SK hynix and TSMC are working together on HBM4 base-die technology and package integration: TSMC is contributing advanced logic process technology for the base die and its CoWoS packaging expertise, while SK hynix develops the HBM memory. SK hynix announced the plan in 2024, reiterated it in 2026, and later said HBM4 development was complete and ready for mass production. That readiness statement does not, by itself, establish shipment volumes, customer qualification, or broad market availability.
What the SK hynix–TSMC HBM4 collaboration covers
SK hynix announced a memorandum of understanding with TSMC on April 19, 2024, covering next-generation HBM development and advanced packaging integration. The companies described a division of work: SK hynix develops the stacked memory, while TSMC’s advanced logic process is intended for the HBM4 base die. They also said they would optimize integration of SK hynix HBM with TSMC’s CoWoS packaging. SK hynix’s 2024 announcement.
The announcements identify TSMC’s contribution as an “advanced logic” process, but do not unambiguously name a process node for the HBM4 base die. The collaboration therefore should not be described as using a particular nanometer node based on these statements.
What HBM4’s base die does
HBM, or high-bandwidth memory, is made by stacking DRAM dies. The base die is the lowest die in the package; SK hynix describes it as connecting the stack to the GPU. Through-silicon vias (TSVs) provide vertical electrical connections between chips in the stack. SK hynix’s description of the HBM4 collaboration.
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Using an advanced logic process for the base die is intended to make it possible to put more functionality in limited space, according to SK hynix’s 2024 announcement. The companies’ separate CoWoS work addresses how the HBM is integrated into the broader package; it is not a claim that TSMC is developing SK hynix’s DRAM stack.
How the collaboration and HBM4 status have progressed
- April 19, 2024: SK hynix announced the MOU and a plan to develop HBM4 with TSMC’s advanced logic technology for the base die, alongside packaging integration work. The announcement said mass production was planned from 2026; that was a forward-looking target at the time, not a report of production or shipments. 2024 announcement.
- April 23, 2026: In a report on the TSMC Technology Symposium, SK hynix reiterated the base-die collaboration and described a displayed HBM4 model as 16-layer and 48GB. Those figures describe the model presented by SK hynix; they are not market statistics or independently validated performance results. 2026 symposium report.
- Later company update: SK hynix reported completing HBM4 development and readiness for mass production. The update establishes the company’s stated development status; it does not quantify shipments, disclose customer qualification outcomes, or establish market-wide availability. SK hynix HBM4 update.
What the announcement does—and does not—establish
The reported 16-layer, 48GB model indicates the configuration SK hynix chose to describe at the 2026 symposium. It should not be treated as evidence of a shipping product’s volume, qualification by particular customers, or comparative performance. The cited company updates do not provide matched specifications for ranking HBM4 against competing products, nor do they establish a definitive process node for this base die.
SK hynix Chief Development Officer Ahn Hyun framed the collaboration as part of a broader strategy, saying that integration of memory and logic could “transcend the limitations of existing architectures to maximize AI performance.” In the same April 23, 2026 company report, he said the company would strengthen collaboration on TSMC advanced logic for the base die starting with HBM4 and pursue customized solutions for varied workloads. These are statements of company strategy, not independent performance findings. SK hynix’s symposium report.
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