AMD/Xilinx and Ranovus demonstrated an 800G co-packaged-optics system that paired AMD Versal adaptive SoCs with Ranovus Odin CPO 2.0. The March 2023 demonstration showed interoperability with third-party 800G DR8+ retimed pluggable modules; it was a technology demonstration, not an announcement that AMD was shipping a data-center photonics product.
What AMD and Ranovus demonstrated
At OFC on March 6, 2023, Ranovus announced that its Odin 800G direct-drive CPO 2.0 optical engine interoperated with AMD Versal adaptive SoCs and third-party 800G DR8+ retimed pluggable modules. AMD described the demonstration as evidence of flexibility and scalability in Ranovus’s technology. The announcement established interoperability in a demonstration; it did not specify a commercial launch, deployment schedule, or customer product. Ranovus’s OFC announcement.
What co-packaged optics means
In a conventional system, high-speed electrical signals travel across a circuit board from compute or switching silicon to separate optical modules, where they are converted to optical signals for transmission over fiber. Co-packaged optics (CPO) moves the optical input/output (I/O) engine into the same package as, or very close to, the main compute or switching silicon. Shorter electrical paths can reduce the burden of moving data across the board and are intended to enable higher I/O density and lower system power.
That architecture is relevant to AI and machine-learning clusters, where accelerators and network equipment must move large volumes of data. It can also simplify board routing. Those are design goals and system-level benefits, not a guarantee that every CPO deployment will achieve a specific power or cost saving. EE Times’s account of the demonstration.
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What Ranovus Odin does
Odin is Ranovus’s silicon-photonics optical-engine platform. In the company’s description, its monolithic electronic-photonic integrated circuit combines 100Gbps transmit and receive circuitry with silicon-photonics modulators and photodetectors. The AMD demonstration used the CPO 2.0 version of Odin. Ranovus’s later CPO 3.0 description also discusses integrated laser capability and passive attachment of fiber and laser components, but those details should not be assumed to describe the exact AMD-compatible CPO 2.0 setup. Ranovus’s ODIN CPO 3.0 announcement.
What the published performance figures mean
| Platform or demonstration | Reported bandwidth | Reported energy | What it applies to |
|---|---|---|---|
| Odin CPO 2.0 with AMD Versal, 2023 | 800Gbps | 5pJ/bit | Ranovus’s figures for the AMD-compatible demonstration. They are not an independently verified system-level comparison. |
| ODIN CPO 3.0 with MediaTek, 2024 | 6.4Tbps | 4pJ/bit | Ranovus’s figures for a separate, later platform collaboration—not the AMD demonstration. |
Bandwidth describes the stated data rate, while pJ/bit means picojoules per bit and expresses energy per transferred bit. The two rows refer to different generations and collaborations, so the 6.4Tbps and 4pJ/bit values should not be attributed to the AMD-Versal demonstration or treated as a like-for-like system benchmark. Ranovus’s 2023 announcement; Ranovus’s 2024 ODIN CPO 3.0 announcement.
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How the later announcements fit
AMD’s photonics plans
In 2025, AMD announced its acquisition of Enosemi, saying the team would help it “immediately scale our ability to support and develop a variety of photonics and co-packaged optics solutions across next-gen AI systems.” This is evidence that AMD is investing in photonics capabilities, but it does not establish that AMD adopted the 2023 Ranovus demonstration as a shipping product. AMD Ventures separately lists Ranovus among its data-center-interconnect portfolio companies. AMD’s Enosemi announcement; AMD Ventures portfolio.
Ranovus’s manufacturing collaboration
Ranovus announced a 2025 collaboration with Jabil for mass production of ODIN optical engines for AI and data-center applications. This points to a manufacturing path for the platform; the announcement alone does not establish deployment volumes or the commercial availability of the AMD demonstration. Ranovus’s Jabil announcement.
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What the announcement does—and does not—show
The meaningful result is interoperability: an AMD adaptive-compute platform was demonstrated alongside an 800G co-packaged optical engine and conventional retimed pluggable modules. That matters because optical links have to work within real system architectures, not just as isolated components.
It does not, on its own, establish a production AMD accelerator or network system using Odin, a customer deployment, a final system’s power savings, or how CPO compares with pluggable optics on serviceability and total cost. Evaluating such systems requires details beyond a link-rate and energy-per-bit figure, including optical I/O density, laser design, system power, board complexity, manufacturing maturity, serviceability, and cost. As Ranovus CEO Hamid Arabzadeh put it at the time, “Co-packaging is well under way.” EE Times.
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