has been manufactured, sold, or tested by an independent party.
- Pricing or a release date for a replacement bed.
No user experience with the design has been reported. A patent application describing a heating arrangement is evidence of what the applicant has proposed, not evidence that the proposal outperforms current hardware.
Why bed temperature still matters on current printers
Bambu Lab’s plate troubleshooting guidance says adhesion between filament and build plate is significantly influenced by heatbed temperature. That guidance applies to printers that exist today. It does not indicate that current plates or beds incorporate the proposed heater layout, and it should not be read that way.
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Practical options on current printers
If prints are lifting or peeling today, the following options come from Bambu Lab’s current guidance. None of them depend on the patent.
Check the bed temperature for the filament
Confirm that the bed temperature in your slicer’s filament profile matches the manufacturer’s recommendation for the material you are printing. Because the troubleshooting guide identifies heatbed temperature as a significant factor in adhesion, this is the first setting to verify. Change one value at a time and print a test piece after each change so you can see which adjustment made the difference.
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Replace a worn build plate
Bambu Lab’s guide mentions replacement plates as a remedy when adhesion problems persist. A replacement plate is a separate part from the proposed bed, and the guide does not connect the two.
Use the adhesive Bambu Lab recommends
In a quality update, Bambu Lab wrote: “A liquid glue adhesion product was launched recently, which has been specially formulated for easy application and little residue, so we strongly recommend it.” This is the company’s recommendation for its current products. It is not evidence about how the patented heater performs, and the company does not present the glue as a replacement for the design.
What would change the picture
The following developments would give readers something to measure the application against:
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- Published adhesion, temperature-uniformity or warping measurements, with the test plate, filament, temperature and print conditions stated.
- Independent tests that compare the new design with current beds and plates under the same conditions.
- Published pricing or availability for a replacement bed.
Until one of these appears, the application is best read as an engineering intention, and the peeling question remains open for current printers and for the proposed design alike.
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