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Chip on board (COB) is an electronics assembly method in which a bare semiconductor die is mounted directly on a printed circuit board or another substrate, connected there, and protected at the assembly level. The term describes how the die is installed—not what the chip does.
What does chip on board mean?
In a conventional integrated circuit, the semiconductor die is enclosed in its own package before that package is mounted on a circuit board. With COB, the bare die is attached directly to the board or substrate, and its electrical connections are made there. This removes the separate chip package between the die and the board.
COB connections can use different methods, including wire bonding and flip-chip. The term does not specify which method was used, nor does it identify the die’s function. These are features of the assembly, not a description of whether the chip is a processor, memory, controller, or another kind of component. FastTurn PCBs’ COB explainer and the INFN Low Cost COB Guidelines describe the direct-die assembly approach.
What is the black blob on a circuit board?
A black epoxy glob top may cover a bare die and its connections, protecting them at the board level. It is a visible form of encapsulation, not a reliable way to identify the chip underneath. Its appearance alone cannot tell you the die’s purpose or whether it is wire-bonded or flip-chip connected. Suga PCBA’s COB overview likewise cautions against inferring function or connection method from the epoxy covering.
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How does COB compare with a packaged IC?
| Feature | Chip on board | Packaged IC |
|---|---|---|
| Chip structure | Bare die mounted directly on the board or substrate | Die enclosed in a separate package before board mounting |
| Electrical connection | Made as part of the board-level assembly; may use wire bonding or flip-chip | The packaged component is mounted and connected to the board |
| Protection | May use local protection such as a glob top | The chip has its own package |
| Footprint and serviceability | Depend on the particular design; a COB die is not necessarily separately replaceable like a packaged IC | Depend on the package and board design |
COB describes a manufacturing arrangement, not a guaranteed advantage in cost, heat handling, reliability, footprint, or repairability. Those outcomes depend on the specific design and production process. If a COB assembly fails, whether it can be repaired or replaced depends on the board and service context; the term alone does not establish a universal repair rule.
Is chip on board the same as a COB LED?
No. A COB LED module is one lighting application of the broader chip-on-board method. COB also refers to other electronic assemblies, so the phrase does not mean that a board-mounted bare die is necessarily an LED. The distinction is reflected in Suga PCBA’s explanation of COB structure and applications.
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