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COM Express, SMARC and OSM all separate a computer’s core processing hardware from the product-specific carrier board, but they make different trade-offs. COM Express prioritizes broad, high-speed connectivity and a replaceable module; SMARC targets compact, low-power systems; OSM integrates the module directly onto the board for a smaller, soldered design. The right choice depends on power, interfaces, servicing and manufacturing—not simply on which standard is newest.
How the three module standards compare
A computer-on-module (COM) combines processor, memory and core logic on a module that works with a carrier board. The standards differ in how that module connects, the physical space it occupies and the design goals it serves.
| Standard | Module-to-carrier connection | Form factors | Power and interface emphasis | Source |
|---|---|---|---|---|
| COM Express | Plug-in module on a carrier board | Compact: 95 × 95 mm; Basic: 125 × 95 mm; Extended: 155 × 110 mm | Broad mid-range and high-speed applications. Rev. 3.1 includes PCIe Gen 4, SATA Gen 3, USB 4, optional MIPI-CSI and SoundWire, plus connector updates for 16-Gbps signaling. | PICMG COM Express overview and Rev. 3.1 information |
| SMARC | 314 edge fingers mate with a low-profile 314-pin, 0.5 mm-pitch connector | 82 × 50 mm or 82 × 80 mm | SGET describes a typical power envelope under 6 W. It emphasizes mobile-oriented interfaces and optional camera, display and networking functions. | SGET SMARC overview |
| OSM | BGA module soldered directly to the board | Size-0: 30 × 15 mm, 188 pins; Size-S: 30 × 30 mm, 332 pins; Size-M: 30 × 45 mm, 476 pins; Size-L: 45 × 45 mm, 662 pins | Interface options scale with module size and include video, CSI, PCIe, Ethernet, USB, CAN, UART and GPIO. The standard does not specify one fixed power envelope. | SGET OSM overview |
SGET says the largest OSM size is 28% smaller than µQseven and 51% smaller than SMARC. Those comparisons are from SGET’s OSM overview; actual board-area savings depend on the full design, including its carrier or host board and surrounding components.
COM Express: a connector-based platform for broad I/O
PICMG ratified COM Express in 2005. Its architecture puts processor, memory and core logic on a standardized module, while a customizable carrier board supplies product-specific connections and functions. This division lets a design use a standardized compute module without fixing the final system’s peripheral layout.
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The standard’s connector-based approach supports module replacement and processor-roadmap upgrades, while giving designers a broad set of high-speed signals. PICMG describes COM Express as a family of small-form-factor computer-on-module specifications for mid-range edge processing and networking. Its Rev. 3.1 update, released in summer 2022, documents newer interface capabilities; the specific interfaces available still depend on the module and carrier implementation.
Choose COM Express when interoperability, a replaceable compute module or a wide range of high-speed I/O matters more than minimizing module footprint. Its larger form factors and connector/carrier design are trade-offs to account for early.
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SMARC: compact modules for low-power systems
SMARC—Smart Mobility ARChitecture—is SGET’s standard for compact, low-power embedded systems. Like COM Express, it uses a plug-in module and carrier-board arrangement. The module includes processor, memory, boot flash, power sequencing and core interfaces; the carrier can add application-specific features such as audio, touch and wireless connectivity.
That split can simplify prototyping and later module changes, but the carrier remains essential: a SMARC module does not by itself guarantee that a desired display, camera, network or peripheral connection is exposed in a finished product. Confirm the module’s pin use and the carrier’s implementation for the target design.
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- MEMORY & STORAGE: Equipped with 8GB DDR4 RAM and 16GB onboard eMMC storage for reliable system performance and data handling
- CONNECTIVITY: Extensive interface support including USB 2.0, Ethernet, HDMI, GPIO, SPI, I2C, UART, PCIe, and MIPI interfaces for versatile integration
- COMPACT DESIGN: Measures just 55mm x 40mm x 4.7mm, making it ideal for space-constrained applications and embedded systems
- THERMAL PERFORMANCE: Wide operating temperature range from -20°C to +85°C ensures reliable operation in various environmental conditions
SMARC is a natural fit when a design has a constrained power budget and needs a compact ARM or x86 module with a replaceable, carrier-based architecture. Its under-6-W figure is SGET’s typical envelope, not a guarantee for every module or workload.
OSM: solder-on integration for compact production designs
OSM, or Open Standard Module, changes the manufacturing model: its BGA mini module is soldered to the host board rather than plugged into a mating connector. SGET positions the standard as an enhancement to connector-based modules, with small size, predefined interfaces and suitability for automated soldering, assembly and testing. OSM supports MCU32, ARM and x86 architectures.
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Direct soldering can reduce the space and connector hardware needed for a modular compute design, and it aligns with machine-based production. The trade-off is serviceability: replacing a soldered module is not the same straightforward field operation as swapping a connector-based one. OSM is therefore most compelling when board area and dense integration outweigh easy module replacement.
Independent reader supportYour contribution helps us test, update, and keep practical guides available for everyone.Which standard should you choose?
- Choose COM Express if broad high-speed I/O, established vendor interoperability and the ability to replace the module are priorities.
- Choose SMARC if low power and compact size are central, and you want a plug-in ARM or x86 module with a custom carrier.
- Choose OSM if minimizing module footprint and supporting automated solder assembly matter more than field-swappable compute hardware.
For a design whose bandwidth and power requirements exceed the intended COM Express envelope, consider COM-HPC as an adjacent PICMG standard rather than treating OSM or SMARC as direct performance substitutes. PICMG says COM-HPC was ratified in 2021.
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- COMPACT FORM FACTOR: Measures just 2.17" x 1.57" with 4 x M2.5 mounting holes and operates in temperatures from -4°F to 185°F (-20°C to 85°C).
Standards status and version context
The version dates help distinguish the standards’ current documented revisions from their origins. PICMG identifies COM Express Rev. 3.1 as released in summer 2022. SGET announced SMARC Specification and Design Guide 2.2 in June 2025; its news listing reports OSM Specification 1.2 and Design Guide 1.1 in November 2024. These publication milestones do not by themselves establish product availability or the support lifetime of any particular module; check the module vendor’s documentation for those details.
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