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Samsung has a potential opening to turn its HBM4 relationship with AMD into broader chip-manufacturing business, but there is no public confirmation that AMD has awarded Samsung a foundry contract. The companies’ March 2026 memorandum of understanding covers HBM4 for AMD’s MI455X accelerator, advanced DRAM for its next-generation EPYC processor, and collaboration that includes foundry and advanced packaging. It does not disclose a logic-chip order or make memory supply conditional on one.
What Samsung and AMD have actually announced
On March 18, 2026, Samsung and AMD announced a memorandum of understanding (MOU) describing cooperation across next-generation memory, foundry, and advanced packaging. Samsung said the arrangement aligns primary HBM4 supply for AMD’s next-generation Instinct MI455X AI accelerator and advanced DRAM solutions for sixth-generation EPYC processors, codenamed “Venice.” Samsung’s announcement establishes the stated areas of cooperation, not a disclosed foundry award.
The public MOU announcement does not give order quantities, prices, exclusivity, guaranteed supply allocations, or details of a chip-manufacturing commitment. An MOU that names foundry and packaging as collaboration areas is not, by itself, proof that AMD selected Samsung to fabricate a particular processor or accelerator.
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Why HBM4 creates a potential opening
Samsung has paired HBM4 with a logic base die
In February 2026, Samsung said it had begun mass production and commercial shipment of HBM4. It described its implementation as using sixth-generation 1c DRAM and a 4nm logic base die. That gives Samsung a concrete technical basis for presenting memory, foundry, and packaging capabilities together; it does not show that AMD chose Samsung to manufacture the main logic chips in its products. Samsung’s HBM4 announcement describes Samsung’s process choices and production status.
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Supply relationships can make broader discussions relevant
HBM is a specialized component in AI accelerator platforms, while foundry manufacturing and advanced packaging are separate services that can matter to the design and delivery of complex chips. A supplier already discussing HBM and packaging with a customer has a plausible opportunity to make a broader technical or commercial case. That is strategic potential—not evidence that one part of the relationship was offered in exchange for another.
What October reporting says—and does not say
On October 8, 2026, Tom’s Hardware reported that AMD CEO Lisa Su was visiting South Korea to seek additional HBM supply, citing Chosun.biz. The report quoted Su saying, “We are going to talk about our broader partnership,” and described Samsung as hoping to turn its memory-supply relationship with AMD into foundry orders. That report supports the existence of ongoing discussion and Samsung’s reported ambition; it does not establish a signed foundry contract or a quid pro quo linking HBM supply to manufacturing work.
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Samsung’s March announcement also quoted Vice Chairman and CEO Young Hyun Jun describing the company’s “turnkey capabilities” across HBM4, memory architectures, foundry, and advanced packaging. This is Samsung’s characterization of its own offering, rather than independent confirmation that AMD has selected those services.
Has AMD picked Samsung to manufacture its chips?
The public evidence cited here does not establish that AMD has picked Samsung to fabricate MI455X, Venice, or another named logic product. It confirms an MOU covering specified memory supply and broader collaboration areas, while October reporting describes discussions and Samsung’s hope of winning foundry work. A named collaboration scope and a reported sales opportunity are not the same as a customer award.
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Samsung said it expected its HBM revenue in 2026 to be more than three times its 2025 level. That is a forward-looking company expectation, not an independently verified result or an AMD-specific revenue figure. Samsung’s February 2026 announcement also discussed plans to sample HBM4E; it does not disclose the value or volume of AMD’s arrangement.
Independent reader supportYour contribution helps us test, update, and keep practical guides available for everyone.What remains undisclosed
- Whether AMD has awarded Samsung any foundry contract, and the value or timing of any such work.
- The HBM4 allocation, price, volume, exclusivity, or guaranteed delivery terms associated with the MOU.
- Whether AMD’s HBM4 supply discussions are formally linked to a foundry decision.
Those distinctions matter because the confirmed supply relationship and the potential foundry opportunity are different claims. The public material identifies the first as an announced area of cooperation; it leaves the second unconfirmed.
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