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ASML, Applied Materials, Lam Research, and KLA do not sell interchangeable versions of one machine. They occupy different centers of gravity in semiconductor manufacturing: ASML is built around lithography, Applied Materials covers a wide range of wafer-processing and integration steps, Lam Research concentrates on deposition, etch, clean, and support for installed tools, while KLA focuses on inspection, metrology, analytics, and process control.

Those descriptions are useful starting points, not rigid boxes. ASML also sells metrology and inspection products; Applied Materials and Lam Research overlap in several process categories; and KLA has specialty process equipment. The practical comparison is therefore about the manufacturing job a tool performs, the breadth of each portfolio, and the services surrounding the equipment—not a simplistic ranking of four companies.

At a glance

Company Primary manufacturing role Portfolio emphasis Useful comparison lens
ASML Lithography-centered equipment supplier EUV and DUV lithography, plus related metrology, inspection, software, and services Patterning capability and lithography-adjacent control
Applied Materials Broad wafer-fabrication and integration supplier Deposition, removal, modification, materials analysis, and device integration Coverage across many process steps and integrated process solutions
Lam Research Wafer-fabrication equipment and services supplier Deposition, etch, clean, and customer support for installed tools Process concentration and tool performance over the equipment life cycle
KLA Process-control supplier with specialty process businesses Inspection, metrology, software, analytics, services, specialty etch/deposition, and PCB/component inspection Defect detection, measurement, yield learning, and process control

The descriptions above follow the companies’ own portfolio and regulatory disclosures. They explain business positioning; they do not prove that one supplier is technically or financially superior in every application.

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What ASML actually supplies

Lithography is the defining business

Lithography projects a pattern onto a semiconductor wafer so later process steps can build transistors and interconnects in the intended geometry. ASML’s defining products are lithography systems, including extreme ultraviolet (EUV) and deep ultraviolet (DUV) platforms. Its portfolio also includes High NA EUV systems, as well as metrology, inspection, software, and service offerings that support patterning operations.

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ASML describes EUV as using light with a 13.5-nanometer wavelength and positions the technology for production of the most advanced semiconductor features. That technical role is why ASML is usually discussed first when the question is how the smallest printed features are formed. Lithography does not, by itself, deposit films, remove material, or verify every defect; it creates the patterned image that makes those subsequent operations possible.

What the 2025 unit figures mean

ASML’s 2025 company overview reports sales of 48 EUV lithography systems, 279 DUV lithography systems, and 208 metrology and inspection systems. These are company-reported system units sold during 2025, not market-share percentages and not a count of every system operating in the field.

The same overview reports 2025 total net sales of €32.7 billion, a 52.8% gross margin, and €4.7 billion in research and development. Those are ASML company-level US GAAP figures. They should not be placed in a league table beside the other three companies without aligning fiscal periods, accounting definitions, business scope, and currency treatment.

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How Applied Materials spans the process flow

A portfolio organized around multiple wafer steps

Applied Materials describes a portfolio that reaches across deposition, removal, modification, materials analysis, and device integration. In a fab, that means its equipment can be relevant at several points rather than being tied to one dominant operation.

  • Deposition: forming thin films on the wafer, often repeatedly as device structures are built.
  • Removal: processes such as etch and chemical mechanical planarization (CMP) that selectively remove material or flatten a surface.
  • Modification: operations including ion implantation and thermal processing that change material properties or activate a structure.
  • Materials analysis: examining films and structures so process engineers can understand composition, thickness, and other characteristics.
  • Device integration: coordinating process technologies so individual steps work together in a manufacturable device flow.

This breadth is the key contrast with a lithography-centered supplier. Applied Materials can address several process modules and integration challenges, but that does not mean it supplies every tool in a modern fab or that its equipment replaces lithography systems.

Why breadth matters to a chipmaker

A broad portfolio can help a device manufacturer evaluate related steps together: for example, how a deposited film behaves during etch, how planarization affects later patterning, or how thermal treatment changes a material stack. The benefit is process coverage and integration context. The trade-off for a buyer is that “broad portfolio” is not the same as “best in every category”; each tool still has to meet the device’s performance, throughput, defect, and cost requirements.

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Lam Research: deposition, etch, clean, and installed-tool support

Its process center of gravity

Lam Research’s fiscal 2025 filing describes a wafer-fabrication equipment and services business with opportunities in deposition, etch, and clean. These operations shape and prepare the wafer after patterns have been created and between successive layers.

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  • Deposition adds controlled films to the wafer.
  • Etch removes selected material to transfer a pattern into an underlying layer.
  • Clean removes residues and contaminants that could interfere with the next process step.

Because Applied Materials also describes deposition and removal in its portfolio, the two companies overlap. The meaningful question is not whether both names appear next to “etch” or “deposition,” but which specific process module, architecture, materials set, performance target, and fab qualification a customer is evaluating.

Support is part of the business

Lam’s filing separately describes customer support focused on the performance and efficiency of installed tools. That includes the operational period after a system is delivered: maintaining capability, improving productivity, and helping a fab keep equipment performing consistently. For capital equipment, this installed-base relationship can matter as much as the initial purchase because tools run through long production cycles and process changes.

KLA: process control rather than a single wafer step

Inspection, metrology, and analytics

KLA’s fiscal 2026 annual filing describes inspection, metrology, software, analytics, and services aimed at improving yield during both development and production. Inspection looks for defects or anomalies; metrology measures dimensions or material properties; software and analytics turn those observations into information process engineers can use.

KLA’s center of gravity is therefore process control. It helps answer questions such as: Did a defect appear? Where on the wafer did it occur? Is a critical dimension drifting? Which process condition is associated with the yield loss? Those answers guide corrective action in the tools that deposit, pattern, etch, clean, or otherwise modify the wafer.

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Specialty process and adjacent inspection businesses

KLA is not limited to measurement hardware. Its filing also describes specialty etch and deposition activities, along with inspection businesses serving printed circuit boards and components. Those operations broaden the company’s manufacturing exposure, but they do not change the main distinction: KLA is principally associated with finding, measuring, analyzing, and controlling process variation.

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How the four roles fit together in a wafer fab

A simplified manufacturing sequence shows why these suppliers can all be important to the same chipmaker without being direct substitutes.

  1. Deposit or grow a material layer. A fab forms a film or other layer on the wafer. Applied Materials and Lam Research both have portfolio exposure to deposition, depending on the specific application.
  2. Pattern the layer. A lithography system coats, exposes, and develops the wafer so the intended geometry is defined. ASML’s EUV and DUV systems occupy this patterning role.
  3. Transfer the pattern. Etch removes selected material according to the lithographic image. Applied Materials and Lam Research both describe removal or etch capabilities, with exact product fit determined by the process.
  4. Clean and prepare. Cleaning removes residues or particles before the next cycle. Lam specifically identifies clean as a process opportunity; cleaning can also be part of broader fab process flows.
  5. Modify material properties. Implantation and thermal processing adjust electrical or structural characteristics. Applied Materials explicitly includes these modification categories.
  6. Measure and inspect. Inspection and metrology detect defects and measure whether the process stayed within control limits. KLA’s portfolio is centered here, while ASML also reports metrology and inspection systems.
  7. Use analytics to improve yield. Software and services connect measurements to process decisions, helping engineers identify drift, classify defects, and stabilize production. KLA emphasizes analytics and services; all major equipment suppliers also support their own installed systems in different ways.

The sequence is intentionally simplified. Real fabs repeat, reorder, and subdivide these operations across many layers, and a single device process can require hundreds of steps. The point is functional: patterning, material processing, and process control solve different manufacturing problems.

Head-to-head comparison by decision criterion

Question a reader is asking ASML Applied Materials Lam Research KLA
What is the clearest primary identity? Lithography Broad wafer processing and integration Deposition, etch, clean, and support Inspection, metrology, analytics, and process control
Which process family is most distinctive? EUV and DUV patterning Coverage across deposition, removal, modification, analysis, and integration Concentrated wafer-fabrication process equipment Defect detection, measurement, and yield learning
Does the portfolio overlap another company here? Yes: metrology and inspection overlap with process-control suppliers Yes: deposition and removal overlap with Lam Yes: deposition and etch overlap with Applied Materials Yes: specialty etch/deposition overlap with process-equipment suppliers
What services are emphasized in the cited descriptions? Software and services supporting patterning, plus related metrology and inspection Integration-oriented process coverage Installed-tool performance and efficiency Analytics and services for development and production yield
What should not be inferred? Unit sales are not market share Portfolio breadth is not proof of category leadership Process concentration is not a ranking Process-control focus does not mean no process equipment

Where the portfolios overlap—and why that matters

ASML and KLA are not separated by a simple “hardware versus software” line

ASML is best known for exposure systems, but its reported portfolio also includes metrology and inspection. KLA is best known for inspection and metrology, yet its filing includes specialty process equipment. A procurement team should therefore examine the exact product and application rather than assume that every ASML product patterns wafers or every KLA product measures them.

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Applied Materials and Lam Research can appear in the same process discussion

Both companies describe deposition and removal-related opportunities. Their businesses can overlap at the category level while differing in chamber design, materials support, pattern-transfer capability, throughput, defect performance, software, service model, and qualification history. A category label alone is not enough to identify a substitute.

“Supplier” does not mean “single machine”

Large equipment manufacturers sell families of systems, options, upgrades, consumables or service components, software, and field support. A fab may use several suppliers in one module and several modules from the same supplier elsewhere. The comparison should follow the production constraint being solved, not the corporate name in isolation.

Why lithography receives disproportionate attention

Every patterned layer depends on transferring a design to the wafer with sufficient resolution, overlay accuracy, and productivity. EUV’s 13.5-nanometer light wavelength is central to ASML’s explanation of how the technology supports advanced features. DUV remains an important part of the portfolio and is used across many layers and device generations.

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That visibility can create a misleading impression that lithography is the whole semiconductor-equipment market. It is one critical stage in a long chain. Deposition builds films, etch defines structures, clean removes contamination, modification changes material behavior, and process control identifies variation. A technically advanced chip needs all of those functions to work together.

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Services, software, and the installed base

Equipment economics do not end when a system is accepted by the customer. Fabs need upgrades, preventive maintenance, troubleshooting, process tuning, spare parts, data analysis, and productivity improvements over years of operation. The companies emphasize different aspects of that continuing relationship.

  • ASML: services and software support lithography and related metrology or inspection operations.
  • Applied Materials: integration-oriented breadth can connect multiple process categories and materials decisions.
  • Lam Research: customer support is explicitly described in terms of installed-tool performance and efficiency.
  • KLA: software, analytics, and services turn inspection and metrology data into yield and process-control actions.

These are not equivalent service packages, and the cited descriptions do not provide a like-for-like service-revenue or uptime comparison. They do show why a customer evaluates the total operating relationship rather than only the initial equipment specification.

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How to compare them for a real manufacturing question

If the question is “Who supplies the patterning system?”

Start with ASML’s EUV and DUV lithography portfolio, then examine the required wavelength, numerical aperture, overlay, throughput, resist stack, and service ecosystem. The answer concerns pattern formation, not the full set of tools needed to build the device.

If the question is “Who covers the most process steps?”

Applied Materials is the clearest fit for a breadth-oriented comparison because its description spans deposition, removal, modification, analysis, and integration. Confirm the exact process module before treating breadth as a purchasing advantage.

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If the question is “Who is concentrated in etch, deposition, and clean?”

Lam Research is the natural process-concentration lens, especially when installed-tool support and operating efficiency are part of the decision. Applied Materials may still be relevant because the categories overlap.

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If the question is “Who helps find defects and improve yield?”

KLA is the clearest starting point because inspection, metrology, software, analytics, and services are its stated center of gravity. ASML’s metrology and inspection products mean the comparison should be made at the product level, not by assuming exclusive ownership of process control.

If the question is “Which company is best?”

Define “best” first: resolution, overlay, etch profile, film quality, defect sensitivity, throughput, cost of ownership, uptime, service response, integration risk, or another metric. The cited company and regulatory sources do not provide a single, comparable test or market-share dataset that can rank all four on one scale.

Financial and market-share cautions

The available reporting periods are not aligned. ASML’s figures are for calendar 2025. Lam Research’s cited fiscal 2025 filing covers a fiscal year ending June 29, 2025. KLA’s cited fiscal 2026 filing covers a fiscal year ending June 30, 2026. Applied Materials is represented here by an official portfolio description rather than a same-period financial figure.

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Consequently, the cited material cannot support a four-company revenue ranking, market-share table, or claim that one supplier has the strongest business overall. Revenue also reflects different mixes of equipment, services, software, and adjacent businesses. A valid ranking would require a defined metric and a consistent period and accounting basis.

A practical checklist for reading claims about these companies

  • Identify the manufacturing operation: patterning, deposition, etch, clean, modification, inspection, metrology, or analytics.
  • Check whether the statement concerns a product family, a business segment, or the entire company.
  • Separate company-reported unit sales from market share.
  • Record the reporting period and fiscal-year end before comparing financial numbers.
  • Look for overlap: a supplier may participate in an adjacent process without being the market’s main reference point for it.
  • Include service, software, installed-base, and integration requirements in the decision.
  • Do not infer technical superiority from portfolio breadth, brand visibility, or a single headline metric.

What this comparison establishes

ASML is the lithography-centered company, with EUV and DUV at the heart of its business and related metrology, inspection, software, and services around patterning. Applied Materials is the broad process and integration supplier. Lam Research is concentrated in deposition, etch, clean, and support for tools in production. KLA is centered on inspection, metrology, analytics, and process control, with specialty process and PCB/component inspection activities.

Those distinctions are strong enough to explain why the four names appear together in semiconductor-equipment discussions, but not strong enough to turn them into mutually exclusive categories or a universal performance ranking. The right comparison follows the fab problem first and the company name second.

The Bottom Line

Bottom line: ASML patterns wafers, Applied Materials covers many process and integration steps, Lam Research concentrates on deposition/etch/clean and installed-tool support, and KLA measures and controls process performance. They overlap, but they solve different primary manufacturing problems.

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