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Semiconductor equipment suppliers make and service the specialized machines used to manufacture chips. ASML is best known for lithography and related wafer-measurement systems; Besi supplies equipment for attaching, connecting and packaging semiconductor dies. Their work belongs to different stages of production, although both companies have products relevant to emerging 3D integration.
Where equipment suppliers fit in chip production
Chip design specifies the circuits; equipment suppliers provide tools and services that help manufacturing businesses turn those designs into physical chips. ASML describes its offering as hardware, software and services for chipmakers. Besi describes itself as an assembly-equipment manufacturer serving the semiconductor and electronics industries.
A simplified production map is: wafer-fabrication processes create patterned structures on silicon wafers; the resulting dies are then assembled, connected and packaged. This is not a complete manufacturing flow, but it shows why lithography and packaging equipment are not interchangeable.
ASML: patterning and measuring wafer layers
ASML’s core role is wafer fabrication. Its portfolio includes extreme ultraviolet (EUV) and deep ultraviolet (DUV) lithography systems, as well as metrology and inspection equipment. Lithography projects patterns onto a wafer; measurement and inspection systems help assess the wafer and the structures made during fabrication. ASML’s 2025 annual report describes EUV and DUV as part of its lithography portfolio and reports sales of its systems. ASML 2025 Annual Report
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EUV and DUV are light-based patterning approaches
ASML states that its EUV lithography uses light with a wavelength of 13.5 nanometers. That number describes the light wavelength, not the size of every chip feature. ASML explains that EUV light is produced through a laser-produced plasma process and directed by multilayer mirrors developed with its optical partner ZEISS. DUV is also part of ASML’s portfolio and can be used with multi-patterning to create small features. ASML 2025 Annual Report: Strategy & stories
ASML’s 2025 figures describe ASML alone
ASML reported 535 system sales in 2025: 48 EUV lithography systems, 279 DUV lithography systems, and 208 metrology and inspection systems. These are ASML’s own system-sales figures, not a count of all equipment sold across the semiconductor industry. For 2025, ASML also reported US GAAP net sales of €32.7 billion, a gross margin of 52.8%, and €4.7 billion in research and development investment. ASML 2025 Annual Report Based on US GAAP
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Besi: attaching, connecting and packaging dies
Besi’s equipment is associated with assembly and packaging rather than the wafer-patterning work for which ASML is known. Its products cover die attach, flip-chip, thermal-compression bonding, fan-out wafer-level packaging, hybrid bonding and embedded-bridge die bonding. It also lists molding, trim and form, singulation, and tin, copper and precious-metal plating equipment. Its services include tooling, conversion kits, spare parts and support for equipment already installed at customer sites. Besi Products & Services
These categories address different operations: attaching one or more dies, forming connections between components, and completing or separating packages. “Packaging” is therefore not one machine or one manufacturing step. Besi’s product list is a set of examples, not a complete inventory of every packaging technology.
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ASML and Besi compared by production stage
| Company | Production stage | Equipment examples | Customer context |
|---|---|---|---|
| ASML | Primarily wafer fabrication | EUV and DUV lithography; metrology and inspection | Chipmakers operating wafer fabs |
| Besi | Assembly and packaging | Die attach, flip-chip, bonding, molding, singulation and plating | Semiconductor and electronics assembly operations; installed-base service |
The comparison is about function and production stage, not price or performance. The companies may serve adjacent parts of the supply chain, but the cited product portfolios do not make them substitutes for the same step.
Why advanced packaging connects the two fields
Advanced packaging increasingly involves connecting or stacking components rather than treating a finished chip as a single, isolated die. ASML describes wafer bonding as joining separate wafers—for example, logic and memory wafers—into a stack. Its report says lithography, metrology and inspection can support the precision needed for bonded wafers. Besi, meanwhile, lists hybrid and embedded-bridge bonding equipment among its assembly products. ASML 2025 Annual Report: Strategy & stories Besi Products & Services
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ASML also documented a move into advanced-packaging equipment: CEO Christophe Fouquet said the company shipped its first advanced-packaging product, the TWINSCAN XT:260, in 2025. That shipment broadens ASML’s activity into an adjacent area; it does not mean ASML and Besi perform the same manufacturing step. ASML 2025 Annual Report: CEO message
Independent reader supportYour contribution helps us test, update, and keep practical guides available for everyone.The supplier network behind the machines
Equipment makers themselves depend on specialized suppliers. ASML says approximately 80% of its bill of materials is sourced through its global supplier network and identifies ZEISS as its optical partner for EUV mirrors. The 80% figure applies to ASML’s own bill of materials; it should not be read as an industry-wide statistic or as a measure of every equipment company’s sourcing. ASML 2025 Annual Report
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What this comparison does—and does not—show
ASML and Besi illustrate how semiconductor production relies on specialized equipment makers at different stages: one company’s best-known systems pattern and inspect wafers, while the other’s portfolio focuses on die assembly and packaging. Their examples help explain the supply chain, but they are not a complete map of all semiconductor equipment suppliers or all packaging processes.
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