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Neither chipset wins every benchmark in the available comparison. 91mobiles reports a higher Dimensity 6360 Max score in Geekbench single-core and AnTuTu, while the Snapdragon 778G Plus leads in Geekbench multi-core. Those figures are snapshots, not a controlled head-to-head test—and the comparison page gives two different AnTuTu totals for the Snapdragon chip.
How the benchmark results compare
The figures below are reported by 91mobiles, accessed in 2026. They are not measurements made in a controlled test for this article, and the page does not establish a common phone, test setup, or conditions. Treat them as indicative comparisons, not guaranteed results for a phone you buy.
| Benchmark | Snapdragon 778G Plus | Dimensity 6360 Max | What the result suggests |
|---|---|---|---|
| Geekbench single-core | 732 | 784 | Dimensity 6360 Max scores higher in this reported result. |
| Geekbench multi-core | 2,486 | 2,042 | Snapdragon 778G Plus scores higher in this reported result. |
| AnTuTu summary | 596,815 | 651,333 | Dimensity 6360 Max scores higher in the summary. |
| AnTuTu detailed panel | 541,618 | 651,333 | The Snapdragon figure conflicts with the same page’s summary; no single Snapdragon AnTuTu result should be treated as definitive. |
What the split means
Single-core results can offer one clue about workloads that rely on a small number of cores; multi-core results can offer a clue about work that uses several cores at once. Neither score directly predicts how fast a particular phone will feel. AnTuTu combines multiple kinds of performance into an overall score, but the conflicting Snapdragon values make this page especially unsuitable as a precise ranking.
Specifications at a glance
The CPU and many chipset comparisons below are listed by 91mobiles. MediaTek’s official Dimensity 6360 product page describes the base 6360, not specifically the Max variant. MediaTek’s Dimensity 6000 family page confirms Dimensity 6360 Max as a product name but does not provide Max-specific technical specifications. Accordingly, base-chip details should not be read as verified Max specifications.
#1 Best Overall
- [Qualcomm QCS6490 flagship core support] Rubik Pi 3 SBC as the first AI development board equipped with 6nm qua-lcomm QCS6490, achieves intelligent computing power scheduling with triple-cluster CPU architecture (1×2.7GHz + 3×2.4GHz + 4×1.9GHz). Coupled with a 12TOPS NPU, it delivers 300% higher performance than Rasp berry Pi 5. The edge-optimized hardware design supports one-click TensorFlow/PyTorch model deployment, eliminating developers' computing power constraints.
- [Fast Response, Stable and Durable] Rubik Pi 3 Single Board Computer is equipped with 8GB of LPDDR4x memory, which significantly improves the efficiency of multitasking and AI computing; and 128GB of UFS 2.2 flash memory, with a measured sequential read speed of 1,050MB/s and a write speed of 240MB/s, which is a performance increase of more than 300% compared to the traditional SD card solution. This configuration is perfectly adapted to edge computing, robot control and other high-intensity application scenarios, and fully meets the dual needs of developers for storage performance and reliability.
- [Multi-OS Development Platform] The RUBIK Pi 3 Single Board Computer supports multiple operating systems including qua-lcomm Open Source Linux, Android, Ubuntu for qua-lcomm IoT platforms, and Debian 12. Featuring a compact 100×75mm lightweight design, it streamlines both prototyping and mass production workflows.
- [Industrial Grade Multimedia Processor] The RUBIK Pi 3 AI development board is capable of hardware-accelerated 4K60 H.264/H.265/VP9 decoding and 4K30 encoding.The Spectra 570 ISP supports advanced imaging configurations including a single 64-megapixel or three 22-megapixel cameras, while the 12TOPS NPU enables real-time AI processing.
- [8-core open-source development board] RUBIK Pi 3 development board features one 2.7 GHz qua-l-comm Kryo 670 Gold Plus CPU core, three 2.4 GHz qua-l-comm Kryo 670 Gold CPU cores and four 1.9 GHz qua-l-comm Kryo 670 Silver CPU cores, which is actually a qua-lcomms upgrades for the Cortex-A78 and Cortex-A55.
| Specification | Snapdragon 778G Plus | Dimensity 6360 Max |
|---|---|---|
| CPU configuration | 1 Cortex-A78 up to 2.5 GHz, 3 Cortex-A78 up to 2.4 GHz, and 4 Cortex-A55 up to 1.8 GHz (91mobiles) | 2 Cortex-A76 up to 2.4 GHz and 6 Cortex-A55 up to 2.0 GHz (91mobiles) |
| Manufacturing process | 6 nm (91mobiles) | 6 nm (91mobiles) |
| Graphics | Adreno 642 (91mobiles) | Mali-G57 MC2 (91mobiles; also specified for base Dimensity 6360 by MediaTek) |
| Memory and storage support | LPDDR5 and UFS 3.1 (91mobiles) | LPDDR4X and UFS 2.2 (91mobiles; base Dimensity 6360 support is confirmed by MediaTek) |
| Display support | Up to FHD+ at 144 Hz (91mobiles) | Up to FHD+ at 120 Hz (91mobiles); MediaTek specifies up to 120 Hz for base Dimensity 6360 |
| Peak 5G download rate | Up to 3.7 Gb/s (91mobiles) | Up to 3.3 Gb/s (91mobiles); MediaTek also states up to 3.3 Gb/s for base Dimensity 6360 |
These are reported capability figures, not promises about a retail handset. A manufacturer may implement fewer features, and actual cellular throughput depends on factors including supported bands, network conditions, and the carrier. Qualcomm’s October 2021 announcement describes Snapdragon 778G Plus as a follow-on to Snapdragon 778G with boosted CPU and GPU performance; that is the manufacturer’s positioning, not independent testing. Qualcomm’s official page retrieved for the related base Snapdragon 778G specifies Adreno 642L, so it should not be substituted for the Adreno 642 listed for the Plus variant by 91mobiles.
Which chip is likely to suit your workload?
Everyday use and bursty tasks
The Dimensity 6360 Max has the higher reported Geekbench single-core score, 784 versus 732. That is one synthetic indicator, not a reliable promise of faster app launches or smoother everyday use. Software, storage, memory capacity, and the phone maker’s tuning can change the experience.
Rank #2
- [Qualcomm QCS6490 flagship core support] Rubik Pi 3 SBC as the first AI development board equipped with 6nm qua-lcomm QCS6490, achieves intelligent computing power scheduling with triple-cluster CPU architecture (1×2.7GHz + 3×2.4GHz + 4×1.9GHz). Coupled with a 12TOPS NPU, it delivers 300% higher performance than Rasp berry Pi 5. The edge-optimized hardware design supports one-click TensorFlow/PyTorch model deployment, eliminating developers' computing power constraints.
- [Fast Response, Stable and Durable] Rubik Pi 3 Single Board Computer is equipped with 8GB of LPDDR4x memory, which significantly improves the efficiency of multitasking and AI computing; and 128GB of UFS 2.2 flash memory, with a measured sequential read speed of 1,050MB/s and a write speed of 240MB/s, which is a performance increase of more than 300% compared to the traditional SD card solution. This configuration is perfectly adapted to edge computing, robot control and other high-intensity application scenarios, and fully meets the dual needs of developers for storage performance and reliability.
- [Multi-OS Development Platform] The RUBIK Pi 3 Single Board Computer supports multiple operating systems including qua-lcomm Open Source Linux, Android, Ubuntu for qua-lcomm IoT platforms, and Debian 12. Featuring a compact 100×75mm lightweight design, it streamlines both prototyping and mass production workflows.
- [Industrial Grade Multimedia Processor] The RUBIK Pi 3 AI development board is capable of hardware-accelerated 4K60 H.264/H.265/VP9 decoding and 4K30 encoding.The Spectra 570 ISP supports advanced imaging configurations including a single 64-megapixel or three 22-megapixel cameras, while the 12TOPS NPU enables real-time AI processing.
- [8-core open-source development board] RUBIK Pi 3 development board features one 2.7 GHz qua-l-comm Kryo 670 Gold Plus CPU core, three 2.4 GHz qua-l-comm Kryo 670 Gold CPU cores and four 1.9 GHz qua-l-comm Kryo 670 Silver CPU cores, which is actually a qua-lcomms upgrades for the Cortex-A78 and Cortex-A55.
Tasks that use several CPU cores
The Snapdragon 778G Plus has the higher reported Geekbench multi-core score, 2,486 versus 2,042. This points in its favor in that particular comparison, but does not establish how either chip will perform in a sustained workload on a specific handset.
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The comparison lists Adreno 642 for Snapdragon 778G Plus and Mali-G57 MC2 for Dimensity 6360 Max. The available figures do not establish game frame rates, sustained performance, or thermal behavior. Phone cooling, firmware, game settings, and the specific game matter; a GPU name or aggregate benchmark alone cannot settle the gaming comparison.
Rank #3
- ESP32-C6 GEEK Development Board,Suitable for creative WF 6 and BT applications based on ESP32-C6.
- Integrated LCD display, TF card slot, BOOT button and other peripheral interfaces.
- Adopts high-performance 32-bit RISC-V processor, up to 160MHz main frequency.
- Onboard 3PIN UART header, 3PIN GPIO header and 4PIN I2C header.
- Equipped with plastic case and cables.
What to check in the actual phone
For a purchase decision, compare complete handset specifications rather than choosing by chipset name alone. The same processor can behave differently across phones because of design and software choices.
- Memory and storage: Check installed RAM and storage capacity, not just the memory and storage standards a chip may support.
- Screen: Confirm the phone’s actual resolution and refresh rate. A chipset’s stated display ceiling does not mean every phone uses it.
- 5G compatibility: Check the handset’s supported bands for your region and carrier. A peak theoretical download rate is not a real-world speed guarantee.
- Cooling and sustained use: Look for device-specific gaming or long-load testing if sustained performance matters; the comparison scores here do not provide that evidence.
- Software and firmware: Updates and manufacturer tuning can affect responsiveness and benchmark behavior.
91mobiles lists the OPPO F33 Pro 5G as an example of a Dimensity 6360 Max phone and lists several Snapdragon 778G Plus models. Those examples are not a controlled comparison, so they do not show how the chips perform under equivalent device conditions.
Rank #4
- Product advantages:Core board module programming development board's the speed of developing product prototypes is faster, the program is easier to achieve modularity, and maintenance is more convenient
- More suitable for beginners:Programming development board does not require complicated settings, installation of special software and additional hardware, or compilation and downloading. Programming in any text editor via a USB
- Most of the hardware functions:Core board module programming development board can be driven by a single command, and can be developed quickly without understanding the underlying hardware. Very good for product prototyping and software migration, making the development process easy and full of fun
- Programming development board includes 4 LEDs on the for pyboard, the USR button, the reset button and the booto button, that can indicate and use to interact with the system, built-in USB, with flash and reset switches, easy to program
- Applicable users:Core board module programming development board is a program development learning tool for makers, DIY enthusiasts, and engineers
Bottom line
The available scores show a split: Dimensity 6360 Max leads in the listed single-core and AnTuTu results, while Snapdragon 778G Plus leads in multi-core Geekbench. Because the AnTuTu Snapdragon result conflicts within the source and the comparison lacks controlled test details, use these figures as rough context. For a real buying decision, prioritize reliable tests of the specific phones you are considering and compare their actual screens, memory, storage, network support, and cooling.
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Quick Recap
Best Value
- UNLEASH 12 TOPS AI POWER: Powered by the advanced Qualcomm QCS6490 chipset, this development board delivers a staggering 12 TOPS of AI computing performance. Perfect for demanding edge AI, machine learning, and computer vision projects, ensuring lightning-fast processing and real-time analytics.
- MASSIVE MEMORY & STORAGE: Equipped with 8GB of high-speed RAM and 128GB of ultra-fast UFS storage. Experience seamless multitasking, rapid data access, and ample space for your complex algorithms, large datasets, and heavy-duty applications without any bottlenecks.
- SEAMLESS CONNECTIVITY & I/O: Stay connected with robust Wi-Fi 5 and Bluetooth 5.2 capabilities. Features versatile I/O options including HDMI for high-res displays and USB 3.1 for ultra-fast data transfer, making it the ultimate hub for your IoT ecosystem.
- MULTI-OS FLEXIBILITY: Designed for true developers, this board offers comprehensive Multi-OS support. Whether you prefer the versatility of Android or the robust control of Linux, seamlessly switch and deploy the environment that best suits your project needs.
- 🛠️ THE ULTIMATE IOT & AI CATALYST: Transform your ideas into reality. From smart home automation and industrial robotics to advanced AI prototyping, this board provides the enterprise-grade reliability and cutting-edge specs required to build the future of technology.
Product prices and availability are accurate as of the date/time indicated and are subject to change. Any price and availability information displayed on Amazon at the time of purchase will apply.
