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TSMC is expanding its U.S. plans around Phoenix, Arizona, while Samsung is building out its Central Texas program around Taylor and Austin. TSMC says it intends to invest $165 billion in the United States, adding fabs, advanced-packaging facilities and an R&D center. Samsung’s Texas program is valued at more than $37 billion and includes two logic fabs and an R&D facility. The projects add domestic capacity for advanced chips, but their announced plans and schedules are not the same as a guarantee that every chip or supply-chain step will be made in the United States.

What are TSMC and Samsung building in the United States?

The two companies are establishing different kinds of capacity in two states. TSMC’s project is centered on its Phoenix, Arizona, site and brings together logic-chip fabrication, advanced packaging and research and development. Samsung’s Central Texas plan is centered on Taylor, with an R&D facility and two planned logic fabs; it also encompasses the company’s Austin expansion.

Company and location Announced investment and scope Technology and timing disclosed
TSMC, Phoenix, Arizona TSMC’s March 4, 2025 announcement set its intended U.S. investment at $165 billion, including three additional fabs, two advanced-packaging facilities and an R&D center. Its April 8, 2024 Arizona plan had put the Phoenix site above $65 billion for three fabs. TSMC said its first Arizona fab entered volume production in late 2024. The 2024 plan had targeted 4nm production in the first half of 2025 for that fab; it said the second fab would target 2nm and 3nm processes beginning in 2028, and the third would target 2nm or more advanced processes by the end of the decade. The latter dates are announced targets, not confirmation of later production.
Samsung, Taylor and Austin, Texas Samsung’s 2025 report on 2024 activity put its Taylor campus plan at more than $37 billion. It describes a campus spanning more than 1,200 acres, with two logic fabs and an R&D facility, alongside expansion in Austin. The cited Samsung report does not give a comparable public, node-by-node production schedule for the Texas fabs.

The investments are not directly comparable measures of identical projects: TSMC’s $165 billion figure is its intended total U.S. investment after the 2025 expansion announcement, while Samsung’s more-than-$37-billion figure describes its Central Texas program. TSMC’s earlier more-than-$65-billion figure covered the three-fab Phoenix plan announced in 2024; it should not be added to the later $165-billion total.

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How much public CHIPS Act support has each company been offered?

The announced federal support differs in form. The Commerce Department’s November 15, 2024 award to TSMC provides up to $6.6 billion in direct funding and proposed loans of up to $5 billion for its three-fab Arizona plan. Samsung’s 2025 report on 2024 activity records up to $4.745 billion in direct CHIPS funding for its Texas expansion. The proposed TSMC loans are separate from direct funding and are not the same kind of award.

These figures describe company- or project-specific federal support, not the full cost of either investment. “Up to” is a maximum award amount, not a statement that all funds have already been paid out.

What chip production and jobs are the plans expected to support?

TSMC: fabrication, packaging and research

TSMC’s announced scope matters because making a chip is only one part of the supply chain. Its 2025 U.S. expansion announcement includes advanced packaging facilities as well as fabs and an R&D center. That is intended to add domestic capacity across more stages of advanced-chip production, including chips used for AI and high-performance computing.

TSMC said the 2025 expansion would support 40,000 construction jobs over four years and tens of thousands of high-tech jobs. Separately, the Commerce Department estimated about 6,000 direct manufacturing jobs and more than 20,000 unique construction jobs for the three-fab Arizona plan. These are estimates from different announcements, with different scopes and job definitions; they should not be combined as though they were one forecast.

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Samsung: logic capacity for several industries

Samsung describes its Texas expansion as capacity serving automotive, AI, consumer technology, defense and aerospace chips. Its 2025 report on 2024 activity projected up to 12,000 construction jobs and more than 3,500 direct manufacturing jobs within five years. These are company projections, not independently audited job counts.

Neither set of job estimates establishes how many positions have already been filled. Construction and direct manufacturing roles also refer to different kinds of employment.

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How to read the announced production timelines

TSMC provided node-level targets for its Arizona fabs in its April 2024 plan. That plan targeted 4nm production for the first fab in the first half of 2025, 2nm and 3nm production at the second fab beginning in 2028, and 2nm or more advanced processes at the third fab by the end of the decade. TSMC subsequently said its first Arizona fab had entered volume production in late 2024. The earlier first-fab target is therefore a past target, while the second- and third-fab dates remain forward-looking schedules in the cited plan.

Samsung’s cited report identifies two planned Taylor logic fabs but does not provide equivalent process-node milestones. That difference in disclosure does not establish that one company’s chips will be more capable, cheaper or more profitable than the other’s. The cited materials do not provide a like-for-like comparison of production yields, costs or commercial profitability.

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Will the United States make advanced AI chips domestically?

The plans aim to make more advanced-chip manufacturing capacity available in the United States. TSMC’s roadmap includes leading-edge logic processes and advanced packaging, while Samsung’s Texas program adds logic-fab capacity. This can localize portions of the supply chain for AI, high-performance computing, 5G and 6G, automotive, defense and consumer electronics.

It does not mean that the United States will make every chip used in AI systems, or every component and production input those chips require. Nor do facility announcements alone establish how much output will be available to particular customers. TSMC has specifically described AI as a driver of demand; Samsung has listed AI among several markets its Texas expansion is intended to serve.

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