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Samsung is reshaping its leadership, semiconductor operations and investment around the shift to AI computing. The central challenge is to turn its memory, foundry and advanced-packaging businesses into a more integrated offering while improving execution in logic chips and advanced manufacturing.
What Samsung is reorganizing around
The strategy is broader than a leadership shuffle. In its March 2026 corporate-value plan, Samsung described an end-to-end AI semiconductor offering that combines memory, foundry manufacturing and advanced packaging. Those capabilities matter together: AI systems need high-bandwidth memory (HBM), processors made on advanced manufacturing processes, and packaging that brings components together effectively.
The company also identified advanced robotics, MedTech, automotive electronics and heating, ventilation and air conditioning (HVAC) as potential growth areas for mergers and acquisitions. These priorities connect semiconductor investment to businesses where AI and electronics may create additional demand; they do not mean Samsung has announced a specific acquisition in each area.
Why the semiconductor business is under pressure
Samsung’s FY2025 results point to an execution problem, especially in foundry operations. Revenue grew, but earnings improvement was limited by provisional costs. Samsung said it had started mass production of first-generation 2-nanometer products and shipped 4-nanometer HBM base dies. For 2026, it said it planned to stabilize yields at advanced nodes, ramp second-generation 2-nanometer products, expand higher-value products on mature nodes, and better integrate logic, memory and advanced packaging.
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That plan targets both manufacturing performance and business economics. More advanced production is not enough if yields—the share of usable chips produced—remain difficult to stabilize or if the resulting products do not improve profitability. Samsung’s FY2025 disclosure does not establish a single cause for foundry performance, but it identifies yields, provisional costs and the need to expand high-value products as relevant issues.
The distinction between memory and logic operations also matters internally. Samsung’s memory business is competing in HBM, while foundry and System LSI operations face different technology, customer and profitability challenges. The integrated strategy is meant to bring those capabilities together without removing the need to address each business’s own execution problems.
Who took on new leadership roles
Samsung’s 21 November 2025 announcement changed leadership at its Device eXperience division and research organizations. TM Roh became head of DX and CEO, joining Young Hyun Jun as co-CEO. DX covers Samsung’s device-facing business; the announcement did not say that Roh replaced Jun as the sole chief executive.
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| Leader | Role announced | Why it matters to the reorganization |
|---|---|---|
| TM Roh | Head of Device eXperience (DX) Division and CEO | Places Roh in charge of the device division as one of Samsung’s co-CEOs. |
| Young Hyun Jun | Co-CEO | Continues as CEO alongside Roh. |
| Janghyun Yoon | DX chief technology officer and head of Samsung Research | Combines DX technology leadership with responsibility for Samsung Research. |
| Hongkun Park | Head of Samsung Advanced Institute of Technology | Leads the company’s advanced research institute. |
The semiconductor plan and these appointments are related parts of a wider corporate reset, but the leadership announcement itself did not assign Roh responsibility for the foundry business or state that the appointments would directly resolve chip-manufacturing issues.
How AI is changing manufacturing as well as products
Samsung’s October 2025 AI Megafactory announcement with NVIDIA showed that its AI push extends beyond chips and devices. The proposed project covers semiconductor, mobile-device and robotics manufacturing. Samsung said it would deploy more than 50,000 NVIDIA GPUs and use AI to analyze and optimize design, process, equipment, operations and quality control in real time.
The initiative signals an effort to apply AI across factory workflows, not just to sell AI-related products. The announcement describes a planned deployment; it does not establish that all the GPUs are already installed or that the promised operational improvements have been measured.
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Where Samsung is directing capital and partnerships
Samsung’s March 2026 plan allocates more than KRW 110 trillion to facilities and research and development in 2026. This is a company plan for one year, not a recurring annual commitment. Samsung also cautioned that the plan’s forecasts and future plans may change.
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- Broadcom: In July 2026, Samsung and Broadcom signed a memorandum of understanding spanning memory, foundry and advanced packaging. The companies estimated the collaboration’s value at more than $200 billion over five years through 2030. That is their estimate of the MOU’s scope, not a statement of completed sales or guaranteed revenue.
- ASML: In September 2026, Samsung agreed to join a 12-inch photomask initiative and collaborate with ASML on High-NA EUV for future DRAM and advanced semiconductor manufacturing. The work concerns future process technology and equipment, so it reflects a long-cycle investment rather than an immediate production result.
Why compensation has become part of the story
A Reuters-based report by Tom’s Hardware, citing internal Samsung negotiation documents in 2026, said memory employees were offered a proposed bonus equal to 607% of annual salary, compared with 50% to 100% for foundry and System LSI staff. These are reported figures from negotiation documents, not an audited Samsung disclosure or a confirmed company-wide bonus policy.
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The reported gap helps explain why balancing the businesses is also a workforce issue. Employees in a more profitable memory operation may see substantially different proposed rewards from colleagues in logic-chip divisions under financial pressure. Such differences can add to labor tension and make it harder to retain talent across businesses that Samsung wants to coordinate more closely.
What the reorganization needs to accomplish
- Make the memory, foundry and advanced-packaging combination useful to AI-chip customers.
- Improve advanced-node yields and the profitability of foundry and System LSI operations.
- Build HBM competitiveness while extending AI into factory operations and growth businesses.
- Turn high capital spending and long-term technology partnerships into products and manufacturing capabilities.
Samsung’s reorganization is best understood as an effort to reposition the company for AI-era semiconductor demand while confronting uneven execution across its chip businesses. The leadership changes are one part of that effort; the harder test is whether investment, manufacturing improvements and coordination across divisions translate into competitive products and better operating results.
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