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A fabless chip company designs semiconductor products but has no or limited wafer-fabrication capability. It can sell chips without operating the factory that makes them: instead, it contracts with a foundry to manufacture wafers and may use a foundry or an outsourced semiconductor assembly and test provider (OSAT) for packaging and testing.

What “fabless” means

“Fabless” describes a company’s role and manufacturing capability, not whether it makes or sells semiconductor products. The Semiconductor Industry Association (SIA) defines a fabless company as “a semiconductor design company with no or limited wafer fabrication capability” (SIA glossary).

The qualification “no or limited” matters: fabless does not necessarily mean a company has no fabrication capability at all. The central distinction is that the company specializes in designing chips while relying on external manufacturing partners for wafer production.

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How a fabless chip gets made

Semiconductor production is commonly divided into three stages: design, front-end wafer fabrication, and back-end assembly, testing, and packaging. A fabless company focuses on design; its partners handle the manufacturing steps it does not perform itself.

  1. Design: The fabless company develops the semiconductor product and its design.
  2. Wafer fabrication: A foundry manufactures the chip design on silicon wafers.
  3. Assembly, test, and packaging: A foundry or an OSAT provider may perform these downstream services. Some foundries and integrated device manufacturers also have in-house packaging operations, and may outsource some packaging work.

This division of work is known as the fabless-foundry model. It lets design companies specialize without having to establish and maintain their own full wafer-manufacturing operation. The SIA notes that leading-edge fabs can cost several billion dollars to construct, but that broad figure is not a universal cost for every facility or a quantified estimate of what a fabless company saves (SIA industry primer).

Fabless vs. foundry, IDM, and OSAT

The terms refer to different roles in the semiconductor supply chain. A company’s model is best understood by asking who designs the chip, who fabricates wafers, and who handles assembly, testing, and packaging.

Model Main role Typical manufacturing arrangement
Fabless Designs semiconductor products; has no or limited wafer-fabrication capability. Contracts with foundries for wafer manufacturing and may rely on foundries or OSATs for assembly, test, and packaging.
Foundry Manufactures chips on wafers for customer designs. Provides wafer-fabrication services to fabless firms and can supplement other companies’ manufacturing capacity.
Integrated device manufacturer (IDM) Designs, manufactures, and sells integrated circuits within a vertically integrated company. Combines design and manufacturing within the business; these activities need not take place at one physical site.
OSAT Provides outsourced assembly, test, and packaging services. Works downstream of wafer fabrication for chip makers and foundries.

These are business-model distinctions, not a guarantee about cost or performance. Specialization can spare a fabless company the investment involved in building, maintaining, and upgrading a foundry, but the sources do not establish a universal cost saving compared with an IDM.

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Does a fabless company make its own chips?

It designs the chips and may sell them, but usually does not fabricate the wafers itself. In everyday usage, “make a chip” can mean designing the product or physically manufacturing it. For clarity, distinguish chip design from wafer fabrication: a fabless company does the former and contracts with a foundry for the latter.

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Examples and how to read them

The SIA’s ecosystem report has listed AMD, Broadcom, MediaTek, and Qualcomm as examples of fabless design companies. Those examples are a historical snapshot, not a current classification of each company’s operations. For a present-day classification, check the company’s latest filings or corporate description.

At its simplest, “fabless” answers who designs a chip and whether that company has wafer-fabrication capability. It does not mean that no one manufactures the chip, or that the designer does not sell it.

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