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Samsung announced on February 12, 2026, that it had begun mass production of HBM4 and shipped commercial products to customers. The company later said the memory was designed for NVIDIA’s Vera Rubin platform; its Q1 2026 results presentation reported mass product sales of HBM4 and SOCAMM2 for that platform. Samsung has not disclosed NVIDIA’s purchase volumes, supply terms or whether it is an exclusive or primary supplier.
What Samsung HBM4 is—and why AI systems use it
HBM4 is the fourth generation of high-bandwidth memory, a type of stacked DRAM built to move large amounts of data quickly between memory and processors. It is intended for demanding systems such as AI accelerators and data-center hardware, not as a consumer upgrade or a memory module for an ordinary PC.
For an AI accelerator, memory bandwidth affects how quickly data can be supplied to the processor. Stacking memory close to the processor also makes high-capacity, high-bandwidth designs possible within a specialized package. Samsung says HBM4 combines its sixth-generation 10-nanometer-class 1c DRAM process with a 4-nanometer logic base die.
What Samsung has said about supplying NVIDIA
Samsung’s March 17, 2026 GTC announcement described HBM4 as designed for NVIDIA’s Vera Rubin platform. Samsung’s Q1 2026 results presentation went further, saying the company had commenced mass product sales of HBM4 and SOCAMM2 for Vera Rubin. Together, those statements establish a commercial relationship around the platform, but do not identify how much HBM4 NVIDIA has bought or how orders are allocated among suppliers.
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NVIDIA has also described broader semiconductor collaboration with Samsung, including memory, custom solutions and foundry services. That supports the existence of a wider partnership, but does not independently confirm Samsung’s HBM4 performance figures.
Samsung HBM4 specifications
The figures below are Samsung’s published specifications and comparisons, not independent test results. Samsung says its product performance data come from internal testing under standard Samsung benchmarks in laboratory conditions; designs and specifications may change without notice, and actual throughput can vary.
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| Specification | Samsung’s HBM4 figure | Context |
|---|---|---|
| Interface | 2,048 pins | Samsung says this doubles the 1,024 I/O pins it cites for the previous generation. |
| Transfer speed | 11.7 Gbps consistently; up to 13 Gbps | Samsung says 11.7 Gbps is about 46% above its stated 8 Gbps industry standard. |
| Bandwidth | Up to 3.3 TB/s per stack | Samsung describes this as 2.7 times HBM3E bandwidth. |
| Capacity | 24 GB to 36 GB in 12-layer stacks | Samsung says future 16-layer configurations are intended to support up to 48 GB. |
| Power efficiency | 40% improvement versus HBM3E | Samsung-reported comparison. |
| Thermal performance | 10% better thermal resistance and 30% improved heat dissipation versus HBM3E | Samsung-reported comparisons. |
The 11.7 Gbps figure is Samsung’s stated consistent speed; 13 Gbps is its stated upper speed. Similarly, the 3.3 TB/s bandwidth and 48 GB capacity are maximums or planned configurations, not assurances that every HBM4 stack will deliver those values.
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Samsung’s stated HBM4 improvements center on bandwidth, capacity, and power and thermal characteristics. Its 3.3 TB/s per-stack figure is presented as 2.7 times HBM3E, while the company reports the efficiency and thermal gains shown above. The comparison is Samsung’s own; the available figures do not provide an independent, like-for-like benchmark or enough matched competitor data to rank Samsung against other memory makers.
Independent reader supportYour contribution helps us test, update, and keep practical guides available for everyone.Samsung’s HBM4E roadmap
At GTC 2026, Samsung displayed HBM4E and reported targets of 16 Gbps per pin and 4.0 TB/s bandwidth. In its February announcement, it expected HBM4E sampling in the second half of 2026 and custom HBM samples in 2027. Its Q1 results presentation likewise scheduled delivery of first HBM4E samples in H2 2026. These are company targets and timing expectations, not confirmation that samples or products have been delivered.
Samsung also forecast that its HBM sales would more than triple in 2026 compared with 2025. That is a company forecast, not a reported outcome.
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