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VIS and NXP’s Singapore joint venture, VisionPower Semiconductor Manufacturing Company (VSMC), held the grand opening of its first 300mm wafer fab in Tampines on September 28, 2026. The facility is designed to make specialty analog, mixed-signal and power chips. The opening is a major construction milestone, but it does not mean the fab is already at full production: VSMC’s latest stated target is capacity of 44,000 12-inch wafers per month by 2029.
What VIS and NXP are building
VSMC is a Singapore-based joint venture created by Taiwan-based Vanguard International Semiconductor Corporation (VIS) and Dutch semiconductor company NXP. It is building and operating a 300mm, or 12-inch, wafer fab in Tampines, Singapore. A wafer fab processes silicon wafers into integrated circuits; the chips are then prepared for use in products such as vehicles, industrial equipment and consumer devices.
The partners intend VSMC to operate as an independent commercial foundry, making specialty chips for customers rather than serving only its owners. VIS operates the fab. The venture also gives each partner access to capacity in proportion to its ownership; NXP has said it is entitled to 40% of fab capacity.
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Who owns the fab and how it is funded
VIS owns 60% of VSMC and NXP owns 40%. The approximately $7.8 billion figure announced in June 2024 refers to the initial build-out, not a separately stated final cost for every later expansion.
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| Funding item | Amount and qualification |
|---|---|
| VIS planned investment | $2.4 billion, as announced in June 2024 |
| NXP planned investment | $1.6 billion, as announced in June 2024 |
| Additional partner contribution | $1.9 billion combined for long-term capacity infrastructure, according to the June 2024 announcement |
| Other funding | The remaining funding was to come from third parties, including loans; the announcement did not give a separate amount for each source |
The partners describe the arrangement as part of NXP’s hybrid manufacturing strategy and a way to broaden geographic supply resilience. That rationale does not establish how much production any particular customer will receive beyond the stated capacity entitlement.
What chips and technologies the fab is intended to support
The June 2024 plan covered analog, mixed-signal and power-management technologies in the 130nm-to-40nm range. Those process technologies are aimed at products for automotive, industrial, consumer and mobile markets. The original plan said underlying process technology would be licensed and transferred from TSMC.
In its September 2026 opening announcement, VSMC described its specialty foundry services as covering mixed-signal, power, analog and interposer technologies, with applications also including high-performance computing. The announcement describes the fab’s service scope; it does not establish that every listed process or application is already in volume production.
When production is expected, and what capacity figures mean
The original June 2024 announcement targeted customer production in 2027. VSMC’s September 2026 grand-opening release did not give a revised date for the start of customer production. Therefore, 2027 should be read as the original target, not as a newly confirmed production schedule. A grand opening marks the facility’s opening ceremony; by itself, it does not confirm that production has begun or that planned capacity is online.
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| Announcement | Stated monthly capacity | How to interpret it |
|---|---|---|
| June 2024 plan; repeated at the December 2024 groundbreaking | 55,000 300mm wafers per month in 2029 | Earlier project forecast |
| September 28, 2026 grand-opening release | 44,000 12-inch wafers per month by 2029 | Latest official forecast; not a claim that this capacity is already operating |
The 44,000 and 55,000 figures are forecasts from different project updates, not a single capacity figure and not evidence of current monthly output. The latest official target is 44,000 wafers per month by 2029.
Independent reader supportYour contribution helps us test, update, and keep practical guides available for everyone.Project milestones and Singapore plans
- June 5, 2024: VIS and NXP announced the planned joint venture and fab. Construction was expected to begin in the second half of 2024, subject to regulatory approvals.
- September 4, 2024: The companies said approvals had been obtained, capital injected and VSMC formally established.
- December 4, 2024: VSMC held its groundbreaking in Tampines. At that time, the company said the project remained on track for initial production in 2027.
- September 28, 2026: VSMC held the grand opening of its first 12-inch fab.
The original 2024 announcement projected approximately 1,500 Singapore jobs. That is a project estimate, not a count of people currently employed at the facility. In its 2026 opening release, VSMC said it had signed memoranda of understanding with Singapore universities and was developing internship and professional-training programs to build semiconductor talent.
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Automation and sustainability measures
At the December 2024 groundbreaking, VSMC described plans for fully automated production using an Automated Material Handling System and AI applications for quality management. The company also described Singapore Green Mark construction, energy-efficient cooling and lighting, process-water recycling and eco-friendly materials. These are the company’s stated design and operating measures, not independent assessments of the fab’s environmental performance.
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