iTechGuides is reader-supported. When you buy through links on our site, we may earn an affiliate commission. As an Amazon Associate I earn from qualifying purchases. Learn more
DISCO’s DFL6360 was reported in August 2002 as an automatic laser dicer for 300 mm wafer-fab applications, initially aimed at removing low-k material from dicing streets. It was a historical equipment announcement—not evidence that the DFL6360 is available today. The process it highlighted, laser grooving followed by blade dicing, addresses the risk of damaging mechanically weak low-k films during wafer separation.
What DISCO announced about the DFL6360
On 21 August 2002, EE Times reported that DISCO had announced the DFL6360, an automatic laser dicer for 300 mm fabrication applications. The machine was based on DISCO’s DFD6360 300 mm dicing-saw platform and used short-pulse laser technology. Low-k removal was its initial target application.
The announcement reported a planned December 2002 release at SEMICON Japan, with shipments expected to begin in March 2003. Those were plans stated at the time; they do not establish present-day availability. The article also relayed DISCO’s claim that the machine offered low heat damage. That is a company claim reported by the trade press, not an independently measured result.
Free tools Windows power users keep installed
One-click scans. No signup required.
What low-k removal means in wafer dicing
Why low-k films need care
Low-k dielectric films insulate wiring layers in high-speed logic. DISCO says these films have low mechanical strength, making them susceptible to peeling when a blade cuts through them. Dicing streets—the planned paths between chips—therefore need preparation that limits damage to the dielectric and surrounding wiring layers.
#1 Best Overall
- Powerful Pure Copper Motor: Equipped with 401 stainless steel blades and a 100W pure copper motor, this food dicer ensures long-lasting performance. This potato slicer features a safety latch, it will not start if not locked
- 8-in-1 Vegetable Chopper: This electric chopper effortlessly handles slicing, dicing, shredding, and chopping for vegetables (potato, onion, carrot, cabbage), fruits, and more, suitable for commercial kitchens or home use
- Efficient & User-Friendly: Our vegetable dicer features a large 88 mm feed opening (dual inlet) for quick processing of ingredients. The enlarged feed opening allows you to directly insert whole pieces of vegetables and fruits. The non-slip suction cup base ensure stability
- Easy to Clean: This multi-functional food processor allows for easy removal of the blades and discs, which can be rinsed directly with water to wash away food residue. To clean the inside of the machine, simply wipe with a cloth for cleanup
- Wide Range of Applications: This commercial vegetable slicer can effectively reduce food preparation time before cooking and is suitable for use in restaurants, school cafeterias, and other places
Laser groove, then blade separation
In low-k grooving, a laser removes the low-k-containing wiring layer along the dicing street; a blade then cuts through the wafer to separate the chips. DISCO describes this as a way to reduce chipping, delamination, and other cut-quality problems compared with cutting the fragile layers directly with a blade. These are manufacturer-described benefits, not quantified comparative results. Its low-k grooving overview outlines two process variants:
- Pi laser grooving: laser grooving followed by step-cut blade dicing.
- Omega grooving: laser grooving followed by one-pass blade dicing.
The source describes these process sequences but does not provide measurements showing one variant outperforms the other.
Rank #2
- Fully Upgraded: This vegetable chopper adopts full stainless steel main shaft and fastening nuts, replacing fragile plastic shafts on ordinary models. It effectively avoids shaft breakage and loose parts, and enables easier, safer blade replacement. The widened double-wing pusher solves common food clogging problems, improving cutting efficiency and bringing a more fluent user experience for long-time use.
- 4 in 1 Versatile Cutting: Equipped with 3 professional cutting discs and 3 matching cutting grids, this electric cutter supports slicing(1-5mm), shredding(2mm/3mm), dicing( 8x8mm/10x10mm) and straight strip cutting(10mm) in one machine.
- Industrial Grade: Built with heavy-duty die-cast aluminum body, stainless steel blades and cutting disc, this food processor is impact-resistant and high-temperature resistant for complex commercial kitchen environments. Compared with ordinary plastic cutters, its full metal structural upgrade delivers outstanding anti-rust performance and 3 times longer life.
- 200W High Power Motor: Powered by an efficient 200W pure copper DC motor, this vegetable cutter delivers fast and uniform cutting with one-button start. Adopting energy-saving and high-reliability motor, it supports up to 2 hours of continuous working and runs 50% quieter than similar food processors.
- Safe Operation & Ultra-fast Cleaning: Designed with a 3.58"x2.6" feed chute to easily fit whole potatoes, carrots, massive vegetables, fruits and cheese for less prep work.Waterproof one-touch switch and safety lock mechanism to prevent accidental operation. Both the housing and blades can be wiped clean or rinsed under running water; the entire cleaning process takes only 60s.
How short-pulse laser grooving is intended to limit damage
DISCO’s explanation is that low-k material absorbs the laser pulses and vaporizes. The escaping vapor carries energy away from the interaction area, which the manufacturer says limits heat transfer to nearby material. DISCO characterizes this as minimizing heat damage. The available sources do not provide an independent comparison or a quantified reduction in thermal damage, so the mechanism should not be read as proof of a particular performance level.
Do these 3 things before closing this tab:
1Scan for outdated or missing drivers - takes under a minute2Clear out junk files and repair common Windows errors3Fix the driver behind crashes, sound loss and screen glitchesA 2023 DISCO technology briefing depicts a broader sequence: protective-film coating, laser grooving, then blade dicing. It says grooving is generally used to prevent interlayer dielectric delamination and notes that the grooved surface affects the blade-dicing step that follows.
Independent reader supportYour contribution helps us test, update, and keep practical guides available for everyone.How the 2002 announcement relates to DISCO’s later equipment
DISCO’s later product documentation shows that 300 mm laser grooving remains an equipment application, but it does not establish that the DFL6360 is still sold or that newer machines share all of its features.
| Model | What DISCO’s documentation says | What it establishes |
|---|---|---|
| DFL6360 | Reported by EE Times in August 2002 as an automatic 300 mm laser dicer based on the DFD6360 platform, initially targeting low-k removal; planned release and shipment dates were reported at the time. | A historical announcement. Current availability is not established. |
| DFL7161 | DISCO lists a 300 mm-compatible laser saw for low-k and copper grooving. | Later product and application context; not evidence of equivalence to the DFL6360. DFL7161 product page |
| DFL7262 | DISCO describes a fully automatic laser saw for 300 mm wafers, with optional ultrashort-pulse laser optics and integrated coating, dicing, and cleaning. Listed applications include low-k wiring-layer grooving. | Later product and application context; not evidence of equivalence to the DFL6360. DFL7262 product page |
DISCO’s laser-process overview describes ablation as non-contact processing that concentrates laser energy in a small area over a short time to vaporize material. It identifies grooving as removal of surface wiring layers before blade dicing and lists low-k films among suitable materials.
Quick Recap
Rank #4
- 【300W Powerful Motor & 300KG/H High Output】Upgrade your kitchen with our commercial vegetable chopper electric machine. Featuring a 300W pure copper motor running at 700rpm, this heavy duty food processor delivers an unmatched output of 300kg/h. Unlike normal dicers that overheat quickly, this automatic vegetable cutter supports continuous 1-hour work, saving massive meal prep time for busy restaurants and catering services.
- 【7-in-1 Versatile Cutting & Wavy Chipper Disc】Say goodbye to tedious manual slicing. This multi blade vegetable processor comes with 5 interchangeable grid blades (6/8/10/12/16mm) and adjustable 2-4mm slicing discs. It serves as a professional cabbage shredder, carrot cuber, and onion dicer. Plus, the exclusive 10mm crinkle cutting grid allows you to create uniform wavy potato chips and French fries effortlessly to enrich your menu.
- 【Food-Grade 304 Stainless Steel & Long-Lasting Durability】Engineered for heavy duty commercial kitchen environments, the entire body of this automatic fruit dicing machine is crafted from thickened, rustproof 304 stainless steel. The premium alloy steel blades are wear-resistant and stay sharp for precise, uniform cubes without mashing soft ingredients. It is a durable, cost-effective asset for fruit shops, salad bars, and school canteens.
- 【Triple Safety Protection & Stable use】Your safety is our top priority. This electric food chopper machine features an intelligent safety induction device that automatically shuts off the motor when the cover is opened. The sealed power switch prevents water leakage and electrical shocks, while the bottom anti-slip suction cups reduce vibration and noise, keeping the automatic potato chipper perfectly stable during high-speed use.
- 【Quick-Release Buckle & Effortless Cleaning】Designed with advanced quick-release spring buckles, the upper and lower split structure allows you to swap accessories and grids in seconds. The detachable dicing chamber and food-grade components can be rinsed directly under running water. Its compact size handles large fresh vegetables without excessive pre-cutting, making it an easy-to-clean food processor for both homes and businesses.
What the announcement does—and does not—show
- It records a 2002 announcement of a 300 mm automatic laser dicer, not a current product launch.
- It explains the process rationale: clear fragile low-k-containing layers from the dicing street before the blade separates the wafer.
- It reports DISCO’s claims about heat damage and cut quality, but the cited material supplies no independent trial, quantified thermal-damage reduction, throughput figure, yield result, or cost comparison.
Product prices and availability are accurate as of the date/time indicated and are subject to change. Any price and availability information displayed on Amazon at the time of purchase will apply.
Quick wins for a faster PC:
Clear out junk files and repair common Windows errorsFree Scan →Scan for outdated or missing drivers - takes under a minuteDriver Scan →Repair Windows errors before they cause bigger problemsFix Now →
