A common starting point for a four-layer PCB is signal / ground / power / signal (S-G-P-S), with a continuous ground plane directly beneath the top signal layer. It is not a universal rule: choose the stackup around signal return paths, impedance, power distribution, board thickness, and the fabricator’s available materials and build options.
What does a four-layer PCB stackup describe?
A stackup lists the copper layers from one board surface to the other, along with the insulating material and thickness between them. Layer assignments determine where signals route, what reference plane they use, and how the board can distribute power. The finished dielectric spacing and copper geometry also affect controlled impedance, so the layer names alone are not enough to define a build.
| Layer | Typical S-G-P-S assignment | Purpose and design check |
|---|---|---|
| L1, top | Signal routing | Can place outer-layer traces close to the L2 ground reference. |
| L2 | Ground plane | Provides a reference and return path for top-layer signals; preserve continuity under sensitive routes. |
| L3 | Power plane or power distribution copper | Supplies components. It may be a plane or routed power copper, depending on the design. |
| L4, bottom | Signal routing | Adds routing capacity. Check the actual reference available to bottom-layer signals in the chosen construction. |
Which layer order is most common?
Signal / ground / power / signal
S-G-P-S is a defensible general-purpose starting point. It dedicates an inner layer to ground, places that reference immediately below top-layer signals, provides internal power distribution, and leaves both outer layers available for routing. Texas Instruments describes it as a typical arrangement, and Analog Devices also presents signal, ground, power, and auxiliary signal as a typical four-layer setup. See TI’s System Design Guidelines for SimpleLink MSP432E4 Microcontrollers and Analog Devices’ Grounding (Again).
These examples do not make S-G-P-S a universal standard. A circuit may need a different assignment, and the bottom-layer reference must be evaluated in the actual geometry rather than assumed from the layer labels.
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Signal / ground / ground / signal
S-G-G-S assigns both internal copper layers to ground and routes power on signal layers, pours, or traces. Consider it when continuous ground reference and return paths are more important to the design than a dedicated power plane. The cited design guidance supports the importance of continuous ground references, but does not establish a controlled, like-for-like comparison proving S-G-G-S is always better. Check power delivery, routing space, impedance geometry, and manufacturability for the particular board.
Other layer assignments
Other stackups can place ground on an outer layer or distribute signal and power differently. TI’s High Speed Layout Guidelines compares four candidate arrangements and discusses differing decoupling, EMC, and signal-integrity results. Those results are guidance in the context of that note, not a universal ranking. For high-speed signals, the note emphasizes a complete ground reference for sensitive microstrip traces and cautions against routes crossing plane gaps.
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How should you choose the stackup?
1. Preserve reference continuity and return paths
Give sensitive traces a nearby, continuous reference plane. At higher frequencies, return current tends to flow close to its outgoing signal because that minimizes loop area. A route crossing a gap in its reference plane can interrupt the direct return path and enlarge the loop; avoid this unless you deliberately provide a suitable return path. Analog Devices discusses return paths and grounding in Grounding (Again), while TI’s High Speed Layout Guidelines warns about routing across split-plane gaps.
2. Design impedance for the actual build
Trace width alone does not set impedance. The distance to the reference plane and the dielectric construction matter as well. If the fabricator changes the stackup, recheck trace geometry against the actual board build before finalizing impedance-sensitive routing. TI’s System Design Guidelines and Microchip’s Reference PCB Stack-Up illustrate construction-specific dimensions.
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3. Match power distribution to the rails and routing
Decide whether a dedicated power plane benefits the board’s supply architecture or whether routed power copper and ground pours fit better. A layer need not be an uninterrupted power plane simply because it is assigned to power. In Microchip’s device-specific example, L3 carries power and signal routing, with the remaining area filled by a ground polygon.
4. Plan mixed-signal grounding around current paths
Do not split analog and digital grounds automatically. Analog Devices notes that a solid ground can suit some systems with low digital current, while more complex systems may need a different strategy. Follow the component datasheets and plan where signal return currents flow; a signal routed over a split-plane gap loses its direct reference path.
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5. Confirm the fabrication geometry
Give the fabricator the layer order, finished thickness, copper weights, dielectric material and thicknesses, and controlled-impedance targets. Ask the chosen manufacturer to confirm its available construction and tolerances before fixing trace dimensions. Reference examples vary, so a published thickness or layer spacing should not be treated as a universal requirement.
Independent reader supportYour contribution helps us test, update, and keep practical guides available for everyone.What do published four-layer examples look like?
The following dimensions belong to specific official design examples, not a market-wide standard or a recommendation for every board.
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| Example | Reported construction | Qualification |
|---|---|---|
| Texas Instruments, 2017 | 0.062 inch (1.5748 mm) board thickness; four 1-ounce copper layers; 0.040-inch core; two 0.008-inch prepreg sheets. | Example FR-4 S-G-P-S construction in TI’s System Design Guidelines for SimpleLink MSP432E4 Microcontrollers; not a universal requirement. |
| Microchip Technology | 0.8 mm overall example thickness and 700 µm laminated thickness. | Device-specific Reference PCB Stack-Up; publication date is not stated on the retrieved page. |
What is the practical takeaway?
- Start with S-G-P-S when it suits the board, but choose the final assignment based on the circuit rather than convention alone.
- Keep a continuous ground reference close to sensitive signal routing.
- Verify impedance against the fabricator’s actual dielectric spacing, copper, and finished thickness.
- Use a dedicated power plane only when it serves the board’s power-distribution needs; routed copper may be appropriate instead.
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