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In July 2001, Tokyo Electron (TEL) and WaferMasters announced plans to develop a 300-mm single-wafer rapid thermal furnace (SRTF) that would pair single-wafer process flexibility with the productivity of a batch furnace. The announced design was specified at less than 3.5 kW per chamber and described as using roughly one-tenth the power of then-current single-wafer rapid thermal processing (RTP) tools. WaferMasters later received exclusive rights to manufacture and sell SRTF technology after TEL left the single-wafer thermal-process business.
What TEL and WaferMasters announced in 2001
EE Times reported on July 17, 2001, that TEL and San Jose-based WaferMasters planned to co-develop a single-wafer thermal processor for 300-mm semiconductor fabs. The project was based on WaferMasters technology and was presented as a hybrid: batch-furnace-like productivity and repeatability, with the process flexibility of a single-wafer RTP tool.
A contemporaneous account of the companies’ announcement described the system as a 300-mm version of WaferMasters’ existing 200-mm SRTF platform. It gave an operating range of 200–1150 °C and said the furnace could operate at low or atmospheric pressure. The partners expected a pilot version within months and planned product shipments for 2002. Those were targets announced at the time, not confirmation that shipments later occurred.
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The 2001 company release specified less than 3.5 kW per chamber at 1150 °C. EE Times characterized that as roughly one-tenth the power consumption of then-current single-wafer RTP tools. That comparison is a period-specific claim: the published account does not identify a particular competing model, test setup, or measurement method. It should not be read as a verified comparison with current equipment, nor as evidence of total fab energy use.
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The figure is chamber power, not a complete facility-power budget. It does not establish consumption by a full production line or account for associated equipment and site systems. Later WaferMasters product pages list different power figures for the named SRTF models, so the 2001 design target should not be substituted for a specification of every SRTF version.
What processes the SRTF was intended to run
The reported process window covered thermal steps used in semiconductor manufacturing and related thin-film work, rather than general-purpose heating. The announcement and later WaferMasters product descriptions list:
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- Dry and wet oxidation.
- Thin-film formation, glass densification, and glass reflow.
These are application families cited for the platform. The pages do not establish that every listed process is qualified for every material, recipe, or production line.
What WaferMasters’ later product pages document
WaferMasters’ product pages, accessed in 2026, describe the SRTF-201LP and SRTF-302LP. The figures below are manufacturer-published specifications, not independent test results. The 201LP page presents its capabilities up to 1150 °C; the 302LP page lists operation up to 1100 °C.
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| Published detail | SRTF-201LP | SRTF-302LP |
|---|---|---|
| Temperature capability | Up to 1150 °C | Up to 1100 °C |
| Chamber power | Less than 5 kW; temperature condition not stated on the page | Less than 10 kW at 1100 °C |
| Ramp rate | Up to 150 °C/s at 1100 °C | Up to 100 °C/s at 1100 °C |
| Uniformity and repeatability | Process uniformity below 1% (1 sigma); repeatability below 3 °C | Not stated on the page |
| Throughput | Approximately 40 wafers per hour for a 60-second process | Not stated on the page |
| Load and ambient features | Not stated on the page | Two vacuum-capable load locks, two built-in FOUP openers, and oxygen-free ambient below 30 ppm |
The 201LP page describes a resistively heated single-wafer furnace for conventional batch-furnace thermal applications and RTP applications. The 302LP page documents a 300-mm model with fab-facing wafer handling features. The pages do not, by themselves, show how many systems were installed or establish that the 2001 shipment target was met.
Independent reader supportYour contribution helps us test, update, and keep practical guides available for everyone.Who held the SRTF rights after TEL exited
In March 2005, EDN reported that TEL relinquished all SRTF intellectual-property rights to WaferMasters. WaferMasters received exclusive rights to manufacture and sell the SRTF technology and platforms. TEL said it was exiting the single-wafer thermal-process business; the companies also discussed a customer-service and support agreement for existing SRTF customers.
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The available reporting establishes the rights transfer and TEL’s exit, but does not quantify the installed base or establish the scale of subsequent commercial shipments. The 2002 shipment date therefore remains an original plan, not a documented outcome in these accounts.
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