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3D PLUS announced a radiation-tolerant non-volatile CMOS NAND Flash module for space applications in 2006. EDN reported a 4G × 8 organization, independent CE, R/B, RE and WE signals, and a 50-lead SOP package. Those are historical announcement details—not confirmation of a currently orderable configuration. EDN’s May 9, 2006 announcement is the source for those claims.

What the 2006 announcement described

EDN characterized the module as radiation tolerant and designed for space applications. It reported a 4G × 8 organization and a 50-lead SOP package, with independent CE, R/B, RE and WE signals. The announcement does not provide the detailed electrical, environmental or radiation-test limits needed to assess a design against current mission requirements.

The same article said 3D PLUS technology was qualified by ESA, NASA and CNES, and reported that more than 20,000 modules had been in orbit for more than 10 years. These are company-level claims as reported in 2006; they do not establish that every product or a particular part number holds those qualifications or heritage. EDN also named Kepler, Solar Probe, SDO, New Horizon, Rosetta and Smart-1 as missions with embedded 3D PLUS modules. The announcement is the source for those mission references; independent mission-level verification is not established here.

A separate documented model: 3DFN16G08VS1712

A separate datasheet copy, marked August 2016, covers the 3D PLUS model 3DFN16G08VS1712. It describes a 16 Gbit device organized as 1 × 2G × 8-bit, in an SOP-50 package. Do not treat those model-specific details as a specification for the 2006 announcement’s product: the organization differs, and the available sources do not establish that the two descriptions refer to the same configuration.

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Specification in the 3DFN16G08VS1712 datasheet Stated value
Organization 1 × 2G × 8-bit
Package SOP-50
Supply voltage 3.3 V
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Typical block erase time 700 microseconds
Program/erase endurance 100,000 cycles
Data retention 10 years

These are specifications stated in the available 3DFN16G08VS1712 datasheet copy, not independent test results. Its August 2016 revision date makes controlled, current manufacturer documentation essential before using these figures for a new design.

What the radiation-tolerance claim does—and does not—establish

The 2006 EDN announcement calls the module radiation tolerant, but the information available from that announcement does not state test conditions, total-dose limits, particle species, LET thresholds, failure-rate data or a qualification record tied to an individual part number. The phrase alone is not enough to determine whether a device meets a mission’s radiation assurance requirements.

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For a design review or procurement decision, request controlled manufacturer documentation for the exact part and revision. Check for radiation test reports and qualification evidence applicable to that part, and confirm the electrical and environmental limits, error-management approach, endurance, retention, lifecycle status and traceability required by the mission. The cited sources do not establish those details for the 2006 product.

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How to interpret current portfolio listings

A more recent MSA Components overview groups 3D PLUS products under NAND Flash, RTIMS Flash and high-density NAND Flash categories. That portfolio overview indicates product categories, but does not show that a currently listed part is a direct successor to the product described in 2006 or that category names establish interchangeability.

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When evaluating a candidate, compare its controlled product documentation against the mission’s requirements: capacity and organization, interface and bus width, package, supply and environmental range, radiation assurance evidence, error management, endurance, retention, lifecycle and traceability. The cited overview is not enough to rank products across these criteria.

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What to confirm before specifying or sourcing

  • Identify the exact orderable part number and obtain its current controlled datasheet and revision history.
  • Confirm package, organization, interface signals, supply limits and environmental ratings against the design—not against the 2006 announcement alone.
  • Obtain part-specific radiation assurance evidence and determine whether its test conditions match the mission environment.
  • Verify lifecycle status, availability and traceability directly with the manufacturer or an authorized supplier. The available sources do not establish current stock or orderability.

Product prices and availability are accurate as of the date/time indicated and are subject to change. Any price and availability information displayed on Amazon at the time of purchase will apply.