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HP’s Corvallis, Oregon, facility is slated to receive up to $53 million in federal CHIPS Act direct funding for expansion and modernization. The U.S. Department of Commerce announced the award on January 13, 2025, naming HPI Federal LLC as the recipient. The money is tied to project milestones; the announced ceiling does not establish how much has been paid.
What HP’s CHIPS Act award will fund
The project supports expansion and modernization of HP Inc.’s existing facility in Corvallis, Oregon. Commerce describes the site as part of a regional “lab-to-fab” ecosystem, linking research and development with commercial manufacturing.
The work involves silicon devices for life-sciences laboratory equipment. Potential applications include drug discovery, single-cell research and cell-line development, drawing on HP’s microfluidics and microelectromechanical systems (MEMS) expertise. The announcement does not specify a breakdown of the award by equipment, construction or individual application.
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Who receives the award, and how payment works
Commerce named HPI Federal LLC as the recipient; the project supports HP Inc.’s Corvallis facility. The announcement followed a preliminary memorandum of terms dated August 27, 2024, and the department’s due diligence. Commerce said funds would be disbursed as the recipient completes project milestones, so “up to $53 million” is an award ceiling—not confirmation that HP has already received $53 million.
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The Government Accountability Office’s December 2025 award accounting lists one HP project with $53 million in direct funding, rounded to the nearest million. GAO says its award review covers Commerce awards made from September 2024 through July 2025 and excludes amendments made after July 2025. Neither that rounded award entry nor the original announcement establishes HP’s payment total as of October 4, 2026, its current milestone status, or whether its terms changed after GAO’s reporting cutoff.
How many jobs the project is expected to support
Commerce estimated that the project would create and sustain nearly 150 construction jobs and more than 100 manufacturing jobs. These are projections in the award announcement, not a count of jobs confirmed as already created.
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How the award fits into the CHIPS program
The CHIPS Act includes funding streams beyond individual semiconductor-facility awards. The Commerce Department’s Inspector General describes $39 billion in direct assistance for semiconductor facility-related purposes, $11 billion for regional technology hubs and $10 billion for NIST research and support for small manufacturers. Those figures describe broader statutory and program funding, not the source of HP’s specific award terms.
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Repair common Windows errors and clear accumulated junk for a smoother, more stable PC - no reinstall needed.Free scan · no reinstallFor the broader program, GAO reported that Commerce had funded 49 semiconductor facilities and equipment projects as of July 15, 2026. It also reported $13.1 billion disbursed to awardees as of April 2026—about 42 percent of $31.5 billion in direct funding. These are program-wide figures and do not show HP’s share or payment status.
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What the announcement said
In the January 2025 announcement, then-Commerce Secretary Gina Raimondo said, “Companies like HP are developing the technologies that will spur unprecedented breakthroughs for generations to come.” HP President and CEO Enrique Lores said, “HP is pleased its CHIPS grant has been finalized, which will bolster semiconductor production and innovation in the United States.” Both statements were made in connection with the 2025 announcement.
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Sources
- U.S. Department of Commerce, January 13, 2025 award announcement
- U.S. Government Accountability Office, GAO-26-107882, published December 11, 2025
- U.S. Government Accountability Office, GAO-26-109121, published August 6, 2026
- Office of Inspector General, U.S. Department of Commerce, “Semiconductor Manufacturing”
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