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A leadless chip carrier is an integrated-circuit package whose electrical contacts are metallized terminations built into the package body, rather than separate leads projecting from its sides. The term describes how the package connects electrically; it does not, by itself, establish the package’s material, dimensions, pin arrangement, or board footprint.
What makes a chip carrier leadless?
The defining feature is the construction of its external connections. IEC 60194-2:2025 defines a leadless chip carrier as a “chip carrier whose external connections consist of metallized terminations that are an integral part of the component body.” IEC terminology, entry 3.2.39
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In practical terms, the contacts are part of the package itself, not distinct leads that extend out and bend down along the sides. Many ceramic leadless chip carriers use contacts on the underside for surface mounting, but the name alone does not specify a universal contact layout or mounting footprint.
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What does “LCC” mean?
The abbreviation is ambiguous: different suppliers use “LCC” for different package names. Texas Instruments uses it for Leaded Chip Carrier, while identifying Leadless Ceramic Chip Carrier as LCCC and Leadless Plastic Chip Carrier as LPCC. Texas Instruments package terminology
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Analog Devices uses “Leadless Ceramic Chip Carrier” or “Leadless Chip Carrier” for a package with metal pads at its outer edge, and also describes “Leaded Chip Carrier,” also called PLCC, as a plastic package with leads on all four sides. Analog Devices glossary
Other catalog labels exist. For example, Microchip uses CLCC for Ceramic Leadless Chip Carrier in its package drawing catalog; that label is useful in that catalog, but abbreviations are not guaranteed to be uniform across manufacturers. Microchip package drawing catalog
How do leadless and leaded chip carriers differ?
| Feature | Leadless chip carrier | Leaded chip carrier |
|---|---|---|
| External connections | Metallized terminations integrated into the package body | Separate leads project from the package; PLCC is one example described by Analog Devices |
| Abbreviation to watch | LCCC, LPCC, or CLCC may identify particular leadless variants in manufacturer terminology | TI uses LCC for Leaded Chip Carrier; PLCC is another name used for a leaded package |
| What the name tells you | That the package has integral metallized terminations; it does not settle dimensions or layout | That the package has projecting leads; exact outline and lead arrangement remain package-specific |
These distinctions are terminology examples from the cited manufacturers, not a universal abbreviation standard. Do not assume two packages are interchangeable because both are called “LCC,” or because their names differ by one letter.
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Leadless chip carriers may be ceramic or plastic. In TI’s terminology, those variants are distinguished as LCCC and LPCC. In its own ceramic LCC family description, TI characterizes the package as a quad-row package similar to QFN or QFP, with no exposed pad. That describes the cited TI family, not every package called an LCC. Texas Instruments package terminology
Ceramic LCCs are surface-mount packages with bottom-terminated connections in the manufacturer examples cited here. Infineon identifies power ICs, power MOSFETs, and oscillators among products in its ceramic LCC families. Kyocera lists LCC among its ceramic package configurations and notes that package material and configuration depend on application and performance requirements. Infineon ceramic LCC packages Kyocera semiconductor packages
Independent reader supportYour contribution helps us test, update, and keep practical guides available for everyone.What should you check before selecting or replacing an LCC?
The abbreviation is not enough to choose a component, confirm a fit, or substitute a package. Check the specific manufacturer drawing and compare:
- Terminal construction: integral metallized terminations or separate projecting leads.
- Package material and code: ceramic, plastic, and the exact supplier designation.
- Outline and pitch: the package’s dimensions, contact spacing, and row arrangement.
- Board mounting details: the footprint and contact locations shown in the package drawing.
- Application requirements: for example, whether hermetic packaging is required.
Do not infer a footprint, thermal behavior, or interchangeability from “LCC” alone; those details depend on the particular package family and its documentation.
Where can you find detailed ceramic construction requirements?
SEMI G50 covers co-fired ceramic chip-carrier constructions in top-brazed leaded and top-metallized leadless forms. Its published scope describes hermetic packaging, including high-speed digital VLSI examples, with connection to printed wiring assemblies and modules through solder attachment or “leads last” techniques. The standard is listed as a paid download; consult it for its complete requirements. SEMI G50 specification
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