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On October 12, 2004, Spansion announced that Fab 25, its Austin, Texas, flagship, was dedicated to producing 110-nanometer floating-gate flash memory. That announcement described a manufacturing focus at the time—not the facility’s present-day use or status.

What changed at Fab 25?

Fab 25 was already part of Spansion’s flash-memory manufacturing operation. The October 2004 announcement marked a production transition to 110-nanometer floating-gate flash memory. Spansion executive Jim Doran said the transition was completed “in just a few months,” with minimal impact on output and yields better than anticipated. Those yield and output statements were Spansion’s account, not an independent measurement.

Fab 25 was a substantial wafer-fabrication facility. AMD’s 2005 annual filing, filed in 2006, describes it as a 200-millimeter wafer facility with about 120,000 square feet of clean-room space and 110-nanometer production technology. AMD’s 2005 Form 10-K provides that facility detail.

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How did Spansion and Fab 25 come together?

AMD and Fujitsu formed Spansion in 2003. AMD contributed its flash-memory group and Fab 25 in Austin to the venture, so Fab 25 was described as Spansion’s facility in the 2004 announcement. The formation and contribution are documented in AMD’s 2003 Form 10-K.

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Was Fab 25 working only on 110-nm flash?

No. The 110-nanometer announcement concerned floating-gate flash production. Separately, AMD’s 2004 annual filing said Fab 25 was making 90-nanometer MirrorBit development wafers, with production planned for the second half of 2005. Development wafers and planned production are not the same status as an announced production focus.

Development or production Technology Status reported at the time
110 nm Floating-gate flash Spansion announced Fab 25’s production dedication in October 2004.
90 nm MirrorBit Fab 25 was making development wafers; AMD planned production for the second half of 2005, according to its 2004 Form 10-K.

AMD later reported that 110-nanometer floating-gate and MirrorBit technologies were deployed in production at both Fab 25 and JV3 during 2005. That follow-up describes a broader manufacturing portfolio, not a change to what Spansion announced in October 2004. See AMD’s 2005 Form 10-K.

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What the announcement does—and does not—tell us

  • It identifies Fab 25 in Austin as a production site dedicated to 110-nanometer floating-gate flash in October 2004.
  • It does not establish that all work at the facility was confined to that process node; AMD separately documented 90-nanometer MirrorBit development there.
  • It does not establish Fab 25’s current operating status or current use. The cited company filings and announcement cover the 2003–2005 period.
  • Spansion described Fab 25 as a model for yield and advanced manufacturing, but that was the company’s characterization rather than independent yield verification.

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