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The June 2023 edition of EE Times Europe Magazine focuses on automotive electronics, from electric-vehicle range and charging to the safety limits of autonomous driving. It also covers semiconductor startups, the U.S. and EU Chips Acts, and tinyML, including an interview with Pete Warden.
Issue identity and focus
EE Times/AspenCore published the digital edition on June 5, 2023. The publisher describes its central theme as “the changing landscape of automotive electronic design.” The issue connects that theme to three developments in vehicles: electrification, connectivity and autonomy. EE Times Europe’s issue page
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What the issue says about electric vehicles
The edition considers EV adoption through three practical system questions: vehicle range, energy storage and recharging infrastructure. Its publisher says EV penetration had exceeded expectations, but the public issue description gives no percentage or other numerical measure. That makes the statement a qualitative observation, not a quantified forecast or adoption statistic.
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The issue presents autonomous vehicles as promising while emphasizing the demanding conditions required for safe operation. A vehicle intended to drive autonomously must handle roads safely by day and night and in all weather—not just in favorable conditions. The description also frames road-safety improvements as urgent even as timelines for fully autonomous, Level 5 driving recede.
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The publisher captures the tension directly: “The promise of autonomous vehicles (AVs) is also immense, but will it be realized?” The issue description does not give a revised Level 5 launch date, so its point is about the challenge and uncertainty of reaching that capability, not a specific schedule.
Semiconductor startups and the Chips Acts
The issue broadens its focus from vehicle design to the semiconductor ecosystem that supports it. Wayne Rickard, CEO of Terecircuits, contributes an opinion piece about startups in the semiconductor supply chain. Sriram Viswanathan, founding managing partner of Celesta Capital, offers a perspective on the role of the U.S. and EU Chips Acts in the global economy.
These contributions put startup participation and public policy alongside automotive engineering: the issue treats chip development and the policy environment as relevant parts of the wider technology landscape, rather than as vehicle specifications. The publisher’s description does not provide a side-by-side assessment of the two acts or quantify their effects.
tinyML and the Pete Warden interview
tinyML is another subject in the edition. The publisher presents it as a technology that has developed over time and features an exclusive interview with Pete Warden, whom it identifies as one of tinyML’s founders. In the issue’s broader context, tinyML brings the discussion to machine learning on small, embedded devices, alongside the larger automotive and semiconductor topics.
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Who should read the issue?
The June 2023 edition is most relevant to readers following automotive electronics, EV system development, autonomy and safety, semiconductor startups, chip policy, or embedded machine learning. Its value is the range of connected subjects it brings together; the public issue description is an overview, not a source of detailed adoption figures, policy comparisons or technical specifications.
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Rank #4
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