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GigaDevice announced the GD25NX series on November 25, 2025: octal xSPI NOR Flash with a 1.8 V core and 1.2 V I/O. The lower I/O voltage lets compatible 1.2 V SoCs connect directly, without an external voltage-booster circuit. The family is offered in 64 Mb and 128 Mb densities, with octal transfer rates up to 400 MB/s, according to GigaDevice.

What the GD25NX series is

GD25NX is a family of serial NOR Flash memory devices designed for systems that need fast code or data access with low-voltage I/O. Its combination of a 1.8 V core supply and 1.2 V I/O supply is intended to match the I/O levels of 1.2 V processors and SoCs. For a compatible design, that can avoid a separate I/O voltage booster and may reduce power use and component count.

The series extends GigaDevice’s earlier 1.2 V-I/O GD25NF and GD25NE families. GigaDevice identifies wearables, data centers, edge AI and automotive electronics as target applications; its broader octal NOR materials also name AI/ML systems, 5G base stations and industrial automation.

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How fast GD25NX is

GigaDevice specifies Octal SPI operation up to 200 MHz in both single-transfer-rate (STR) and double-transfer-rate (DTR) modes, with throughput of up to 400 MB/s. These are manufacturer specifications, not independent benchmark results. Actual system performance depends on the memory mode and controller, board design, software and workload.

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Published specification GD25NX figure Qualification
Octal SPI clock Up to 200 MHz STR and DTR, per GigaDevice’s launch announcement
Maximum throughput Up to 400 MB/s Manufacturer-stated family figure
Typical page-program time 0.12 ms GigaDevice figure; typical, not a guaranteed maximum
Typical sector-erase time 27 ms GigaDevice figure; typical, not a guaranteed maximum

GigaDevice says the series programs 30% faster and erases 10% faster than conventional 1.8 V octal Flash products. Those percentages are the company’s comparison, and the announcement does not identify a specific competitor part or test protocol.

Power, voltage and data-integrity features

1.2 V I/O and read current

The 1.2 V I/O is the defining compatibility point for systems with 1.2 V SoC interfaces. GigaDevice reports read current as low as 16 mA in Octal I/O STR and 24 mA in Octal I/O DTR at 200 MHz. It also claims up to 50% lower read power consumption than conventional 1.8 V octal I/O SPI NOR devices. These figures are manufacturer claims; overall device and system power will vary with operating mode and use.

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  • Product features: This module uses serial Nor flash external memory expansion chip W25Q64. And supports SPI interface.
  • Product parameters: Capacity: 64m-bit/8m-byte Clock frequency: ≤104mhz Working voltage: 2.7~3.6V Size: 14mm * 16mm
  • Application range: This module can be used in experimental scenarios such as home, office and industrial electrical experiments
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Integrity and high-speed signaling

The family integrates error-correction code (ECC) algorithms and CRC verification for data integrity. It also provides DQS to support signal integrity in high-speed systems. GigaDevice’s broader octal NOR family materials list execute-in-place (XIP) and DLP features; confirm their availability and requirements for the exact GD25NX device and system before designing around them.

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GD25NX64J and GD25NX128J: density, package and status

The launch announcement covered 64 Mb and 128 Mb parts. At announcement, GD25NX128J samples were available for customer evaluation, while GD25NX64J samples were being prepared. GigaDevice’s catalog lists GD25NX128J as a 128 Mb mass-production part. The catalog information cited here does not establish the GD25NX64J’s later sample or production status.

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NOYITO W25Q64 64Mbit 8MByte FLASH Memory Module DataFlash SPI Interface
  • This module uses serial Nor flash external memory expansion chip W25Q64.
  • Supports SPI interface.
  • Capacity: 64M-bit / 8M-byte.
  • Clock frequency: ≤104MHz.Work voltage: 2.7-3.6V.
Model Density Status stated by GigaDevice
GD25NX64J 64 Mb Samples were being prepared at the November 25, 2025 announcement
GD25NX128J 128 Mb Samples available for evaluation at launch; listed as mass production in GigaDevice’s catalog

Supported package formats announced for the series are TFBGA24, 8 × 6 mm with a 5 × 5 ball array, and WLCSP with a 4 × 6 ball array. GigaDevice’s catalog entry for GD25NX128J specifies TFBGA24 packaging. Confirm the package for the exact ordering part number; the family-level package announcement does not mean every model is offered in every package.

The catalog entry for GD25NX128J also lists 1.8 V VCC, 1.2 V VIO, x1/x8 operation at 200 MHz, x8 DTR at 200 MHz, ECC, hardware reset and secured OTP. Temperature grade is not stated in the cited catalog information, so verify that requirement with GigaDevice or an authorized representative.

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MusRock 10pcs W25Q128 128Mbit NOR Flash Memory Module SPI Interface IC Chip
  • 【High-Speed SPI Interface】 133MHz SPI bus support; 256-byte page write capacity; Suitable for embedded systems requiring fast data access and code execution (XIP) in smart home and industrial control applications
  • 【Robust Industrial Performance】 -40°C to +85°C operating range; 100,000 erase cycles per sector; 20-year data retention at 25°C; suitable for long-term use in reliable embedded Settings
  • 【Low-Power Design for Extended Operation】 Standby current less than 1µA; 2.7V to 3.6V wide voltage compatibility; energy-efficient solution for battery-powered devices and portable electronics
  • 【Flexible Memory Management】 Supports 4KB, 32KB, and 64KB erase units; 16MB storage capacity with 256 blocks; optimized for wear leveling and efficient data handling in microcontroller-based projects
  • 【Easy Integration with Common Development Platforms】 SOIC-8 package; compatible with for for Arduino , for for Raspberry Pi, STM32, and other popular microcontrollers; simple hardware setup with standard SPI communication protocols
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What to check before choosing or sourcing a part

GD25NX is a candidate when a design needs octal NOR performance and direct 1.2 V I/O compatibility. Compare the actual part and system requirements rather than treating the family’s headline figures as universal operating results.

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  • Voltage compatibility: Confirm that the SoC’s I/O voltage and the selected Flash device’s VIO are compatible, while accounting separately for the Flash core supply.
  • Interface and throughput: Check whether the controller supports the required octal STR or DTR mode, DQS behavior and sustained transfer pattern.
  • Timing: Match typical program and erase figures to the workload, and consult the device datasheet for limits and conditions that matter to the design.
  • Power: Assess current and total energy for the intended read pattern and operating mode; the stated read-current and power comparisons are not whole-system guarantees.
  • Reliability features: Confirm the role of ECC, CRC, reset and secured OTP in the system’s integrity and recovery plan.
  • Ordering details: Verify model, density, package, temperature grade and production status for the exact part number.

For technical information or pricing, GigaDevice directs customers to local authorized sales representatives. Distributor stock and retail listings are not established by the manufacturer information summarized here. When evaluating a listing, confirm that it is from an authorized seller and matches the required model, voltage, package, grade and density.

Quick Recap

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