AMD designs its chips but uses outside companies to manufacture and finish them. In AMD’s FY2025 filing, TSMC is named for wafers used in high-performance computing (HPC), FPGA, and adaptive SoC products; GlobalFoundries (GF) is named for HPC wafers at 12 nm and 14 nm. After wafer fabrication, third-party partners package and test the products. AMD says nearly all final assembly and testing takes place at third-party facilities in China, Malaysia, and Taiwan, but it does not publish a reliable country-and-factory map for each retail CPU or GPU model.
How AMD chips are made
AMD is a fabless chip designer: it develops chip designs and product platforms, then contracts other companies for wafer fabrication and downstream manufacturing. A semiconductor wafer contains many copies of a chip design. After fabrication, those copies are sorted and routed for packaging and testing, which turns the silicon die into a finished semiconductor product.
- Design: AMD develops the chip design and product platform.
- Wafer fabrication: A foundry manufactures wafers using AMD’s designs. AMD’s FY2025 Form 10-K names TSMC for wafers for HPC, FPGA, and adaptive SoC products, and GF for HPC wafers at 12 nm and 14 nm. AMD’s FY2025 Form 10-K was filed February 4, 2026.
- Wafer sort: The foundry may sort the wafers, or deliver them to an assembly, test, mark, and packaging provider (ATMP).
- Packaging and test: ATMP partners package the dies and test the resulting semiconductor products.
- Board manufacturing, where applicable: AMD separately outsources board-level graphics product manufacturing. Making a graphics card or board is a later step than fabricating the chip wafer.
AMD describes the handoff this way in its FY2025 filing: wafers “are either sorted by the foundry or delivered by the foundry to our assembly, test, mark and packaging (ATMP) partners or subcontractors located in the Asia-Pacific region, who package and test our final semiconductor products.”
Which companies does AMD name?
AMD’s filing lists suppliers by role and broad product category. The roles are not interchangeable: foundries fabricate wafers, while ATMP providers package and test the resulting products.
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| Company or group | Role described by AMD | Product scope disclosed |
|---|---|---|
| TSMC | Wafer foundry | HPC, FPGA, and adaptive SoC products |
| GlobalFoundries (GF) | Wafer foundry | HPC wafer purchases at 12 nm and 14 nm |
| UMC and Samsung | Integrated-circuit suppliers | Integrated circuits for programmable logic devices |
| Tongfu Microelectronics joint ventures | ATMP services | Packaging and testing |
| Siliconware Precision Industries (SPIL) | ATMP services | Packaging and testing |
| King Yuan Electronics Company (KYEC) | ATMP services | Packaging and testing |
The table reflects supplier roles and product categories as reported in AMD’s FY2025 Form 10-K; it is not a parts list for any particular Ryzen, EPYC, Radeon, or Instinct product.
Where are AMD chips assembled and tested?
AMD says nearly all product assembly and final testing occurs at third-party-operated facilities in China, Malaysia, and Taiwan. This is a company-wide geographic disclosure, not a statement that every product passes through all three countries or that any named model is made in a particular one. AMD does not identify the precise packaging and test facility for each retail processor or graphics product in the cited filing.
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What the node information does—and does not—tell you
Process-node statements need a filing date. AMD’s FY2024 Form 10-K, filed February 5, 2025, said TSMC produced all microprocessor and GPU wafers at 7 nm or smaller, while AMD relied primarily on GF for microprocessor and GPU wafers at nodes larger than 7 nm. That was the wording of the FY2024 filing, not a timeless allocation rule. The later FY2025 filing describes foundry relationships by product category and identifies GF HPC wafer purchases at 12 nm and 14 nm; it should not be blended with the earlier statement as if both described one unchanged allocation.
Independent reader supportYour contribution helps us test, update, and keep practical guides available for everyone.Can you find the manufacturing country for a specific AMD model?
Not reliably from these supplier disclosures alone. The filings name companies, broad product categories, and overall assembly/testing geography, but do not map individual commercial models to a wafer fab and packaging site. A chip’s brand name or process-node label therefore is not enough to establish where that specific retail unit was fabricated, packaged, or tested.
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These arrangements can change as suppliers, capacity, product allocations, packaging routes, and facility geography change. For the latest public account, consult AMD’s newest annual or quarterly filing rather than treating an older node statement or a general supplier list as a current model lookup.
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