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Adeia-affiliated companies sued AMD in November 2025, alleging that its products infringed 10 patents involving hybrid bonding and advanced process-node technology. The case is no longer pending: Adeia filed a settlement notice on March 9, 2026, and the court dismissed the case on March 10. The docket listing does not disclose the settlement terms, and the materials reviewed do not establish infringement as a court finding.
Why was AMD sued over 3D V-Cache?
Adeia Semiconductor Bonding Technologies Inc., Adeia Semiconductor Inc., and Adeia Semiconductor Solutions LLC filed suit against Advanced Micro Devices, Inc. in the U.S. District Court for the Western District of Texas on November 3, 2025. Adeia said it had filed two lawsuits and alleged infringement of 10 patents: seven concerning hybrid bonding and three concerning advanced process-node technology. Those are Adeia’s descriptions of its claims, not findings that AMD infringed any patent. Adeia’s announcement and the case docket identify the action and parties.
Adeia CEO Paul E. Davis said at filing, “Earlier today, Adeia took legal action against AMD to protect our intellectual property rights and the investments we have made in our foundational semiconductor technologies.” He also said, “After prolonged efforts to reach a mutually agreeable resolution without litigation, we believe this step was necessary to defend our intellectual property from AMD’s continued unauthorized use.” These statements express Adeia’s position; they do not independently establish the allegations.
The two patent groups Adeia identified
- Hybrid bonding: Adeia said seven of the patents concern a method of joining semiconductor dies, a process relevant to vertically stacked chip designs.
- Advanced process-node technology: Adeia said the other three concern semiconductor manufacturing at advanced process nodes. The materials cited here do not establish how each patent claim applies to a particular AMD product.
Adeia also described its portfolio as containing more than 13,000 worldwide patent assets. That figure comes from the company’s announcement and is not an independent portfolio count.
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- 96MB L3 cache with better thermal performance vs. previous gen and allowing higher clock speeds, up to 5.2GHz
- Drop-in ready for proven Socket AM5 infrastructure
- Cooler not included
What is hybrid bonding in Ryzen X3D CPUs?
Hybrid bonding is a way to connect stacked semiconductor dies through dense direct connections rather than conventional solder bumps. AMD’s technical brief describes its 3D V-Cache approach as a “bumpless” chip-on-wafer process using copper-to-copper hybrid bonding. In broad terms, this allows cache dies to be stacked vertically and connected to a processor die. That technical context does not show that Adeia’s patents cover AMD’s implementation or that AMD infringed them.
AMD says its EPYC 9004 implementation uses this copper-to-copper hybrid-bonding approach. Its brief reports up to 96 MB of L3 cache per die for some EPYC 9004 configurations; that is not a specification for every Ryzen X3D processor. Technical and performance descriptions in the brief are AMD’s own claims. AMD’s 3D V-Cache technical brief provides its account of the process.
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Which AMD products did the complaint name?
The complaint reproduction lists Ryzen X3D processors, EPYC X processors, and Instinct MI accelerators among the products Adeia accused. The Ryzen models listed include:
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- Ryzen 5 5500X3D, Ryzen 5 5600X3D, and Ryzen 5 7600X3D
- Ryzen 7 5700X3D, Ryzen 7 5800X3D, Ryzen 7 7800X3D, and Ryzen 7 9800X3D
- Ryzen 9 7900X3D, Ryzen 9 7950X3D, Ryzen 9 9900X3D, and Ryzen 9 9950X3D
- Ryzen 9 9955HX3D and Ryzen 9 7945HX3D
This is the plaintiff’s accused-product list, not a judicial determination about any product. The complaint reproduction is available through CourtListener.
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- For the advanced Socket AM4 platform
Did Adeia’s lawsuit against AMD get settled?
Yes. The docket records Adeia’s settlement notice on March 9, 2026, followed by an order dismissing the case on March 10, 2026. The Justia docket listing does not state the financial terms, licensing arrangements, or other settlement conditions. No damages amount or royalty rate is established in the materials cited here. The docket listing supplies the procedural dates.
A settlement and dismissal resolve the case procedurally, but the available docket information does not explain the parties’ agreement or establish a court finding that AMD infringed Adeia’s patents.
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- 6 Cores and 12 processing threads, based on AMD "Zen 5" architecture
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- Cooler not included
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