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At its June 9, 2022 Financial Analyst Day, AMD outlined fourth-generation EPYC CPUs for four server workloads, a CDNA 3-based MI300 package combining CPU and GPU technology, and plans to bring Xilinx-derived AI Engine technology into more of its product portfolio. These were roadmap plans and company projections—not independent performance results. AMD’s later updates confirmed some product details, while its July 2026 announcement places the 2022 roadmap in historical context.
What AMD announced in June 2022
AMD’s roadmap connected three strands of its portfolio: Zen 4 and Zen 4c EPYC server processors, CDNA 3 Instinct GPU technology, and XDNA adaptive-compute IP derived from Xilinx. The company described them as products for different workloads and deployment settings, rather than as interchangeable alternatives.
| # | Preview | Product | Price | |
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AMD Epyc 9554 Processor 3.1 Ghz 256 Mb L3, W128281619 (256 Mb L3) | $3,550.00 | Buy on Amazon |
| 2 |
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AMD Epyc 9354 Processor 3.25 Ghz 256 Mb L3, W128281623 (256 Mb L3) | $2,819.95 | Buy on Amazon |
| 3 |
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AMD EPYC 9004 [4th Gen] 9124 Hexadeca-core [16 Core] 3 GHz Processor | $977.48 | Buy on Amazon |
The distinction matters when reading the announcement: target workloads and performance figures were AMD’s own positioning and expectations at the time. They should not be treated as neutral comparisons or as proof of measured results.
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AMD named four fourth-generation EPYC products, assigning each a target workload. Genoa and Siena use Zen 4; Bergamo uses Zen 4c; Genoa-X adds 3D V-Cache. AMD’s descriptions identify intended uses, not independent findings that a given model is best for that workload.
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| Product | Architecture or design | AMD’s stated target use |
|---|---|---|
| Genoa | Zen 4 | General-purpose servers |
| Bergamo | Zen 4c | Cloud-native computing |
| Genoa-X | Zen 4 with 3D V-Cache | Relational databases and technical computing |
| Siena | Zen 4 | Intelligent edge and communications deployments |
The roadmap therefore offered workload-specific choices within one processor generation. It did not provide neutral price/performance rankings or establish that a product’s target workload was its only suitable use.
What CDNA 3 and MI300 were designed to do
AMD described CDNA 3 as a GPU architecture combining 5 nm chiplets, 3D die stacking, fourth-generation Infinity Architecture, Infinity Cache and HBM, with a unified-memory programming model. The announced MI300 design brought together a CDNA 3 GPU, a Zen 4 CPU, cache and HBM in a 3D chiplet package. AMD positioned the system for AI training and high-performance computing (HPC).
This CPU-and-GPU combination was a different proposition from an EPYC CPU alone: MI300 was presented as a packaged design that joined CPU and accelerator components, with memory and programming features intended to support the target workloads. The 2022 announcement describes the architecture and intended use; it does not provide an independent comparison with other systems.
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How Xilinx-derived AI Engine technology fit the plan
AMD described XDNA as foundational architecture IP from Xilinx, comprising FPGA fabric and an AI Engine (AIE). The FPGA fabric combines adaptive interconnect, FPGA logic and local memory. AMD said the AIE’s dataflow architecture was optimized for AI and signal processing.
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AMD’s strategy was to extend this adaptive-compute technology across products, starting with Ryzen. It also described integrating AIE across Ryzen, EPYC and Versal for small and mid-size AI models, complementing larger Instinct accelerators and adaptive SoCs. This was a portfolio plan, not evidence that an AI Engine would outperform an Instinct accelerator or replace one in every workload.
What AMD’s performance numbers meant
The following figures appeared as AMD expectations in its June 9, 2022 announcement. They are vendor projections tied to the stated comparison and workload—not independent benchmark results.
| AMD’s 2022 figure | Comparison and context | How to interpret it |
|---|---|---|
| 8%–10% expected IPC increase | Zen 4 over Zen 3 | AMD’s projected instructions-per-clock gain |
| More than 25% expected performance-per-watt increase; 35% expected overall performance increase | Zen 4 over Zen 3 for desktop applications | AMD projections for desktop applications, not a measured result for every workload |
| More than 5× expected performance-per-watt | CDNA 3 versus CDNA 2 on AI training workloads | AMD’s workload-specific projection |
| More than 8× expected AI-training performance increase | MI300 versus MI200 | AMD’s announced expectation, not an independently verified outcome |
The announcement did not supply a neutral third-party benchmark study supporting these projections. They are useful for understanding what AMD expected its designs to deliver in 2022, but not as verified results or guaranteed gains in a buyer’s particular application.
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In June 2023, AMD introduced EPYC 97X4, formerly codenamed Bergamo, and specified 128 Zen 4c cores per socket. AMD also described MI300X as a CDNA 3 accelerator with up to 192 GB of HBM3, and said MI300A was sampling to customers. These details provide follow-through on parts of the 2022 plan; they do not convert the earlier performance projections into independently tested results.
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AMD’s Zen family overview lists EPYC 9004/8004 under Zen 4 and Zen 4c and identifies fourth-generation EPYC processors as having up to 128 cores. The product family overview and Bergamo announcement offer later product context beyond the initial roadmap announcement.
Independent reader supportYour contribution helps us test, update, and keep practical guides available for everyone.Is the 2022 roadmap still current?
No. It is a historical roadmap for products and expectations AMD announced in 2022. AMD’s July 2026 announcement describes sixth-generation EPYC and MI400 launches, along with further CPU and GPU roadmaps. For a current-generation decision, the 2022 announcement should not stand in for current product specifications or availability; use AMD’s later product information for the generation being considered.
The lasting significance of the 2022 presentation is its direction: segment EPYC around server workloads, combine CPU and GPU technology in the MI300 design for AI and HPC, and use Xilinx-derived adaptive AI technology across a wider range of AMD products. Each element should be read in its own timeframe and as AMD’s stated strategy, rather than as a present-day performance ranking.
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Product prices and availability are accurate as of the date/time indicated and are subject to change. Any price and availability information displayed on Amazon at the time of purchase will apply.
