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ASML makes lithography systems that semiconductor manufacturers use to pattern silicon wafers. Its extreme ultraviolet (EUV) machines help print some of the intricate layers used in leading-edge chips—but a lithography system is only one part of a much larger manufacturing process, and EUV does not replace every other lithography technology.
What ASML makes—and what it does not
ASML supplies industrial lithography systems to chipmakers. A system projects a pattern onto a wafer coated with light-sensitive material; the patterned wafer then moves through additional manufacturing steps. The machine is not a finished chip, and lithography alone does not make one.
ASML’s 2025 annual report says, “ASML is currently the world’s only manufacturer of EUV lithography systems.” That is ASML’s statement about its position, not an independently verified market survey. The company also sells deep ultraviolet (DUV) lithography systems and metrology and inspection equipment. ASML 2025 annual report
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ASML’s EUV systems use light with a wavelength of 13.5 nanometers, near the X-ray range. The light is generated by a laser-produced tin plasma, then directed through an optical system to transfer a chip pattern onto a wafer. ASML EUV product page
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- 5 x 5 inches, 0.67 ounces, 0.03 inches thick. Some wafers are marked with alignment marks.
- The pattern is produced by light diffraction, and its reflective appearance changes with the viewing angle.
- Silicon wafers are fragile—please handle with care.
- Circuit details can be examined under a microscope.
From tin droplets to light
Fast-moving droplets of tin pass through the machine. A powerful carbon-dioxide laser strikes the droplets, turning them into plasma that emits EUV light. ASML says its latest commercial EUV sources operate at 60,000 tin droplets per second. ASML 2025 annual-report strategy page
Mirrors and a vacuum path
EUV light is absorbed by air and nearly all materials, so it cannot travel through an ordinary lens-based optical path. ASML uses multilayer mirrors to guide the light inside a high-vacuum system. The mirrors direct it to a reticle—a patterned mask—and the optical column reduces and projects that pattern onto the wafer. These are ASML’s descriptions of its system design. ASML EUV product page
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Why EUV matters—and why chipmakers still use DUV
As chipmakers create more intricate structures, they need to pattern increasingly demanding layers. EUV can print some critical layers with fewer exposures than a DUV approach that uses multiple patterning steps. In some cases, a layer that would otherwise require several exposures can be made with one EUV exposure. The right approach depends on the layer and the manufacturing plan; EUV does not replace DUV across an entire fab. ASML 2025 annual report
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The trade-off is not simply one exposure versus several. ASML says EUV systems use more power than DUV systems, while EUV may reduce total process steps. The overall environmental effect depends on the full process flow, not just the lithography machine or exposure count. ASML 2025 annual-report strategy page
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High NA EUV: the next platform generation
ASML describes its TWINSCAN EXE platform as High NA EUV. Its product page gives the platform a numerical aperture of 0.55 and a stated resolution of 8 nanometers. ASML says the platform is intended to support high-volume manufacturing in 2025–2026. That is the company’s stated purpose and timeframe; it does not establish broad customer deployment. ASML EUV product page
Numerical aperture describes an optical system’s ability to collect and focus light. ASML presents High NA as a platform for finer patterning capability, but the stated resolution alone does not establish a chip’s final feature size, yield, cost, or customer adoption.
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What ASML reported in 2025
ASML’s annual figures describe its own business, not the entire semiconductor equipment market. The company reported the following for 2025: ASML 2025 annual report
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1Repair Windows errors before they cause bigger problems2Scan for outdated or missing drivers - takes under a minute3Clear out junk files and repair common Windows errors| ASML-reported measure | 2025 figure | What it describes |
|---|---|---|
| EUV lithography systems sold | 48 | Systems sold by ASML |
| Total systems sold | 535 | ASML systems across EUV, DUV, and metrology and inspection |
| Total net sales | €32.7 billion | ASML company net sales |
For its full-specification NXE:3800E, ASML states throughput of 220 wafers per hour, a 37% improvement over the NXE:3600D. The figure is ASML’s product-performance claim, not an independent comparison across operating fabs. The company’s 2025 strategic report also says approximately 95% of ASML systems sold in the past 30 years were still in use, within the report’s stated frame. ASML 2025 strategic report
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The 1,000-watt EUV source demonstration
ASML says it demonstrated a 1,000-watt EUV light source in April 2025. The demonstration used 100,000 tin droplets per second, compared with 60,000 droplets per second for the company’s latest commercial EUV sources. ASML described the demonstration as validation of an approach that could scale to higher power, while noting that commercial readiness would take time. It is a development milestone, not evidence that a 1,000-watt source is commercially deployed. ASML 2025 annual-report strategy page
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