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FIB-X is a Plano, Texas, laboratory that provides focused-ion-beam (FIB) services, especially for semiconductor design modification, circuit debugging and cross-section analysis. Microtech Analytical Labs spun out its FIB services unit in 2004 to establish FIB-X as a standalone lab for chip makers; the company’s About page says it was established in 2003. Its published services also extend to scanning electron microscopy (SEM), elemental analysis and digital-rock imaging.
Why was FIB-X formed?
Microtech Analytical Labs Inc. (MAL), a failure-analysis laboratory founded by former Texas Instruments employees, separated its FIB services unit into FIB-X LLC in 2004. An EDN report published October 7, 2004 says the transaction took place the previous month and describes the new company as an independent FIB laboratory serving chip makers.
MAL already had FIB capabilities as part of its broader failure-analysis work. The separation created a business focused specifically on FIB services. EDN quoted business manager Jason Parker saying the aim was to debug first silicon and help customers shorten time to market. The report also explained that modifying a design before fabricating new material can help teams validate changes and avoid repeated photomask revisions.
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Clear out junk files and repair common Windows errorsFree Scan →Fix the driver behind crashes, sound loss and screen glitchesFind Drivers →There is a small date discrepancy in the public history: EDN reports the 2004 spinout, while FIB-X’s About page says the company was established in 2003. Those statements may reflect different milestones, but the available accounts do not explain the difference.
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What does FIB-X do?
FIB-X describes its work as specialized laboratory services rather than a general-purpose chip-manufacturing operation. Focused-ion-beam tools can remove or deposit material at small, targeted locations; paired with SEM imaging and other analysis, that lets engineers modify a device, expose a feature or investigate a defect. The company’s services page describes these applications:
- IC design verification and circuit modification: Make changes to an integrated circuit before committing to a new mask spin or fabricating new material, allowing a team to assess a proposed design change on an existing device.
- Debugging buried connections: Install FIB probe pads to access buried nets or metal lines that are too small for a conventional probe tip.
- Site-specific cross-sections: Cut through a selected area to inspect vias and process defects. FIB-X says it can use Bruker Quantax 200 energy-dispersive X-ray spectroscopy (EDS) to analyze contaminants.
- Decapsulation and encapsulation: Open a packaged device for modification or debugging, then encapsulate it again or provide a temporary lid for handling.
- Custom applications: Discuss whether an unusual FIB task is feasible, along with its likely schedule and cost. The company does not publish a standard price list or turnaround time on the cited pages.
What are FIB-X’s semiconductor, failure-analysis and digital-rock services?
Semiconductor design, circuit edit and debug
For semiconductor teams, the central use case is changing or probing an existing device so engineers can evaluate a design or diagnose a problem without first making a new mask set. The company describes design verification, circuit modification and probe-pad installation for buried connections. That makes the service relevant to design, process and failure-analysis teams with a specific device and question to investigate.
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Cross-section and contaminant analysis
A targeted cross-section can expose a via, interface or suspected defect for examination. FIB-X describes pairing this preparation with SEM imaging and EDS elemental analysis, including contaminant identification with its Bruker Quantax 200 system. EDS can help identify elements in a sampled area; it does not, by itself, establish the cause of a failure.
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FIB-X also markets high-resolution backscattered-electron (BSE) SEM MAPS imaging and EDS for unconventional-reservoir and shale samples. Its stated applications include examining pore systems and clay characteristics over large areas. This work broadens the lab’s scope beyond semiconductor devices to geological samples and materials questions.
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What equipment and capabilities does FIB-X list?
FIB-X’s About page names several systems and capabilities. These are the company’s published equipment descriptions, not an independent performance evaluation; confirm current availability and suitability with the lab before planning a project.
| System | Published use or capability |
|---|---|
| FEI Thermo Fisher Helios 660 G3 | FIB work with MAPS mosaic stitching and Auto Slice & View 3D tomography software. FIB-X lists a 1 kV resolution of 0.9 nm and backscatter, secondary-electron and X-ray acquisition detectors. |
| FEI Teneo SEM | Imaging difficult geological, biological, magnetic and non-conductive samples. FIB-X lists a 1 kV resolution of 1.4 nm using the backscatter detector. |
| FEI DB235 Dual Beam | Ion-beam cutting and SEM imaging in one system under vacuum, paired with Bruker Quantax 200 EDS for contaminant identification. The listed capabilities include platinum deposition and gas-assisted etching. |
| Two DCG P3X systems | Circuit modification. FIB-X says they support 45 nm copper top-down edits through gold GaAs devices, resolution below 5 nm, CAD navigation, platinum deposition, gas-assisted etching, SiO2 deposition, copper etching and 8-inch wafers. |
| Fischione Model 1060 SEM mill | Geological and semiconductor sample preparation using two adjustable-beam ion sources. |
The 2004 EDN article names older NPTest P3X and P2X tools and gives historical specifications for an OptiFIB, including 3-to-5-nm FIB resolution and beam-placement accuracy below 0.1 micron at 100 nm. Those figures belong to the equipment description in that 2004 report; they should not be treated as guaranteed current specifications for FIB-X’s present systems.
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Can a company outsource FIB work instead of buying a FIB lab?
Yes. FIB-X’s service model gives organizations a way to request specialist preparation, modification or analysis without maintaining the equipment and expertise in-house. That can suit teams with occasional projects, a need for a particular analytical combination, or a temporary capacity gap. The historical rationale for the spinout was to support chip makers’ debugging and design-change work, including validation before another mask revision.
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How can you evaluate FIB-X for a project?
Match the lab’s stated services to the question you need answered, then confirm details that matter for your sample and workflow. Useful points to discuss include:
- Application: Whether the job is circuit edit, buried-net debug, semiconductor cross-sectioning, digital-rock imaging or a custom task.
- Analytical combination: Whether the work needs FIB preparation, SEM imaging, EDS, 3D tomography, probe-pad installation or device decapsulation.
- Sample handling: Device packaging, wafer size and any need for encapsulation or a temporary lid.
- Specifications: Which current instrument and method will be used, and whether a published resolution or other figure applies to the requested sample and conditions.
- Commercial and project terms: Quote, schedule, data and sample deliverables, confidentiality and arrangements for repeat work.
For a basic business-identity cross-check, HigherGov lists FIB-X Services LLC, doing business as FIB-X, in Plano, Texas, under NAICS 541330, Engineering Services. That third-party listing is useful for identification, but it is not a substitute for a current company statement or contract documentation.
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Product prices and availability are accurate as of the date/time indicated and are subject to change. Any price and availability information displayed on Amazon at the time of purchase will apply.
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