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Rohm and Haas Electronic Materials announced in August 2005 that it would invest $50 million in a combined chemical mechanical planarization (CMP) pad manufacturing plant and technology center at the Chunan Science Park satellite campus of Taiwan’s Hsinchu Science Park. The 45,000-square-foot facility was designed to make advanced polishing pads, with commercial production initially expected in early 2007.

What Rohm and Haas planned to build

The project combined production with technical and customer-facing operations. The planned 45,000-square-foot facility was intended to manufacture next-generation IC1000 polishing pads and house an applications laboratory, sales offices, and customer-support offices. It was a CMP pad project; the available announcements describe pad manufacturing, not slurry production. EDN’s 2005 report and Evertiq’s 2005 report describe the facility and its planned functions.

Where it was and why Taiwan

The facility was announced for the Chunan Science Park satellite campus of Hsinchu Science Park, placing manufacturing and applications support near Taiwan’s semiconductor customers. Rohm and Haas framed the location as a way to serve its Asia-based business more directly as customers developed advanced 300 mm fabs. The company described it as its first major Asian CMP-pad investment outside Japan.

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Nick Gutwein, then president and CEO of Rohm and Haas CMP Technologies, explained the choice: “With the majority of our business currently based in Asia, Taiwan makes the ideal location for our significant investment in this multi-purpose plant and technical center.” Evertiq reported the statement in 2005. A Taiwanese report also quoted Gutwein describing the planned IC1000 production, applications laboratory, sales, and customer support. CTIMES, 2005.

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Investment, capacity focus, and schedule

Project detail What was announced
Investment $50 million, announced in August 2005 for the combined manufacturing and technology center.
Facility size 45,000 square feet, as described in EDN’s 2005 report.
Product Next-generation IC1000 CMP polishing pads; the announcement did not describe slurry manufacturing.
Wafer formats The company said the plant was designed for phased expansion to meet Asian demand for 200 mm and 300 mm polishing pads.
Initial schedule Commercial production was expected in the first quarter of 2007, according to Evertiq’s 2005 report.
Later operating status In July 2008, Rohm and Haas said the Hsinchu plant had been fully operating since March 2007 and had passed certification by major local logic and memory customers.
Employment forecast More than 150 people by 2010 was a forecast reported by Chemical & Engineering News in 2005, not a verified later headcount.

The 2008 company announcement confirmed that operations began earlier than the initial first-quarter 2007 commercial-production expectation: it said the plant had been fully operating since March 2007. The same announcement said the facility had passed certification by major local logic and memory customers and could expand in phases as regional demand required. Rohm and Haas announcement, July 2008.

What the announcement means in context

The investment was more than a factory announcement: production, applications engineering, and customer support were planned together at a location close to semiconductor customers. That arrangement was intended to shorten the distance between pad manufacturing and customer process needs. The documented scope is specific to CMP polishing pads and associated technical support; the cited announcements do not establish a facility for making CMP slurry or a later employment total.

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Product prices and availability are accurate as of the date/time indicated and are subject to change. Any price and availability information displayed on Amazon at the time of purchase will apply.

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