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A dual in-line package (DIP) is an integrated-circuit package with a rectangular body and two parallel rows of pins, one row along each of two opposite sides. The pins are commonly inserted through holes in a circuit board, or the chip can be fitted into a compatible socket. “DIP” describes the component’s physical package, not what the chip does.
How to recognize a DIP
Look for an elongated rectangular body with leads extending from both long sides. Together, the leads form two parallel rows. Analog Devices defines a DIP by those two rows of pins, while NXP describes the rectangular body and through-hole leads in more detail. Analog Devices’ DIP glossary and NXP’s package overview use this defining arrangement.
The term is sometimes written “dual in-line” or “dual inline.” “DIL” is another name for the dual in-line arrangement. A related but different form is SIP, or single in-line package, which has one row of connection pins rather than two.
How a DIP connects to a circuit board
DIP pins commonly pass through matching holes in a printed circuit board and are soldered in place. A DIP can also plug into a socket mounted on the board, allowing the chip to be removed without desoldering it. The socket must match the chip’s pin count and physical layout; the package name alone does not establish socket compatibility. NXP lists both through-hole and socket mounting in its package overview.
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DIP dimensions vary by part
There is no single size that fits every DIP. Pin count, lead pitch (the spacing between neighboring pins), body width, and body length can differ, so use the specific component’s datasheet or package drawing to choose a board footprint or socket.
NXP’s package overview shows examples from 8 to 42 pins, pitches from 1.778 to 2.54 mm, and body widths from 6.35 to 13.97 mm. Those are the ranges in NXP’s overview, not universal limits for all DIPs. Toshiba’s listed DIP devices include 16-, 18-, and 20-pin examples with a 2.54 mm lead pitch and 6.4 mm body width; those figures describe its catalog examples, not every DIP. See Toshiba’s DIP package page for that lineup.
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Plastic and ceramic DIP variants
The package name identifies the pin arrangement, but not one required body material. Two material-related names are:
- PDIP: plastic dual in-line package, typically a molded-plastic body.
- CDIP: ceramic dual in-line package, with a ceramic body.
Analog Devices lists PDIP and CDIP as DIP variants. NXP describes its ceramic DIP variation as hermetically sealed and intended for high-reliability applications. Infineon likewise describes ceramic DIP products for uses such as radiation-hardened power ICs, high-reliability MOSFETs, and space-application memories. These are examples of applications, not a guarantee that every ceramic DIP has the same qualification or suitability; check the individual part’s documentation. See Infineon’s C-DIP information.
NXP also describes shrink plastic DIP as smaller than DIP for the same lead count. Because package dimensions vary, confirm the exact drawing rather than relying on the variant name alone.
Independent reader supportYour contribution helps us test, update, and keep practical guides available for everyone.Where DIPs are used—and why they remain familiar
NXP lists standard logic ICs, memory LSIs, electromechanical relays, LED segment displays, ribbon connectors, and low-power electronics among DIP applications. Its overview characterizes DIP as a mature package that can offer an inexpensive circuit-design solution; that does not make it the best choice for every design.
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DIP was a mainstay of IC packaging for many years beginning in the 1960s. The Semiconductor Industry Association’s packaging-history paper describes surface-mount packaging as one response to the need to use board space more effectively. DIPs remain recognizable and are still present in NXP’s package portfolio, but the choice between a through-hole package and a surface-mount design depends on the board and application. The Semiconductor Industry Association’s packaging-history paper provides the historical context.
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What to check before choosing a DIP or socket
- Mounting: Confirm whether the board uses through-hole soldering or a socket.
- Pin count and pitch: Match the part’s leads to the board footprint or socket.
- Body dimensions: Check width and length against the package drawing, especially when replacing a part.
- Material and application requirements: Check the component documentation for the body type and any stated reliability or environmental qualifications.
- Board space: Consider whether the DIP’s footprint suits the design; surface-mount packaging can make more efficient use of board area.
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